摘 要
科技的進步，對環境的汙染日趨嚴重，於工業界有毒氣體外洩的事件時有所聞；而在日常生活中，每到冬天常有一氧化碳中毒的事件發生，因此氣體感測器的發展倍受重視。氣體感測器除了廣泛運用於工業安全之外，對於災害現場的防治、意外洩漏之氣體感測、環境汙染之維護、現場工作人員之安全保障等，扮演著重要的角色。
目前一般使用的氣體警報器，由於耗電量高，體積大、價錢昂貴、反應時間過長，因此氣體分析儀器大多只應用在工業用途。若是採用半導體薄膜氣體感測元件，將會具有隨時偵測功能，反應時間即時、體積小、成本低廉、方便使用等優點。將來如能將其廣泛運用在日常生活中，則可避免人身曝露在危險的環境。
本論文採用二氧化錫為氣體感測之材料，將氣體感測元件設計成薄膜型式，製作一微型氣體感測元件，並且簡化其電極製程，將所有欲使用之電極設計於此感測元件中，最後再以氫氧化鉀溶液，將感測元件蝕刻成薄膜結構，分別於還原氣體CO及氧化氣體NO2中量測，並且採用奈米壓痕試驗系統量測其結構之薄膜機械性質。

Abstract
With the rapid growth of industrial process and application, it causes a drastic environmental pollution on earth, which can be harmful to our health and inhabitation. Either accident of leakage of toxic emission, or poison gas such as CO and NO2 has been often heard in our daily life. Therefore, the development of gas sensor has drawn a lot of attention for recent years. It can not only be used in industrial application for safe purpose, but also can prevent the leakage of poison gas emission from polluting the environment.
The current gas alarm systems are bulky, expensive, long responding time, and electricity-consuming, which results in them only to be applicable in industry, but not at household. On the contrary, if the gas alarm systems are fabricated using IC/MEMS compatible process, then the above-mentioned shortage can be improved significantly. In addition, when applied in our daily life, it can decrease human danger exposed in harmful situation.
In this study, ZnO2 is utilized as sensing substance of the gas sensor. After designed, fabricated and packaged, a micro-scale gas sensor system is obtained. In addition, the fabrication process of electrical pad is simplified to cost-down this system. Then aqueous KOH solution is applied to thinner the substrate. Finally, experiment is conducted to test the sensibility of the sensor with gases of CO and NO2. Also, the thin film property of the sensor is characterized by using nano indenter system to realize its mechanical properties.

REFERENCES
[1]Riken-Keiki Co., Ltd. Website, http://www.rikenkeiki.co.jp/.
[2]The Bosch Group .Website, http://www.boschautoparts.com/.
[3]フィガロ技研株式會社Website, http://www.figaro.co.jp/.
[4]林鴻明﹐「奈米化學感測材料」﹐化工科技與商情, No.38, pp.18-28﹐
2001.
[5]Freescale Semiconductor Inc., (formerly a Motorola Semiconductor
Company ) Website, http://www.freescale.com/.
[6]P.H. Chou﹐C.C. Lu, T.H. Tsai, G.S. Li, "Carbon Nanotube Gas
Sensors Fabricated by Dielectrophoresist at Room Temperature with
CMOS Integrity," Proceeding of 20th Anniversary of Eurosensors
conference, M3A-P4, pp.146, 2006.
[7]McNerney, J.J., Buseck, P.P. , and Hanson, R.C., ”Mercury Detection
by Means of Thin Gold Flims,” Science , Vol. 178, pp.611-612, 1972.
[8]Chang, S. C., and Hicks, D. B. , ”Tin Oxide Microsensors on Thin
Silicon Membranes.,” Record of the IEEE Solid-State Sensors Workshop, 1986.
[9]Bosc J.M., Odile J.P., ”Micromacgined Structure Reliability Testing
Specificity. The Motorola MGS1100 Gas Sensor Example,“ pp.

1791-1794, 1997.
[10]S. Astie´, A.M. Gue, E. Scheidb, and J.P. Guillemet ,“Design of a low
power SnO2 gas sensor integrated on silicon oxynitride membrane ,“Sensors and Actuators B 67,Vol .67, pp.84-88, 2000.
[11]M. Baroncini, P. Placidi , G.C. Cardinali ,and A.Scorzoni, ”Thermal
characterization of a microheater for micromachined gas sensors”,Sensors and Actuators A 115, pp.8-14,2004.
[12]D. Briand , A. Krauss , B. van der Schoot , U. Weimar , N.
Barsanb,and W. Go¨pel ,”Design and fabrication of high-temperature micro-hotplates for drop-coated gas sensors”, Sensors and Actuators B
68, pp. 223-233, 2000.
[13]H. Hertz, “Über die Berührung fester elastischer Körper,” Journal für
die reine und angewandte Mathematik, Vol. 92, pp. 156-171, 1881.
[14]D. Tabor, “A Simple Theory of Static and Dynamic Hardness,”
Mathematical and Physical Sciences, Vol. 192, pp. 247-274, 1948.
[15]I. N. Sneddon, “The relation between load and penetration in the
axisymmetric boussinesq problem for a punch of arbitrary profile,” Int. J. Eng. Sci., Vol. 3, pp. 47-57, 1965.
[16]M. Doerner and W. D. Nix, “A method for interpreting the data from
depth-sensing indentation instruments,” Journal of Materials Research, Vol.1, pp. 601-609, 1986.
[17]W. C.Oliver and G. M. Pharr, “An improved technique for determining
hardness a nd elastic modulus using load and displacement sensing indentation experiments,” Journal of Materials Research, Vol. 7, pp. 1564-1583, 1992.
[18]O. S. Heavens, “Measurement of the thickness of thin films by
Multiple - beam interferometry,” Proceedings of the Physical Society, Section B, pp. 355-358, 1950.
[19]P. K. Mehrotra and D. T. Qunito, “Techniques for evaluating
mechanical properties of hard coatings,” Journal of Vacuum Science & Technology A: Vacuum, Surfaces and Films, pp. 2401-2405, 1985.
[20]S. J. Bull and E. S. Berasetegui, “An overview of the potential of
quantitative coating adhesion measurement by scratch testing,” Tribology International, pp. 99-114, 2006.
[21]T. W. Wu and J. Frommer, “Micro-indentation and scanning probe
microscopy to assess multilayer magnetic film damage,” Journal of Magnetism and Magnetic Materials, pp. 142-152, 2000.
[22]J. Valli, “A Review of adhesion test method of thin hard coatings,”
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, pp. 3007-3014, 1986.
[23]K. L. Mitt, “Adhesion measurement of thin films,” Electrocomponent
Science and Technology, pp. 21-42, 1976.
[24]N. X. Randall, C. Julia-Schmutz, J. M. Soro, J. V. Stebut and G.
Zacharie, “Novel nanoindentation method for characterizing”, 2006.
[25]陳美杏, 「微型氧氣感測器」, 成功大學碩士論文, 2003.
[26]EM Industries Inc. Website﹐http://www.merck.com.tw/.
[27]張仲卿、侯順雄、張進寬、杜鳳棋,「熱傳遞」 , 高立出版社, 1997.
[28]G. M. Pharr, W. C. Oliver, F. R. Brotzen, “On the generality of the
relationship among contact stiffness, contact area, and elastic modulus during indentation,” J. Mater. Res., Vol. 7, pp. 613-617, 1992.
[29]J. B. Pethica, R. Hutchings, W. C. Oliver, “Hardness Measurement at
Penetration Depths as Small as 20 nm,” Philos. Mag. A, Vol. 48, pp. 593-606, 1983.
[30]G. Davies, “Properties and growth of diamond,” INSPEC, the
Institution of Electrical Engineers, London, 1994.
[31]R. B. King, “Elastic analysis of some punch problems for a layered
medium,” Int. J. Solids Struct., Vol. 23, pp. 1657-1664, 1987.
[32]A.Szczesny, P.´Sniecikowski, J.Szmidt, A.Werbowy, ”Reactive ion
etching of novel materials - GaN and SiC”, Elsevier Science Vacuum 70 , pp. 249-254, 2003.
[33]R.A.Hovver, ”Microelectronic Materials and process, “ pp. 145,
Kluwer, 1986.
[34]P.Serrini, V.Briois, M.C.Horrillo, A.Travers, L.Manes ,”Chemical
composition and crystalline structure of SnO2 thin films used as gas sensor, “ Thin Soild Films 304, pp.113-122, 1997.
[35]Micro resist technology website, http://www.microresist.de/.