在目前薄膜電晶體液晶顯示器(Thin Film Transistor Liquid Crystal Display, TFT-LCD)產業中，產品已趨輕、薄、短小，然而要朝向這目標，背光模組之導光板勢必越來越薄，且能使整個背光模組有效的呈現均勻發光。然而目前中小尺寸導光板的製作需先製作其模仁，模仁製作包含微影與蝕刻製程，目前微影、蝕刻製程參數設定時，往往需要依靠工程師之經驗，經由試誤法與實驗設計且需經過多次測試才能夠找出適合之參數組合，須花費大量時間、人力及成本。故本研究針對導光板模仁之微影製程與蝕刻製程部分提出了最佳化之系統，對多品質特性之導光板模仁，進行微影製程與蝕刻製程參數最佳化研究，其中導光板模仁品質特性分別為微結構之直徑及微結構整體之均勻性與微結構之深度均勻性。

本製程參數最佳化系統，將依田口直交表進行微影與蝕刻製程之微結構成形實驗，以實驗數據計算S/N 比值，利用S/N 比值搭配ANOVA進行搜尋，找出最佳製程參數組合，使各品質特性之S/N 比值都最大化，找出最符合品質規格且製程最為穩定之最佳製程參數組合。

In the current industry of thin film transistor liquid crystal display (Thin Film Transistor Liquid Crystal Display, TFT-LCD), the trends are to make products become lighter, thinner and smaller. To accomplish this goal, the light guide plate of the backlight module has to be thinner and needs to be illuminated uniformly and effectively. However, how to fabricate the mode before producing the medium-sized light guide plates has to be concerned first, and the manufacture of mode comprises the photolithographic and etching processes. In general, the parameter settings of the photolithographic and etching processes still relies on the experiences of engineers, but the method of try-and-error and experimental designs need numerous test in order to find out the proper and reliable parameter settings, which spends a lot of time, manpower and cost. As the consequence,in the research the optimization system for photolithographic and etching processes has been proposed in terms of optimization of parameter settings. Among them, the quality characteristics of light guide mode are: the diameters of micro-structures, the structural uniformity of whole micro-structures and the uniformity of depth in micro-structures.
In our process design, the optimization system of parameter settings is based on the Taguchi orthogonal arrays to proceed the formation experiments of photolithographic and etching processes. The S/N ratio is calculated by experimental data, and followed by conducting ANOVA incorporated with S/N ratio to carry out the optimum combination of process settings. The S/N ratio of each quality characteristic is maximized and eventually, to find out the optimum process settings with the most consistent quality specifications and reliable processes.

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