本研究主要在建構用於化學機械平坦化拋光之拋光墊表面形貌分析，自行研發設計一款雷射共軛焦三維表面形貌掃描儀，並開發對拋光墊形貌分析之專用程式。主要方法為將雷射共軛焦儀架設於龍門線性馬達平台，回授平台X、Y位置訊號，同時以共軛焦法掃描拋光墊之表面得到形貌高度，再轉換為數位化資料，重新建構出拋光墊之3D形貌。其後將掃描所得到之數據，以承載比(Bearing Ratio)之參數建構拋光墊與拋光液之工作分層，包括儲存區(Svk)、傳輸區(Sk)、反應區(Spk)，有助於分析拋光墊之工作壽命、接觸面積以及拋光液儲存能力，本法可加快對新式拋光墊之性能評比，提升拋光墊對半導體晶圓表面精密加工之平坦化效能。拋光墊之表面形貌雖呈現不規則現象，但具有自我相似的特性，本研究嘗試以碎形原理之盒子維數法(Box Method)求得拋光墊之碎形維度(Fractal Dimension)，其結果顯示不同款式拋光墊有其一定範圍之維度值，且會影響藍寶石晶圓拋光之差異性。利用共軛焦掃描儀對拋光墊拋光前、後及修整後做形貌掃描，並以承載比與碎形維度做形貌分析，可提供作為藍寶石晶圓拋光加工參數之設定及拋光墊選擇評估依據。

This study is to develop a pad profile analysis for chemical mechanical polishing (CMP) process. A 3D laser confocal measurernent system with fractal dimension and bearing ratio analysis has been developed in this study to investigate pad topography. Laser confocal measurement probe is installed on a linear motor stage, and also feedbacks the X-Y position and height signal of pad topography at the same time. Then, measurement data can be converted into 3D pad topography. In order to predict the pad life function, polishing contact area of pad asperity and slurry storage ability of pad porosity have calculated and analyzed. The bearing ratio method is defined for the working layer of pad as reservoir region (Svk), transmission region (Sk) and reaction region (Spk). Therefore, pad performance can be effectively predicted without long time experiments. The pad topography has self-similar phenomena which can be predicted by fractal dimension theory. The box method is used to calculate the fractal dimension of pads. Results show that pad has its own dimension which influences the surface profile of sapphire after polishing. Pad topography before polishing, after polishing, and dressed have been measured and calculated. The differences of fractal dimensions and bearing ratio of different pads have been obtained and discussed. Based on such pad profile analysis system, the performance of pad on wafer planarization can be potentially predicted.

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