研究生: |
鄭鼎緯 Ding-Wei Zheng |
---|---|
論文名稱: |
平板彈簧式微定位平台之開發 Development of leaf-spring type micro-positioning stage |
指導教授: |
謝宏麟
Hung-Lin Hsieh |
口試委員: |
林紀穎
Chi-Ying Lin 陳品銓 Pin-Chuan Chen |
學位類別: |
碩士 Master |
系所名稱: |
工程學院 - 機械工程系 Department of Mechanical Engineering |
論文出版年: | 2016 |
畢業學年度: | 104 |
語文別: | 中文 |
論文頁數: | 86 |
中文關鍵詞: | 定位平台 、壓電致動器 、平板彈簧 、奈米 、旋轉式平台 |
外文關鍵詞: | Positioning stage, Piezoelectric auactor, Leaf spring, Nanometer, Rotation stage |
相關次數: | 點閱:289 下載:3 |
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本研究開發一套以平板彈簧結構為設計概念的微定位平台,用以進行精密定位。研究中藉由調整所設計的平板彈簧結構模組間的擺放方式及位置,即可建構出不同定位性能的平板彈簧式微定位平台,使定位平台具備不同維度的定位能力。
平板彈簧式微定位平台在定位過程中,會因平板彈簧結構產生非預期變形而造成微定位平台的位移損失。於研究中,我們建立了平板彈簧結構的模型,藉由田口法來針對平板彈簧結構進行最佳化設計,針對分析結果提出了最適合此平板彈簧式微定位平台的結構參數,可有效降低微定位平台於定位過程中所造成的非預期位移損失。透過靜態分析與Ansys Workbench軟體分析相互比較此板彈簧結構最佳化參數,即可驗證本研究設計之平板彈簧結構其正確性與可行性。而後將此正確的平板彈簧結構參數繪製加工圖,透過線切割加工機加工出實際平板彈簧結構,再藉由光學顯微鏡檢測加工平板彈簧結構之尺寸是否正確,以降低因加工所造成定位誤差。此外,本研究透過設計不同樣式的固定板與活動板,且與平板彈簧結構進行組裝,可分別建立了單維度、二維度與三維度的平板彈簧式微定位平台。
另外,本研究使用精密雷射干涉儀做為定位平台之精密量測系統,搭配PID控制法對定位平台位移進行誤差補償,使得平板彈簧式微定位平台達到更精密的定位性能。為了驗證開發之平板彈簧式微定位平台的定位性能,分別給予定位平台不同大小的波型,驗證出各組定位平台的位移解析度與行程。由實驗結果可得知,此套利用平板彈簧開發的定位平台具有良好的效能,單維度定位平台其位移解析度約為10 nm及位移行程5 μm,另外二維度定位平台與三維度定位平台的位移解析度皆約為10 nm與0.1 μrad,其行程皆具有6.5 μm與250 μrad。而穩態誤差於單維度定位平台約為±20 nm,二維度定位平台分別約為±2 nm與±0.2 μrad,三維度定位平台分別約為±5 nm與±0.2 μrad。
In this study, a micro positioning stage designed using leaf spring structure for displacement measurement is developed. By adjusting the placement and position of the leaf spring of the structure, micro positioning stage for different positioning capability can be constructed, granting the positioning stage different positioning degree-of-freedoms.
The leaf spring structure will cause the loss of displacements during the positioning process of the leaf spring type positioning stage due to unpredictable deformation. By constructing the model of the leaf spring structure during the experiment, using Taguchi method to achieve best design, and finding the most suitable structural parameters for this leaf spring positioning stage, the loss of displacement can be effectively reduced. Also by stationary and Ansys Workbench analyzations, the leaf spring structure’s correctness and feasibility can be verified. The concept and parameters of the leaf spring structure is then processed into design blueprint and manufactured into real structure by WEDM(Wire cut Electrical Discharge Machining), as well as having its parameter verified with microscope to avoid manufacturing error. By designing and combining different platforms and springs, single axis, dual-axes and triple-axes leaf spring type micro positioning stage can be built.
During the study, we use precision laser encoders, combining with PID controls, to perform error compensation for the positioning platforms to achieve better precision. In order to verify the designed leaf spring type positioning stage capability, the positioning stages are experimented with multiple different waveforms, verifying the displacement resolution and maximum distance of each system. From the experimental result, this spring platform structure has excellent measurement capability in all three positioning systems. In single axis, the resolution of the displacement is 10 nm with the maximum distance of 5 μm, while the duel-axes and tri-axes systems’ resolutions of displacements are 10 nm and 0.1 μrad, with the maximum distances of 6.5 μm and 250 μrad. The steady state error is ±20 nm in single axis, ±2 nm and ±0.2 μrad in duel-axes, and ±5 nm and ±0.2 μrad in tri-axes.
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