本文旨在研究電子產品在歷經落摔衝擊後之動態響應及可靠度。本系統係由板件、底座及外櫃封裝而成之系統，文中以矩形平板來代表電子產品中的板元件，以分佈型質量來代表平板上的電子元件。首先假設平板與底座為剛體及外櫃不反彈之情況，建立一個四自由度線性彈簧系統，據此可計算其板件支撐邊之位移及加速度。再者，我們考慮板件實際上為一固定在襯墊的彈性體，本文乃使用Gorman發展出的疊加法來分析振動系統的特徵值問題，再利用應力與應變的關係求解平板的彎曲應力。然後考慮意外落摔高度為隨機變數，即可計筭落摔衝擊的可靠度，文中將分別討論襯墊彈簧常數、分布質量大小及位置參數等對板四周支撐最大位移、最大加速度及板的彎曲應力的影響。

The main purpose of this is to study the dynamic response and the reliability of electronic products experienced a drop impact. The products in question are packaged in a system including a plate element, a chassis and a cabinet. In the analysis the plate element of the products is represented by a rectangular plate, the electronic element on the plate is represented by the distributed type mass. First, a four-degree-of-freedom linear spring system is established by assuming that both the plate and the chassis are rigid, and the cabinet does not rebound. Accordingly the displacements and the accelerations of the support of the chassis and plate can be evaluated. Furthermore we will take into account the fact that the plate element is an elastic body which is fixed into the gasket. The superposition method developed by Gorman is applied to analysis the eigenvalue problem of vibration systems, and the bending stress of elastic plate element is solved using the relation of stress and strain. Then the reliability can be evaluated by considering the dorp height as a random variable. The effects of the spring constants of the cushinings, and the mass and the location of distributed type mass on the maximum displacement, the maximum acceleration of the contour of the plate element, and the induced bending stress respectively, will be examed in this study.

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