銅與銀是目前電子工業中常使用的金屬基材材料，純錫、錫-3.0wt.％銀-0.5wt.%銅、錫-58.0wt.％鉍、錫-9.0wt.％鋅為最具潛力的無鉛銲錫合金。故本研究針對構裝製程中常使用的銅、銀金屬基材，探討基材與無鉛銲錫材料間的溶解行為。另外利用自行製備的介金屬化合物，對其在液態銲錫間發生的界面反應及溶解機制進行探討。此研究成果對無鉛銲接製程之應用與發展提供重要的參考資料。
在反應溫度為300、270與240℃下，銅、銀基材在不同銲錫的溶解速率快慢依序為錫>錫-3.0銀-0.5銅>錫-58鉍>錫-9鋅；基材溶解行為隨著反應時間增加呈現線性的關係，且基材溶解速率與溫度成正比關係。銅、銀基材與純錫、錫-3.0銀-0.5銅、錫-58鉍銲錫反應生成銅-錫和銀-錫系的介金屬化合物，生成的介金屬相彼此間存有溝槽，基材將藉由此溝槽快速的擴散至銲錫內部溶解，溶解模式為晶界擴散(grain boundary diffusion)所主導；且基材溶解速率快慢與反應生成的介金屬層厚度、晶粒尺寸與界面形態相關；基材與銲錫間的濃度梯度差異越大將造成基材的溶解速增快。銅、銀基材與錫-9鋅銲錫反應則生成銅-鋅和銀-鋅系的介金屬化合物，此層狀結構的介金屬相厚度相當厚且沒有溝槽提供基材快速溶解的路徑，故錫-9鋅銲錫能抑制基材的溶解原因為此層狀結構所致。
介金屬相Ag3Sn基材在液態純錫的溶解速率明顯高於在錫-3.0銀-0.5銅銲錫系統，且銲錫內銀元素含量的多寡將會造成Ag3Sn析出相的微結構的差異。關於錫-9鋅銲錫與介金屬相Ag3Sn基材進行液/固反應時，反應初期界面處會生成貝殼狀的AgZn3與層狀的Ag5Zn8介金屬相，此層狀的Ag5Zn8相阻礙銀原子擴散至液態銲錫內部。而當界面處的鋅濃度不足時，Ag3Sn基材中的銀與錫原子反應生成(Ag,Zn)4Sn相在銀-鋅系介金屬層與Ag3Sn基材之間，並造成(Ag,Zn)4Sn相與Sn混錯交錯的形態。

Element Cu and Ag have been widely used for interconnection materials in electronic industries. Sn、Sn-3.0Ag-0.5Cu、Sn-58Bi and Sn-9Zn solders are most common lead-free solders. Dissolution behavior and kinetic of metallic substrates-Cu, Ag and the intermetallic compound (IMC)-Ag3Sn in molten Sn, Sn-3.0Ag-0.5Cu, Sn-58Bi and Sn-9Zn at 300, 270 and 240℃ are investigated in this study.
The dissolution rate of both Cu and Ag in molten solders is Sn>Sn-3.0Ag-0.5Cu>Sn-58Bi>Sn-9Zn. The dissolution rate of metallic substrates increases with increasing temperature, and it exhibit approximately linear increasing with increasing the reaction time. Plane Cu3Sn and scalloped Cu6Sn5 phases in Cu/solders and the scalloped Ag3Sn phase in Ag/Solders can be observed at the metallic substrate/solder interface and the dissolution mechanism is controlled by the grain boundary diffusion except Sn-9Zn/substrate systems. For the Sn-9Zn/Cu system, the plane Cu5Zn8 layer forms at the interface. AgZn3, Ag5Zn8 and AgZn phases are found at the Sn-9Zn/Ag system. The compact layer IMC formed between the substrates and solder cause lower dissolution rate.
The dissolution rate of Ag3Sn in Sn is more higher than that in Sn-3.0Ag-0.5Cu solder. Massive Ag3Sn phases dissolved into solders and forms during solidification processes in the Ag3Sn/Sn or Ag3Sn/Sn-3.0Ag-0.5Cu systems. There are three IMC layers formed between Sn-9Zn solder and Ag3Sn substrate are AgZn3/Ag5Zn8/(Ag,Zn)4Sn. With increasing reaction time, the growth of (Ag,Zn)4Sn increases and it moves forward and very close to Ag3Sn substrate. The mixture micro-structures of (Ag,Zn)4Sn and Sn are formed between Ag-Zn layers and Ag3Sn substrate.

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