錫與金-銅合金之界面反應｜國立臺灣科技大學博碩士論文系統

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研究生：	葉家宜 Chia-Yi Yeh
論文名稱：	錫與金-銅合金之界面反應 Interfacial Reactions between Sn and Au-xCu Alloys
指導教授：	顏怡文 Yee-Wen Yen
口試委員:	施劭儒 Shao-Ju Shih 陳志銘 Chih-Ming Chen 鄭明正 Cheng-Ming Cheng
學位類別：	碩士 Master
系所名稱：	工程學院 - 材料科學與工程系 Department of Materials Science and Engineering
論文出版年：	2017
畢業學年度：	105
語文別：	中文
論文頁數：	65
中文關鍵詞：	界面反應、金銅合金
外文關鍵詞：	Interfacial Reactions, Au-Cu Alloys
相關次數：	點閱：279 下載：0
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在覆晶封裝中，凸塊底層金屬(UBM)扮演著重要的角色，Cu在UBM中常作為潤濕層，Au為常見的抗氧化層。本研究將使用純Sn銲料，與Au-xCu合金基材(x=15, 40, 60, 80 wt.%)製備成反應偶，並於反應溫度於150、180、及200oC下，分別進行反應時間為5、10、20、40、60、100、200、400以及600小時之固/固界面反應，並探討界面反應後介金屬的種類、反應機制、動力學、成長速率常數與反應之活化能。根據實驗結果顯示，在Sn/Au-15Cu的反應中，會形成：(Au,Cu)Sn4、(Au,Cu)Sn、(Cu,Au)6Sn5以及B相，當Au-xCu基材中Cu的添加量增加至40 wt.%以及60 wt.%時，介金屬相的生成依序為：(Au,Cu)Sn、(Cu,Au)6Sn5和B相以及(Cu,Au)6Sn5、(Cu,Au)3Sn與B相，隨著合金基材中Cu比例的添加至80 wt.%時，所形成之介金屬相則以(Cu,Au)6Sn5、(Cu,Au)3Sn與B相為主。因此，由實驗結果可知當反應時間以及溫度的增加，原生成的(Au,Cu)Sn4 相與(Au,Cu)Sn漸漸消失，逐漸被(Cu,Au)6Sn5與(Cu,Au)3Sn相取代，也就是說，介金屬將從Au-Sn相系統轉變為Cu-Sn相的系統。此外，在Sn/Au-xCu反應系統之介金屬相厚度與反應時間之平方根呈線性關係，故反應機制皆為擴散控制所主導。

Under bump metallurgy (UBM) plays an important role in the flip chip package, Cu is widely used as a wetting layer and Au usually acts as an anti-oxidation layer in UBM. The solid/solid interfacial reactions of Sn/Au-xCu at 150, 180 and 200oC for 5, 10, 20, 40, 60, 100, 200, 400 and 600 h were investigated in this study. According to experimental results, the (Au,Cu)Sn4, (Au,Cu)Sn, (Cu,Au)6Sn5 and B phase, were formed at the interface in Sn/Au-15Cu system, in Sn/Au-40Cu and Sn/Au-60Cu reaction systems (Au,Cu)Sn, (Cu,Au)6Sn5, B phase and (Cu,Au)6Sn5, (Cu,Au)3Sn, B phase were formed when the concentrated of Cu increase to 80 wt.% , the main intermetallic compounds in Sn/Au-80Cu system was (Cu,Au)6Sn5, (Cu,Au)3Sn and B phase. From the results the intermetallic compounds (Au,Cu)Sn4 and (Au,Cu)Sn were found to disappear gradually when increasing reaction time and temperature. They turned into (Cu,Au)6Sn5 and (Cu,Au)3Sn, which suggests An-Sn phase system would turns into the Cu-Sn phase system. In addition, the thickness of intermetallic compounds increased with increasing reaction times and temperatures, and was proportional to the square root of reaction time.

摘要......................................................................................................................I
Abstract.............................................................................................................. II
誌謝.................................................................................................................. III
目錄...................................................................................................................IV
圖目錄..............................................................................................................VII
表目錄...............................................................................................................IX
第一章、前言.....................................................................................................1
第二章、文獻回顧.............................................................................................3
2-1 電子構裝概述......................................................................................3
2-1.1 電子構裝技術............................................................................3
2-1.2 覆晶封裝技術............................................................................7
2-2 無鉛銲料.............................................................................................10
2-2.1錫...............................................................................................12
2-2.2 錫-銅.........................................................................................13
2-2.3 錫-金.........................................................................................14
2-2.3 金-銅.........................................................................................15
2-3 界面反應與擴散動力學.....................................................................16
2-3.1 界面反應..................................................................................16
2-3.2 擴散理論..................................................................................19
2-4 Sn/Au-Cu界面反應相關文獻討論....................................................21
2-4.1 Sn/Cu界面反應........................................................................21
2-4.2 Sn/Au-Cu界面反應..................................................................24
第三章、實驗方法...........................................................................................29
3-1 Sn銲料與Au-Cu合金的製備...........................................................29
3-2 Sn/Au-xCu反應偶製備......................................................................29
3-3金相處理..............................................................................................30
3-4 界面觀察與分析.................................................................................30
第四章、結果與討論.......................................................................................33
4-1 Sn/Au-xCu (x=15wt.%)反應偶...........................................................33
4-2 Sn/Au-xCu (x=40wt.%)反應偶...........................................................36
4-3 Sn/Au-xCu (x=60wt.%)反應偶...........................................................38
4-4 Sn/Au-xCu (x=80wt.%)反應偶...........................................................40
4-5添加Cu對Sn/Au-xCu界面反應之影響..........................................42
4-6 Sn/Au-xCu反應偶之界面反應動力學..............................................45
4-7 Sn/Au-xCu反應偶在200℃之反應路徑...........................................57
第五章、結論...................................................................................................61
第六章、參考文獻...........................................................................................63

                                

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全文公開日期 2022/07/19 (校內網路)
全文公開日期 2024/07/19 (校外網路)
全文公開日期本全文未授權公開 (國家圖書館：臺灣博碩士論文系統)

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