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研究生: 趙培勛
Pei-hsiun Chao
論文名稱: 導輪磨耗於線鋸切削影響研究
Study on Wear Effect of Wire Guide Roller for Wire Sawing Process
指導教授: 陳炤彰
Chao-chang Chen
口試委員: 鍾俊輝
Chun-hui Chung
趙崇禮
none
左培倫
none
林紀穎
none
學位類別: 碩士
Master
系所名稱: 工程學院 - 機械工程系
Department of Mechanical Engineering
論文出版年: 2011
畢業學年度: 99
語文別: 中文
論文頁數: 192
中文關鍵詞: 複線式線鋸切削太陽能電池矽基板導輪磨耗
外文關鍵詞: Multi wire sawing process, Silicon substrates
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近年來,隨著地球能源日漸枯竭,可不斷使用再生能源越來越受到重視,其中,太陽能為最受到重視之再生能源之一,於目前所有太陽能電池種類中,矽晶基板太陽能電池所使用之單、多晶矽基板主要運用複線式線鋸切削製程(Multi-wire sawing process)鋸切而成。本研究主要目的為探討線鋸切削製程所使用之導輪(Wire guide roller)溝槽磨耗變化,並以本研究自行製作之導輪磨耗測試機模擬測試比較不同條件之磨耗機制,以進一步增加不同製程參數影響,作為不同製程其導輪壽命評估之參考。本研究設定兩種切削參數(S1、S2)實際進行多晶矽碇之鋸切,量測其溝槽尺寸於不同使用時數下之變化後,以製程模型分析其受力以及各種因子對於其磨耗之影響。由實驗結果可知,導輪於長時間之使用過程中,會因鋼線偏擺以及鋼線運動慣性而對導輪溝槽產生一衝擊,進而使導輪產生磨耗。透過導輪受力以及磨耗模型可明顯得知導輪之外徑(ψroller)、線速度、溝槽間距、張力以及導輪軸距為影響導輪磨耗之因子,其中,以導輪外徑之影響最為顯著。本研究使用之線上導輪溝槽取樣分析手法以及所建立之導輪磨耗模型,未來可運用於不同線鋸製程下之導輪磨耗分析,作為評估導輪使用壽命之參考。


Recent year, multi-wire sawing process has been widely used for fabrication of silicon substrates for solar cell. This research is to investigate and evaluate the wear of wire guide roller (WGR) of wire sawing process. Polyurethane is often used for the material of WGR. Two sawing parameters of free abrasive sawing processes have been chosen to cut the multi-crystalline silicon ingots. The geometric deviation of grooves on wire guide roller has been measured to evaluate the wearing type in different processing time. The mechanical model has also developed to analyze the wear of grooves on wire guide roller. Result of experiment shows that wear of grooves on the wire guide roller significantly affects by the saw wire deflection and impact by wire inertia. The diameter of roller, wire speed, pitch of grooves, tension force and the length between rollers have been found as main factors of wear of wire guide roller. A wear test machine for free and fixed wire sawing has been designed and used to evaluate the wear of the polyurethane material for wire guide roller in different type of fixed and free abrasive wire sawing processes. Results of this study can conclude that the developed method of analysis model of wire guide roller wear can be used to evaluate the wear of grooves on the wire guide roller in the wire sawing process for further life time estimation of wire guide roller.

摘要……………………………………………………………………… I Abstract …………………………………………………………………II 圖目錄 ……………………………………………………………………IX 表錄 ……………………………………………………………………XVIII 符號表………………………………………………………………………XX 第一章 緒論 ……………………………………………………………1 1.1 研究背景 …………………………………………………………… 1 1.2 研究動機與目的 …………………………………………………… 6 1.3 研究方法 …………………………………………………………… 9 1.4 論文架構 ……………………………………………………………11 第二章 文獻回顧 …………………………………………………… 13 2.1 硬脆材料破壞模式研究…………………………………………… 13 2.2 複線式線鋸切削技術文獻回顧 ……………………………………18 2.3 PU材料磨耗與破壞機制文獻回顧 …………………………………27 2.4 線鋸切削製程相關專利分析 ………………………………………31 2.5 文獻回顧總結 ………………………………………………………34 第三章 製程分析與線鋸導輪磨耗機制 …………………………… 47 3.1 複線式線鋸製程分析 ………………………………………………47 3.2 磨耗機制介紹 ………………………………………………………51 3.3 導輪幾何形狀推導 …………………………………………………55 3.4 導輪受力模型 ………………………………………………………59 3.4.1 鋼線作用力 ………………………………………………………59 3.4.2 導輪溝槽軸向受力 ………………………………………………61 3.4.3 導輪溝槽側向受力……………………………………………… 63 3.4.4 導輪溝槽因鋼線慣性所承受之衝擊 ……………………………66 3.5 導輪磨耗量估算 ……………………………………………………67 3.5.1 切削損失 …………………………………………………………67 3.5.2 導輪磨耗面積 ……………………………………………………69 3.5.3.1 磨料披覆量 ……………………………………………………69 3.5.3.2 磨料工作粒徑與有效加工磨料數 ……………………………70 3.5.3.3 游離磨料PU導輪材料移除 ……………………………………71 3.5.4 固定磨料製程導輪磨耗 …………………………………………73 3.6 導輪材料磨耗率估算 ………………………………………………76 3.7 製程分析與理論介紹總結 …………………………………………77 第四章 實驗規劃與方法 ……………………………………………… 78 4.1 實驗規劃 ……………………………………………………………78 4.2 材料特性介紹 ………………………………………………………81 4.2.1 磨料(碳化矽) ……………………………………………………81 4.2.2 載液……………………………………………………………… 83 4.2.3 切割鋼線 …………………………………………………………86 4.2.4 鑽石線 ……………………………………………………………89 4.2.5 冷卻液 ……………………………………………………………92 4.2.6 導輪聚胺脂(PU)材料 ……………………………………………93 4.3 實驗設備 ……………………………………………………………95 4.3.1 複線式線鋸切削機 ………………………………………………95 4.3.2 磨耗試驗機 ………………………………………………………97 4.4 量測設備 ……………………………………………………………98 4.4.1 掃描式電子顯微鏡 ………………………………………………98 4.4.2 光學顯微鏡 ………………………………………………………99 4.4.3 雷射粒徑分析儀 …………………………………………………99 4.4.4 轉子型黏度計 …………………………………………… ……100 4.4.5 精密天平 ……………………………………………………… 101 4.4.6 微小維克氏硬度計 …………………………………………… 102 4.5 PU材料壓痕實驗 ………………………………………………… 103 4.6 導輪溝槽幾何形狀量測 ………………………………………… 103 4.7 導輪PU材料磨耗實驗 …………………………………………… 109 4.8 實驗規劃與方法總結 …………………………………………… 112 第五章 實驗結果與討論 ………………………………………………114 5.1 導輪溝槽幾何形狀磨耗 ………………………………………… 114 5.1.1 導輪溝槽翻印尺寸驗證 ……………………………………… 114 5.1.2 溝槽深度(d)變化量 ……………………………………………115 5.1.3 鋼線偏擺與慣性衝擊所造成之導輪側向磨耗 ……………… 116 5.1.4 不同導輪外徑尺寸之導輪角度偏擺變化量 ………………… 123 5.1.5 導輪溝槽間距(PR)變化量 …………………………………… 129 5.1.6 線鋸切削機導輪材料磨耗率計算 …………………………… 130 5.2 導輪PU材料壓痕實驗結果 ……………………………………… 133 5.3 導輪PU材料磨耗實驗結果 ……………………………………… 134 5.3.1 游離磨料磨耗實驗(FWS)結果 …………………………………135 5.3.2 固定磨料磨耗實驗(DWS)結果………………………………… 137 5.3.3 游離磨料與固定磨料磨耗實驗結果比較 …………………… 138 5.3.4 磨耗試驗磨耗移除量估算 …………………………………… 143 5.3.4.1 磨耗實驗材料移除率 ……………………………………… 143 5.3.4.2 磨耗實驗材料移除率估算 ………………………………… 144 5.4 導輪受力估算 …………………………………………………… 149 5.4.1 導輪軸向與側向受力估算 …………………………………… 149 5.5 實驗結果與討論總結 …………………………………………… 150 第六章 結論與建議 ……………………………………………………152 6.1 結論 ……………………………………………………………… 152 6.2 建議 ……………………………………………………………… 154 附錄A 線鋸機台規格 ………………………………………………… 162 附錄B 微小維克氏壓痕破壞量測值 ………………………………… 164 附錄C 漿料粒徑量測 ………………………………………………… 165 附錄D 導輪翻印尺寸驗證 …………………………………………… 166 附錄E 磨耗實驗結果 ………………………………………………… 168 附錄F 有效加工磨料數計算 ………………….………………………169 作者簡介 ……………………………………………………………… 170

[1]康志堅,「太陽光電產業發展現況與未來」,工研院產業經濟與趨勢研究中心,民國九十八年。
[2]林明獻, 「太陽電池技術入門」,全華圖書,2007年。
[3]MEYER BURGER DS-264操作手冊。
[4]C.P.Chen, M.H.Leipold, “Fracture Toughness of Silicon,” American Ceramic Society, Vol. 59, pp.469-472, 1980.
[5]P.Chantikul, G.R.Antis, B.R.Lawn, D.B.Marshall, “A Critical Evaluation of Indentation Techniques for Measuring Fracture Toughness: II, Strength Method,” Journal of the American Ceramic Society, Vol. 64, No.9, pp. 539-543, 1981.
[6]D.B. Marshall, B.R. Lawn, A.G. Evans, “Elastic/Plastic Indentation Damage in Ceramics: The Lateral Crack System,” Journal of the American Ceramic Society, Vol. 65, NO.11, pp. 561-566, 1982.
[7]M. Buijs, K. Korpel, “Three-body Abrasion of Brittle Materials as Studied Bu Lapping,” Wear, Vol.166, pp. 237-245, 1993.
[8]M.A.Verspui, M.Buijs, “Bed Thickness and Particle Size Distribution in Three body Abrasion,” Wear, Vol.188, pp. 102-107, 1995.
[9]S.Malkin, T.W. Hwang, “Grinding mechanisms for ceramics”, Annals of the ClRP, Vol. 45, pp.569-580, 1996.
[10]B.Bhushen, “Micromechanical and Tri-biological Characterization of Doped Single-crystal Silicon and Poly-silicon Films for Micro-electromechanical Systems Devices,” Journal of Materials Science, Vol. 12, pp. 54-63, 1997.
[11]陳啟宗,”機械性質與加工條件對硬脆材料刻劃加工之影響”,國立成功大學機械工程研究所碩士論文,2004年。
[12]S.D.Aylin, G.Mustafa, “Micro-hardness and Fracture Toughness of Dental Materials by Indentation Method,” Wiley Inter Science, pp. 257-264, 2005.
[13]M.Fujisawa, T.Okua, N.Arakawaa, M.Watanabea and K.Nakayama“Precision sawing with wire saw,” Annals of the CIRP, Vol.32, No.1, pp.87-90, 1983.
[14]T.Enomoto, Y.Shimazakil, Y.Tani, M.Suzuki, Y.Kanda “Development of a Resinoid Diamond Wire Containing Metal Powder for Slicing a Silicon Ingot,” Annals of the CIRP, Vol.48, No.1, pp.273-276, 1999.
[15]F.Yang, I.Kao, “Free Abrasive Machining in Slicing Brittle Materials with Wire Saw ”, Transaction of the ASME, Vol.123, pp. 254-259, 2001.
[16]鄭嘉豪,“鑽石線鋸切割硬脆材料暨加工參數之研究”,國立清華大學動力機械工程研究所碩士論文,2002年。
[17]廖運炫、許春耀,”脆性材料線鋸切割”,機械工業雜誌,pp.122-129,2002年5月。
[18]S. Nishijima, Y. Izumi, “Recycling of abrasive from wasted slurry by superconducting magnetic separation”, IEEE transactions on applied superconductivity, Vol.13, pp.1596-1599, 2003.
[19]W.I. Clark, A.J. Shih, C.W. Hardin, R.L. Lemaster, S.B. McSpadden, “Fixed Abrasive Diamond Wire Machining-Part I: Process Monitoring and Wire Tension Force,”International Journal of Machine Tools & Manufacture, Vol.43, pp. 523–532, 2003.
[20]W.I. Clark, A.J. Shih, C.W. Hardin, R. L. Lemaster, S. B. McSpadden, “Fixed Abrasive Diamond Wire Machining-Part II: Experiment design and results,”International Journal of Machine Tools & Manufacture, Vol.43, pp. 533–542, 2003.
[21]陳健民,「鑽石線鋸切割碳化矽與氧化鋁陶瓷材料之特性研究」,國立清華大學動力機械工程研究所碩士論文,2003年。
[22]顏柏輝,「微細鑽石線鋸鋸切特性與磨耗之研究」,國立清華大學動力機械工程研究所碩士論文,2004年。
[23]沈岳文,「游離再生磨粒線切割加工對矽晶圓品質特性之影響」,國立雲林科技大學機械工程研究所碩士論文,2004年。
[24]H.J.Möller, “Basic Mechanisms and Models of Multi-wire Sawing”, Advanced Engineering Materials, No. 7, pp. 501-513, 2004.
[25]J.Sugawara, H.Hara, A.Mizoguchi,“Development of FixedAbrasive Grain Wire Saw with Less Cutting Loss”, SEI Technical review, No. 58,pp.7-11,2004.
[26]左培倫,鄭嘉葳,”晶圓切割技術-固定磨粒鑽石線鋸切割研究”,機械工業雜誌, pp.37-41,2005年。
[27]宋健民,“台灣鑽石技術之大躍進”,機械工業雜誌275期, pp.43-51, 2006年。
[28]陳勇廷,「先進鑽石樹脂線鋸鋸切特性與磨耗之研究」,國立清華大學動力機械工程研究所碩士論文,2006年。
[29]D.Kray, M.Schumann, “Solar Wafer Slicing with Loose and Fixed grains”, IEEE, pp. 948-951, 2006.
[30]K.I.Ishikawa, H.Suwabe, S.I.Itoh, “Study on slurry actions in slicing groove and slicing characteristics at multi-wire saw”, Conference of Taiwan Society for Abrasive Technology, 2006.
[31]G.Du, L.Zhou, “Hard Inclusion and Their Detrimental Effects on The Wire Sawing Process of Multi-crystalline Silicon,” Solar Energy Materials & Solar Cells, Vol. 91, pp. 1743-1748, 2007.
[32]Z.H.Cheng, C.K.Xu, “The vibration and control of multi-wire saw”, IEEE, pp.735-738, 2007.
[33]梁峻碩,「線鋸切割太陽能基板之研究」,國立台灣科技大學機械工程研究所碩士論文,2007年。
[34]郭柄麟,「漿料特性分析於矽晶片線鋸切割影響研究」,國立台灣科技大學機械工程研究所碩士論文,2008年。
[35]W.Peng, F. Liu, C.Yao, “Research on the Ultraviolet-Curing Resin Wire Saw,”International Conference on Automation and Logistics, 2008.
[36]C.C.A.Chen, B.L.Kuo, J.S.Liang,“Chip Size Estimation for Effective Blending Ratio of Slurries in Wire Sawing of Silicon Wafers for Solar Cells,” Advanced Materials Research, Vols.76-78, pp.422-427, 2009.
[37]Z.M.Jin, D.Dowson, J.Fisher,“Wear and Friction of Medical Grade Polyurethane Sliding on Smooth Metal Counter-faces,” Wear, Vols.162-164, pp.627-630, 1993.
[38]N.Viswanath, D.G.Bellow, “Development of an equation for the wear of polymers,” Wear, Vols. 181-183, pp.42-49, 1995.
[39]D.J.T.Hill, M.I.Killeen, J.H.O’Donnell, P. J. Pomery, D. St. John, A. K. Whittaker, “Laboratory wear testing of polyurethane elastomers,” Wear, Vols. 208, pp.155-160,1997.
[40]K.G.Budinski, “Resistance to particle abrasion of selected plastics,” Wear, Vols.203-204, pp.302-309, 1997.
[41]裘亞萍,「放線滑輪雙R槽形的研究與設計」,電力建設月刊,2000年11期
[42]Y.Y.Lim, M.M.Chaudhri, “Indentation of elastic solids with a rigid Vickers pyramidal indenter,” Mechanics of Materials, Vols. 38, pp.1213-1228, 2006.
[43]R.Elleuch, K.Elleuch, B.Salah, H.Zahouani, “Tribological behavior of thermoplastic polyurethane elastomers,” Materials and Design, Vols.28, pp.824-830, 2006.
[44]X.Jiaa, R.Ling, “Two body free abrasive wear of polyethylene, nylon1010, expoxy and polyurethane coatings,” Tribology International, Vols. 40, pp.1276–1283, 2007.
[45]B. Poon, D. Rittel, G. Ravichandran, “An analysis of nanoindentation in linearly elastic solids,” International Journal of Solids and Structures, Vols. 45, pp.6018-6033, 2008.
[46]H. J. Song, Z. Z. Zhang, X. H. Men, “The tribological behaviors of the polyurethane coating filled with nano-SiO2 under different lubrication conditions” Composites, Part A, Vols. 39 , pp.188-194, 2008.
[47]H. J. Song, Z. Z. Zhang, X. H. Men, “Tribological behavior of polyurethane-based composite coating reinforced with TiO2 nanotubes” European Polymer Journal, Vols. 44, pp.1012-1022, 2008.
[48]M. A. Costantini, J. A. Talbott, “Method and apparatus for improved wire saw slurry”, United States Patent, Number: 6,113,473, 2000.
[49]I. Ueoka, J. Sugawara, A. Mizoguchi, H. Oshita, M. Yamanaka, H. Ogawa, N. Urakawa, H. Yoshinaga, “ Wire saw and its manufacturing method”, United States Patent, Number: 6,070,570, 2000.
[50]Y. Shimazaki, T. Enomoto, Y. Tani, “Abrasive wire for a wire saw and a method of manufacturing the abrasive wire”, United States Patent, Number: US 2002/0100469 A1, 2002.
[51]C. Hauser, “Wire saw with means for producing a relative reciprocating motion between the workpiece to be sawn and the wire”, United States Patent, Number: 6,886,550 B2, 2005.
[52]K. Kajimoto, “Slurry recycling method”, United States Patent, Number: 6,929,537 B2, 2005.
[53]T. Kawasaki, H. Tsuruta, “Multi-wire saw”, United States Patent, Number: US 2006/0249134 A1, 2006.
[54]C. Zavattari, G. Fragiacomo, “Method for treating exhausted glycol-based slurry”, United States Patent, Number: 7,223,344 B2, 2007.
[55]T. Kawasaki, H. Tsuruta, “Multi-wire saw”, United States Patent, Number: 7,306,508 B2, 2007.
[56]T. Kawasaki, H. Tsuruta, “Multi-wire saw and method for cutting ingot”, United States Patent, Number: US 2010/0163009 A1, 2010.
[57]C. C. A. Chen, Handout of Manufacturing Analysis, Department of Mechanical Engineering, NTUST, 2010.
[58]莊東漢,「材料破損分析」,五南出版社,2007年。
[59]Oleg Tchernyshyov, Handout of classical physics, JHU, 2005.
[60]Jeanna M. Marraffa, Michael G. Holland, Christine M. Stork, Christopher D. Hoy, Michael J. Hodgman,“Diethylene glycol: widely used solvent present serious poisoning potential,” The Journal of Emergency Medicine, Vol. 35, No. 4, pp. 401–406, 2008
[61]陳信良, 「聚胺脂/奈米碳管奈米複合材料合成與物性之研究」,國立雲林科技大學化學工程研究所碩士論文,2005年。

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