研究生: |
李怡萱 Yi-Shiuan Li |
---|---|
論文名稱: |
微細發泡射出成形於拋光墊製造及化學機械平坦化應用研究 Microcellular Injection Molding Process of Polishing Pad and Application in Chemical Mechanical Planarization Process |
指導教授: |
陳炤彰
Chao-Chang Chen |
口試委員: |
劉士榮
Shih-Jung Liu 趙崇禮 Choung-Lii Chao 黃世欣 Shih-Hsin Huang 鄭逸琳 Yih-Lin Cheng 陳炤彰 Chao-Chang Chen |
學位類別: |
碩士 Master |
系所名稱: |
工程學院 - 機械工程系 Department of Mechanical Engineering |
論文出版年: | 2018 |
畢業學年度: | 106 |
語文別: | 中文 |
論文頁數: | 140 |
中文關鍵詞: | 超臨界微細發泡射出成形 、化學機械平坦化 、拋光墊 、孔隙率 |
外文關鍵詞: | Microcellular Injection Molding, Chemical Mechanical Planarization, Polishing Pad, Porosity |
相關次數: | 點閱:308 下載:23 |
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本研究主要為結合超臨界微細發泡射出成形技術(Microcellular Injection Molding, MIM)與化學機械平坦化製程(Chemical Mechanical Planarization, CMP),由於微細發泡射出成形技術具有製程時間短、工件微結構形貌易透過加工參數調控等優點,本研究希望將此技術應用於CMP耗材之拋光墊製造。本研究分為三部分:首先探討微細發泡射出成形製程中加工參數與材料對於射出成品之結構影響,本研究以材料種類與氣體填充劑量(SCF dosage)作為控制變因,透過Moldex3D模流軟體對二種TPU材料以及四種氣體填充劑量共計八種不同參數進行製程模擬,最後選用二種TPU材料以及二種氮氣填充劑量製作出四款不同微孔洞結構之拋光墊樣品,分別具有孔洞尺寸62.9、72.8、86.4、99.1μm。第二部分則對拋光墊樣品進行結構觀察與機械性質量測,量測項目包含拋光墊常用標準:壓縮性、壓縮回彈率、硬度、楊氏係數、蒲松比、承載比,並將各拋光墊之量測結果繪製成靜態特性雷達圖,此雷達圖可清楚表示各拋光墊之性質並判別該款拋光墊適合應用之製程種類及適用之加工參數。最後,將四款拋光墊應用於玻璃之化學機械平坦化製程,同時採用商用IC1000拋光墊作為對照。以複合材料中基材/添加材之分配與分散性概念應用於拋光墊基材/孔隙的計算,以拋光墊表面孔洞數量計算孔隙率以及孔洞尺寸分布,發現孔洞尺寸呈常態分佈, MRR則與孔隙率成正比。雷達圖各項機械性質與MRR之相關性:呈高度正相關者包含硬度0.99、楊氏係數0.97、蒲松比0.88以及Spk為0.95。
This study aims to develop a microcellular injection molding (MIM) process of molded pads for chemical mechanical planarization (CMP). Due to its advantages of short process time and adjustable microstructure, this study applies MIM for manufacturing CMP consumables, polishing pads. This study is divided into three parts: the first is the influence of processing parameters and different materials on the structure of the finished microcellular injection molded product is discussed. The material type and supercritical fluid (SCF) dosage have been set as control variables. Moldex3D has been used to simulate two types of TPU and four different SCF dosage. Then, two types of TPU material and two SCF dosage levels have been used to manufacture four types of polishing pad samples with pore sizes 62.9, 72.8, 86.4, and 99.1 μm, respectively. In the second part, polishing pad samples have performed structural observation and mechanical properties measurement, including compressibility, compression recovery rate, hardness, Young's modulus, Poisson’s ratio and bearing area ratio. Experimental results can be drawn into a static property radar chart, which clearly indicates the properties of each polishing pad, and thereby identify the suitable process for the polishing pad and the applicable processing parameters. Finally, the MIM polishing pads have been applied to glass polishing, where a commercial IC1000 polishing pad is used as a reference. The MRR of IC1000 pad is 210.89 nm/min, and 135.88, 127.38, 106.15, 93.4 nm/min for the developed MIM pads. Results of correlation analysis show that hardness, Young's modulus, Poisson’s ratio and bearing area ratio (Spk) are highly correlated with MRR. Concept of dispersion and distribution that are usually used in composite materials have been applied to describe the pore structure distribution in polishing.
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