在半導體製程中，先進封裝(Advanced Package, AP)被視為持續摩爾定律的辦法之一，使用不同功能之晶片將其進行堆疊，並使用先進封裝可以得到較小的元件尺寸，本文將研究探討數位微影曝光系統應用於先進封裝製程中。本文中提到之數位微影曝光系統並不拘限於先進封裝中，可將此系統同樣應用於PCB製程、TFT-LCD製程中等等。相較於傳統光罩曝光系統，此系統將使用數位微反射鏡陣列(Digital Micromirror Device, DMD)取代傳統的玻璃光罩，因DMD具有可重複利用以及可快速變換曝光圖片之特性，相較於傳統玻璃光罩之昂貴製造成本以及不具變動圖案之能力，使用DMD進行曝光能夠有效的降低成本以及增加曝光自由度以實時進行補償。本論文將由數位微影曝光系統之光學引擎開始研究，探討其中之光學系統到分析陣列型態之光學引擎可能造成的縫合誤差(Stitching Error)並提出解決辦法，以及設計分析光學引擎與曝光平台之配合並計算出其曝光效率。接著，將探討使用本文中提到之光學系統所產生之曝光光點對光學潛像(Aerial Image)之影響，並針對先進封裝可能產生之翹曲(Warpage)進行分析，建立其數學模型。最後分析本文中提到之光學系統在曝光前可能造成之誤差預估其可能產生之誤差，並根據其光學系統所產生之曝光光點搭配本文中所提到的曝光規劃，以模擬曝光之方式曝出最小線寬為：1 um的扇出封裝(Fan-out Package)圖案並分析其曝光結果。本文以數位微影曝光系統為主軸，研究並整合整個系統，分析可能產生之誤差，並且以本文之架構模擬定義精密圖案於光阻上。

In the semiconductor process, advanced package(AP) seems to be one of the solution of Moore’s Law. Advanced package assembles multi-functions chip in order to get a smaller critical dimension. The lithography system mentioned in this thesis is not only used in advanced package process but also use in the printed circuit board(PCB) and thin film transistor liquid crystal display(TFT-LCD) process. Compare to the traditional mask-based lithography system, this system which mentioned in the thesis using digital micromirror device(DMD) to replace the traditional glass made mask. Because DMD has the ability to reusing and changing the pattern rapidly. Compare with the traditional glass made mask using DMD to replace the mask take lots of advantage including reduce the cost and compensate the exposure error in real-time. In this thesis, start the research with digital lithography system’s optical engine. Research the array based optical engine and give a solution to array caused stitching error. And analysis the exposure optical engine’s relation with the moving stage, calculate the exposure efficiency. After that simulate the optical setup which mentioned before, using the simulation result to analysis the effect to aerial image. And analysis the warpage which is the big issue to advanced package, building the mathematic model. After all, simulate the distortion caused by the objective lens and using the exposure arrangement to simulation the exposure result. Conclude with exposure L/S 1 um’s fan-out pattern and analysis of the exposure result.

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