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研究生: 麥惟誠
Mai
論文名稱: 精密散射式多感測器三角雷射探頭之電路設計與量測精度改良研究
Research on the Improvement on the Circuit Design and Measurement Accuracy of a Precision Scattered Triangulation Laser Probe with Multi-detectors
指導教授: 修芳仲
Fang-Jung Shiou
口試委員: 郭重顯
Chung-Hsien Kuo
鄧昭瑞
Geo-Ry Tang
陳亮光
Liang-kuang Chen
學位類別: 碩士
Master
系所名稱: 工程學院 - 機械工程系
Department of Mechanical Engineering
論文出版年: 2020
畢業學年度: 108
語文別: 中文
論文頁數: 146
中文關鍵詞: 散射式三角雷射探頭線電荷耦合元件非接觸式量測系統三次元座標量測儀量測模組
外文關鍵詞: scattered type triangulation laser probe, charge coupled device, non-contact precision measurement system, Coordinate Measuring Machine, measurement modules
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  • 本研究以前期精密散射式多感測器三角雷射探頭研究為架構,開發一改良型多感測器三角雷射探頭。在光路設計上,以Scheimpflug原理為基礎,使投射至感測器表面之雷射光斑恆聚焦成像;硬體架構以單一雷射光源搭配六個線電荷耦合元件(Linear CCD)感測器並做環型設置;本研究主要進行電路設計改良,將原本在免焊萬用電路板的電路PCB化,使整體量測系統體積減少,訊號穩定度提升;在驅動Linear CCD方面,利用微控制器Arduino Mega2560生成所需之訊號,減少驅動成本;在CCD方面,將舊型1503-DG更換為精度更好之1705-D,可以大幅度的改善量測精度與點資料的擷取。
    本研究開發之雷射探頭其量測範圍為±2 mm,解析度為0.9 μm,工作距離約為10mm,軟體搭配LabVIEW程式做量測程式撰寫,結合三軸運動平台與雷射探頭,建構自動化量測系統。在提出的量測模組中,針對不同材質進行量測模組比較,根據實驗結果應用在量測實例工件上,量測模組以五個CCD取平均值法、五個CCD取中值法、六個CCD取平均值法為較佳量測方式。在量測誤差比對方面,以三次元座標量測儀(C.M.M.)之量測結果作為比對基準,量測工件有代木材質之階高工件、圓柱面工件、斜面工件、白色紙板水平面與木材之半木圓球,並探討以表現較佳模組量測方式之量測結果。


    This study aims to develop an improved triangulation laser probe based on the previous study of the precision-scattering multi-sensor triangulation laser probe. The optical path design was based on the Scheimpflug principle, so that the laser spot projected onto the surface of the sensor was constantly focused and imaged. The hardware structure of the developed probe consisted of a micro-focus laser, six Linear CCD sensors with ring-shaped arrangement. The circuit design of the measurement system was changed from the solderless breadboard to the Printed Circuit Board, which reduced the volume of the whole system, and stabilized the signals. In terms of driving Linear CCD, we used the microcontroller Arduino Mega2560 to generate the required signals, which reduced the driving cost and increased the convenience of changing the driving parameters. In terms of the CCDs, the previous type, TCD1503-DG, was replaced with a new one, TCD1705-D, which improved the measurement accuracy and the point data extraction significantly.
    The measurement range of the laser probe developed in this study was ±2 mm, and the resolution was 0.9 μm. A collocation of measurement software was developed by the LabVIEW. A three-axis motion platform and the laser probe were integrated to construct an automated measurement system.
    Different measurement modules were compared for the specimens with different materials. The proposed measurement modules were the averaging methods calculated by five CCDs, the median method determined by five CCDs and the averaging methods by six CCDs.
    The measurement errors of the development laser probe were verified by a Coordinate Measuring Machine (C.M.M). The measurement test workpieces included the stepped workpiece, the cylindrical surface workpiece, the bevel plane workpiece, the white cardboard plane, and the wood half-sphere workpiece. According to the performance test results, the three proposed measurement modules were used for the measurement results.

    中文摘要 I Abstract II 誌謝 III 目錄 IV 圖索引 IV 表索引 IV 第一章 緒論 1 1.1研究動機及目的 1 1.2文獻回顧 4 1.2.1多感測器三角雷射探頭 4 1.2.2以雷射探頭建構之非接觸式量測系統 6 1.2.3雷射探頭之實例應用研究 7 1.2.4 線電荷藕荷元件(Linear CCD)驅動 10 1.3研究方法與論文結構 11 第二章 雷射探頭之光路設計與理論介紹 13 2.1非接觸式三角雷射探頭原理介紹 14 2.2光電感測器的選擇介紹 18 2.2.1線電荷耦合元件(Linear CCD)性能指標 19 2.2.2線電荷耦合元件(Linear CCD)之可視角 21 2.3雷射探頭之光路與尺寸設計 22 2.3.1 Scheimpflug成像原理 22 2.3.2 光路設計及參數說明 23 2.3.3新參數選用 29 2.3.4雷射探頭量測模組演算法 31 第三章 第三章雷射探頭系統元件之架構與整合 34 3.1自製雷射探頭(含內部零組件) 34 3.1.1 Linear CCD規格 35 3.1.2 新舊Linear CCD比較 37 3.1.3微聚焦雷射光源 38 3.1.4聚焦透鏡 38 3.2微控制器Arduino Mega2560之Linear CCD驅動 46 3.2.1 TCD1503-DG型Linear CCD輸入訊號介紹 46 3.2.2 微控制器Arduino Mega2560 49 3.2.3驅動Linear CCD之暫存器設定說明 55 3.2.4 ∆Z 量測方法 59 3.2.5 TOSHIBA TCD1705-D Linear CCD整體電路 60 3.3 Linear CCD放大電路 61 3.3.1 Linear CCD線路PCB設計 65 3.4 Advantech 研華科技D/A卡(PCIE-1816) 73 3.5三軸運動平台模組 76 3.6 雷射探頭量測系統之人機介面開發 80 3.7雷射探頭系統整合 82 第四章 雷射探頭之特性校驗與實例量測 83 4.1 D/A轉換卡線性校驗 84 4.2 不同代木之系統校驗 85 4.3 白色紙板水平面之系統校驗 91 4.4 木材之系統校驗 94 4.5 雷射探頭系統之實例量測與誤差比對 96 4.5.1階高工件量測與誤差比對 98 4.5.2 圓柱面工件量測與誤差比對 102 4.5.3 斜面體工件量測與誤差比對 105 4.5.4 木半圓球量測與誤差比對 109 第五章 結論與未來研究方向 113 5.1結論 113 5.2未來研究方向 114 參考文獻 116 附錄一 121 附錄二 122 附錄三 126 附錄四 127

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