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研究生: 林宛盈
Wan-ying Lin
論文名稱: 雙階段濺鍍技術之氧化鋅薄膜殘留應力分析
Residual stress analysis of ZnO thin films deposited by the two-step sputtering technique
指導教授: 趙振綱
Ching-kong Chao
口試委員: 李維楨
Wei-chen Lee
蕭俊卿
Chun- ching Hsiao
學位類別: 碩士
Master
系所名稱: 工程學院 - 機械工程系
Department of Mechanical Engineering
論文出版年: 2010
畢業學年度: 98
語文別: 中文
論文頁數: 124
中文關鍵詞: 殘留應力氧化鋅射頻濺鍍
外文關鍵詞: residual stress, ZnO, sputter
相關次數: 點閱:181下載:5
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  • 中文摘要
    當薄膜沈積於基材上會受到製程參數與晶格常數的不同造成殘留應力的發生,而殘留應力將會影響薄膜之晶格結構與表面粗糙度,且隨著元件之使用環境、溫度、濕度等條件的變化,進而使得薄膜產生與基材剝離的現象,造成元件之生命週期、穩定度與可靠度降低。
    本文將利用射頻磁控濺鍍機濺鍍氧化鋅薄膜於石英(Quartz)、藍寶石(Sapphire)、鈮酸鋰(LiNbO3)、鉭酸鋰(LiTaO3)與具電極薄膜之矽基材(Au/Cr/Si3N4/Si、Pt/Ti/Si3N4/Si)基材上,利用單階段濺鍍技術與雙階段濺鍍技術改變濺鍍功率探討其對氧化鋅薄膜之晶體繞射強度、機械性質及薄膜應力之影響性。首先將鍍好之氧化鋅薄膜利用表面輪廓儀量測薄膜厚度,接著利用X光繞射儀探討其晶格結構與殘留應力之變化,最後再以掃描式電子顯微鏡觀察氧化鋅薄膜之表面形態。
    氧化鋅薄膜沈積於具金屬之矽基材(Au/Cr/Si3N4/Si、Pt/Ti/Si3N4/Si)及石英基材上比沈積於藍寶石、鈮酸鋰及鉭酸鋰上有較高之結晶特性與薄膜品質。氧化鋅薄膜沈積於Au/Cr/Si3N4/Si基材上之殘留應力小於沈積於Pt/Ti/Si3N4/Si上,但氧化鋅薄膜沈積於Au/Cr/Si3N4/Si上之晶粒大於沈積於Pt/Ti/Si3N4/Si之基材上。然而氧化鋅薄膜沈積於藍寶石與鉭酸鋰基材卻因為晶格常數不匹配造成無結晶特性,氧化鋅薄膜沈積於鈮酸鋰基材上,因鈮酸鋰之菱面體晶體結構(Rhombohedral crystal system),則雙階段濺鍍技術無法凸顯其優異性。濺鍍參數由低瓦數再配合沈積高瓦數之雙階段濺鍍技術可提高薄膜品質與結晶特性也可降低沈積時間,但無法明顯大幅度降低氧化鋅薄膜之殘留應力。


    Abstract
    The lattice, mechanical properties and surface roughness of thin films can be influenced while an excess internal stress exists in thin films. Thin films are peeled off the substrate while devices are used in a bad environment included high temperature and humidity etc. Therefore, the lifetime, stability and reliability of devices will be reduced.
    In the present study, the single step and two-step sputtering techniques are used to deposit the ZnO thin films on the various substrates included quartz, sapphire, LiTaO3, LiNbO3, Au/Cr/Si3N4/Si and Pt/Ti/Si3N4/Si. The thickness of the films is measured by 3D-profile. The structure and residual stress of ZnO films are measured by X-ray diffraction (XRD) analysis. Scanning electron microscope (SEM) is used to examine the morphology of ZnO thin films.
    The ZnO films deposited onto the Au/Cr/Si3N4/Si, Pt/Ti/Si3N4/Si and quartz substrates reveal well crystallinity oriented along the c-axis than those of sapphire, LiTaO3 and LiNbO3 substrate. The residual stress of ZnO thin films deposited on Au/Cr/Si3N4/Si substrate is smaller than that of Pt/Ti/Si3N4/Si substrate, but the grain size of ZnO thin films deposited on the Au/Cr/Si3N4/Si substrate is larger than that of Pt/Ti/Si3N4/Si substrate. However, ZnO films deposited onto sapphire and LiTaO3 substrates reveal amorphous state and weakly preferred orientation toward the c-axis because of the higher lattice constant mismatch between ZnO thin films and the substrates. The two-step sputtering technique cannot effectively enhance the crystallinity of ZnO films deposited onto LiNbO3 substrate. This can attribute to higher lattice constant mismatch between ZnO films and LiNbO3 substrate, and crystal system variation between hexagonal structure of ZnO material and rhombohedral structure of LiNbO3 material. The two-step sputtering technique with a lower RF power step followed by a higher RF power step can greatly improve the crystallinity of ZnO films and shrink the deposition time, but it cannot obviously alleviate the residual stress in ZnO films.

    目錄 中文摘要---------------------------------------------------------------- I 英文摘要----------------------------------------------------------------- II 致 謝----------------------------------------------------------------- III 目 錄----------------------------------------------------------------- IV 圖表索引----------------------------------------------------------------- VI 第一章 緒論---------------------------------------------------------- 1 1-1 研究背景與動機------------------------------------------------ 1 1-2 文獻回顧------------------------------------------------------ 4 1-3 研究目的------------------------------------------------------ 8 第二章 儀器與理論介紹------------------------------------------------ 12 2-1 基材---------------------------------------------------------- 12 2-2 薄膜沈積原理-------------------------------------------------- 14 2-3 濺鍍理論------------------------------------------------------- 16 2-4 表面輪廓儀----------------------------------------------------- 18 2-5 薄膜應力之量測------------------------------------------------- 19 2-6 掃描式電子顯微鏡分析------------------------------------------- 26 第三章 實驗過程------------------------------------------------------ 38 3-1 基材的切割與清洗---------------------------------------------- 38 3-2 具電極薄膜之矽基材製作----------------------------------------- 40 3-3 氧化鋅薄膜之濺鍍製程------------------------------------------- 40 3-4 使用X光繞射儀量測薄膜特性-------------------------------------- 41 3-5 使用掃描式電子顯微鏡量測薄膜表面形貌------------------------------- 42 第四章 實驗結果與討論------------------------------------------------ 53 4-1 氧化鋅薄膜之厚度量測------------------------------------------- 53 4-2 氧化鋅薄膜之結晶特性------------------------------------------- 54 4-3 氧化鋅薄膜之晶粒大小------------------------------------------- 57 4-4 氧化鋅薄膜之殘留應力------------------------------------------- 59 4-5 氧化鋅薄膜之表面形態------------------------------------------- 61 第五章 結論----------------------------------------------------------- 79 5-1 結論----------------------------------------------------------- 79 5-2 未來與展望----------------------------------------------------- 80 參考文獻----------------------------------------------------------------- 81 附 錄----------------------------------------------------------------- 84 作者簡介----------------------------------------------------------------- 124

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