簡易檢索 / 詳目顯示

回結果列表
研究生： 江昱成
Yu-Cheng Chiang
論文名稱： BGA構裝中SAC與SACNG無鉛銲料與Au/Ni/Cu多層結構之界面反應與銲點破壞性質
Study of interfacial reactions and mechanism properties between SAC and SACNG lead free solders with Au/Ni/Cu in BGA package
指導教授： 顏怡文
Yee-wen Yen
李嘉平
Chia-Pyng Lee
口試委員: 戴 龑
Yian Tai
吳子嘉
Albert T. Wu
陳志銘
C.M. Chen
郭俞麟
Yu-Lin Kuo
學位類別： 碩士
Master
系所名稱： 工程學院 - 化學工程系
Department of Chemical Engineering
論文出版年： 2008
畢業學年度： 96
語文別： 中文
論文頁數： 124
中文關鍵詞： 無鉛銲料 、界面反應 、BGA構裝
外文關鍵詞： lead-free solders, interfacial reaction, BGA package
相關次數： 點閱：355  下載：9 
分享至:
查詢本校圖書館目錄 查詢臺灣博碩士論文知識加值系統 勘誤回報

    • 摘 要

    電子構裝業中常使用到的基材材料為銅、鎳、銀為主。在銲接製程中，因銲點中因組成(化學勢)的差異引起銲料與基材原子的相互擴散，加上區域平衡(local equilibrium)的存在，於是乎於界面生成脆性之介金屬化合物，此一脆性之介金屬化合物雖然提供異質材料間的接合，但此介金屬化合物厚度大小卻也提供可靠度之不確定性。除此之外，銲料中微量添加物對銲料性質、界面反應等也是相當重要的因子。因此，本研究主要針對Sn-3.0Ag-0.5Cu (SAC305)、Sn-4.0Ag-0.5Cu (SAC405)以及Sn-4.0Ag-0.5Cu-0.05Ni-0.01Ge (SACNG)三種無鉛銲料與球閘式陣列構裝中之Au/Ni/Cu凸塊下金屬層(UBM)多層結構之界面反應以及其界面之剪力強度。
    在界面反應部份，結果顯示三種銲料所生成之介金屬相為(Cu,Ni,Au)6Sn5、(Ni,Cu,Au)3Sn4和AuSn4生成相；經長時間固態熱處理後，界面生成相仍為(Cu,Ni,Au)6Sn5和(Ni,Cu,Au)3Sn4生成相為主，但AuSn4生成相卻隨著反應時間增加而漸漸減少；另外Sn-4.0Ag-0.5Cu-0.05Ni-0.01Ge (SACNG)銲料在所有的反應過程中皆沒有發現以Ge為主的介金屬相生成，Ge的添加並不改變反應生成相之種類。在剪力強度部份，剪切強度隨著時效熱處理時間增加而下降。此外比較銲料間剪切強度之差異，SACNG銲料在長時間時效熱處理過後降幅強度要比SAC305、SAC405銲料要來的小；SAC305、SAC405銲料銲料在熱處理期間，斷裂面從銲料-介金屬化合物處轉變成只有單介金屬化合物，而在SACNG中卻沒有如此轉變。另外，比較觀察其銲料斷裂面之介金屬化合物皆為(Cu,Ni,Au)6Sn5相，並無明顯之差異。

    Abstract

    Element of Cu、Ni and Ag as substrate have been widely used for electronic packaging industry. In bonding process, the element diffusion between solders and substrate will grows brittle intermetallic compound (IMCs) at the interface. Because it has different compositions and local equilibrium inside. The IMCs provides heterogenous connection； however, the reliability is affected by the thickness of IMCs .An addition of little element in solders is important factor for solder properties and interfacial reaction. Therefore, this study investigate interfacial reaction and reliability between Sn-3.0Ag-0.5Cu (SAC305)、Sn-4.0Ag-0.5Cu (SAC405) 、Sn-4.0Ag-0.5Cu-0.05Ni-0.01Ge (SACNG) and Au/Ni/Cu substrate .
    In the interfacial reaction, (Cu,Ni,Au)6Sn5 and (Ni,Cu,Au)3Sn4 phases were formed at the interface, while the AuSn4 phase was observed within the solders in all couples. After heating treatment, (Cu,Ni,Au)6Sn5 and(Ni,Cu,Au)3Sn4 phases were observed to at the interface, but the AuSn4 phases vanished gradually with increasing reaction time. In all reaction process no Ge element IMCs were formed at the interface and within solders in Sn-4.0Ag-0.5Cu-0.05Ni-0.01Ge (SACNG). With respect to reliability, the strength decreased as the time of heating treatment increased. After heating treatment, the strength of SACNG solder was higher that those of SAC305 and SAC405. Furthermore, The fracture morphologies of SAC305 and SAC405 were transformed form solder-IMCs to IMCs only, nevertheless in SACNG, no such transformed was observed. The IMCs of fracture were(Cu, Ni)6Sn5 phase in all solders.

    目 錄 摘 要 I Abstract III 致 謝 V 目 錄 VII 圖 索 引 IX 表 索 引 XIII 第ㄧ章、前言 1 第二章、文獻回顧 5 2-1 電子構裝技術簡介 5 2-2 無鉛銲料之發展 11 2-2.1 無鉛銲料之規範 11 2-2.2 常見無鉛銲料 12 2-2.3 無鉛銲料之性質 16 2-3 球閘式陣列構裝 21 2-4 銲接 24 2-4.1 銲錫潤濕行為 24 2-4.2 助銲劑 26 2-4.3 常見銲接方式 26 2-4.4 銲點機械強度 29 2-5 擴散理論機制 30 2-6 界面反應相關文獻 31 2-6.1 錫-鉛與BGA金屬墊層之界面反應 31 2-6.2 錫-銅與BGA金屬墊層之界面反應 32 2-6.3 錫-銀與BGA金屬墊層之界面反應 33 2-6.4 錫-銀-銅與BGA金屬墊層之界面反應 33 第三章、研究方法 36 3-1 無鉛銲料與金屬墊層間反應 36 3-1.1 銲錫球與印刷電路板之基材製作 36 3-1.2 基材之製備與反應 37 3-1.3 金相分析 38 3-2 基本性質量測 41 3-2.1 DSC熔點測試 41 3-2.3 潤濕行為 42 3-2.4 銲點剪切強度探討 42 3-3 分析儀器 46 第四章、結果與討論 48 4-1 基本性質之量測 48 4-1.1 DSC熔點測試 48 4-1.2潤濕行為 50 4-2 界面反應 51 4-2.1 SAC305/Au/Ni/Cu反應偶之界面反應 51 4-2.1.1 迴銲後之界面金相形態 51 4-2.1.2 固態熱處理後之界面金相形態 58 4-2.1.3反應偶之介金屬層厚度與蝕刻形態 62 4-2.2 SAC405/Au/Ni/Cu反應偶之界面反應 65 4-2.2.1 迴銲之後之界面金相形態 65 4-2.2.2 固態熱處理後之界面金相形態 70 4-2.2.3反應偶之介金屬層厚度與蝕刻形態 74 4-2.3 SACNG/Au/Ni/Cu反應偶之界面反應 78 4-2.3.1 迴銲之後之界面金相形態 78 4-2.3.2 固態熱處理後之界面金相形態 85 4-2.3.3反應偶之介金屬層厚度與蝕刻形態 90 4-3 銲點剪切強度探討 94 4-3.1 SAC305/Au/Ni/Cu反應偶之銲點強度探討 94 4-3.2 SAC405/Au/Ni/Cu反應偶之銲點強度探討 98 4-3.3 SACNG/Au/Ni/Cu反應偶之銲點強度探討 102 第五章、結論 116 第六章、參考文獻 119 作者簡介 124

    參考文獻

    1. B. Trumble and J. Brydges , IEEE International Symposium on Electronics & the Environment, pp. 112-116 (1998).
    2. D. R. Frear and P. T. Vianco, Metallurgical Transactions A, Vol. 25A, pp. 1509 (1994).
    3. D. R. Frear, J. W. Jang, J. K. Lin, C. Zhang, P. T. Vianco, and D. R. Frear , Journal of Materials, Vol. 53, pp. 28-38 (2001).
    4. D. R. Smith, Flegal , J. A. R, Journal of Electronic Materials, vol. 30, pp. 1293 (2001).
    5. A. Z. Miric and A. Girusd. Soldering and Surface Mount Technology, vol. 10, pp. 19-25 (1998).
    6. C. Ernhart, S. Scarr, presented at the ACYF research conference, New Directions in Child and Family Research (1991).
    7. J. W. Yoon, S.W. Kim and S.B. Jung, Journal of Alloys and Compounds, Vol. 392, pp.247-252
    8. S. W. Cho, K. Han, Y. Yi, S.J. Kang, K.H. Yoo, K. Jeong and C.N. Whang, Advanced Enhineering Materials, Vol.8 pp.111-114 (2006).
    9. R. R. Tummala, E.J. Rymaszewaki and A.G. Klopfenstein, Microelectronics Packaging Handbook , Chapman & Hall, New York (1997).
    10. 陳力俊，微電子材料與製程，中國材料科學學會，台北，(2000).
    11. 溫英男， 錫鉛凸塊技術與覆晶技術之應用, 電子月刊, 64期, (2000).
    12. Rao. R. Tummala原著、陳信文、陳立軒、林永森、陳志銘 編譯，微系統構裝基礎原理，高立出版社，台北，(2002).
    13. L. Hymes, Electronic Materials Handbook, Vol. 1 Packaging, ASM International, Materials Park, Ohio (1989).
    14. Mulugeta Abtew and Guna Selvaduray, Materials Science and Engineering, vol. 27, pp. 95-141 (2000).
    15. D. R. Smith and A. R. Flegal, AMBIO (1995).
    16. N. C. Lee, Soldering & Surface Mount Technology, Vol. 9, Iss.2, p. 65 (1997).
    17. C. M. L. Wu, D. Q. Yu, C. M. T. La, and L. Wang, Materials Science and Engineering, Vol. 44, pp. 1~44 (2004).
    18. K. Suganuma, “Advances in Lead-free Electronics Soldering”, Current Opinion in Solid State and Materials Science, Vol. 5, pp. 55~64 (2001).
    19. J. H. L. Pang, B. S. Xiong, and T. H. Low, Thin Solid Films, Vol. 462-463, pp. 408~412 (2004).
    20. Y. Li and C. P. Wong, Materials Science and Engineering, Vol. 51, pp. 1~35 (2006).
    21. 魏弘堯，在BGA製程中以銦作為UBM層對接點界面形態與機械性質之探討，國立台灣科技大學材料科技研究所碩士論文，(2006).
    22. I. Karakaya and W. T. Thompson, ASM Hand book vol. 3 Alloy Phase Diagrams, edited by H. Baker, ASM International, Materials Park, Ohio (1992).
    23. Won Kyoung Choi and Hyuck Mo Lee, Journal of Materials Research, Vol.17, pp.43-51 (2002).
    24. X. Deng, N. Chawla, K. K. Chawla, and M. Koopman, Vol. 52, pp. 4291~4303 (2004).
    25. S. L. Allen, M. R. Notis, R. R. Chromik, and R. P. Vinci, Journal of Materials Research, Vol. 19, pp. 1417~1424 (2004).
    26. N. Saunders and P. Miodwnik, ASM Hand book vol. 3 Alloy Phase Diagrams, edited by H. Baker, ASM International, Materials Park, Ohio (1992).
    27. J. W. Yoon, S. W. Kim, S. B. Jung, Journal of Alloys and Compounds, vol. 385, pp. 192-198 (2004).
    28. J. W. Yoon, S. W. Kim, S. B. Jung, Journal of Alloys and Compounds, vol. 415, pp. 56-61 (2006).
    29. H.Okamoto, ASM Hand book vol. 3 Alloy Phase Diagrams, edited by H. Baker, ASM International, Materials Park, Ohio (1990).
    30. P. G. Kim and K. N. Tu, Materials Chemistry and Physics, Vol. 53, pp.165~171 (1998).
    31. Z. Moser, J. Dutkiewicz, W. Gasior and J. Salawa, ASM Hand book vol. 3 Alloy Phase Diagrams, edited by H. Baker, ASM International, Materials Park, Ohio (1985).
    32. M. McCormack, and S. Jin, Journal of Materials, Vol. 45, pp. 36-40 (1993).
    33. De Kluizenaar, and E. E., Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 1, pp. 1480-1485 (1983).
    34. R. J.K. Wassink, Soldering in Electronics, 2nd edn., Chap.7 (1989).
    35. Z.Mei and J. W. Morr, Jr., Journal of Electronic Materials, Vol. 21, pp. 401~407 (1992).
    36. J. W. Yoon, S. W. Kim, S. B. Jung, Journal of Alloys and Compounds, vol. 392, pp. 247-252 (2005).
    37. I. E. Anderson, J.C. Foley, B.A. Cook and J. Harringa, Journal of Electronic Materials, Vol. 30 (2001).
    38. 呂宗興, "電子構裝技術的發展歷程," 工業材料115 期, pp. 49~53 (1996).
    39. T. Shimoto, K. Baba, K. Matsui, J. Tsukano, T. Maeda, and K. Oyachi, Microelectronics Reliability, Vol. 45, pp. 567~574 (2005).
    40. T. Shimoto, K. Kikuchi, K. Baba, K. Matsui, H. Honda, and K. Kata, Microelectronics Reliability, Vol. 44, pp.515~520 (2004).
    41. Kwang-Lung Lin and Ming-Jin Chung, 2001 Int'l Symposium on Electronic Materials and Packaging, pp.146-149 (2001).
    42. Joachim Kloeser, Paradiso Coskina, Rolf Aschenbrenner, Herbert Reichl, Microelectronics Reliability, Vol.42, pp.391-398 (2002).
    43. Y. S. Wook, W. K. Choi and H. M. Lee , Scripta Materialia, ,Jan. Vol. 40, pp. 297-302 (1999).
    44. G. Leonida, Handbook of Printed Circuit Design, Manufacture,Components & Assembly, Electrochemical Publications Limited, Ayr, Scotland, Chap. 5-6 (1981).
    45. 田民波著、顏怡文修訂，半導體電子元件構裝技術，五南圖書出
    版社，台北 (2005).
    46. ASTM F1269-89, "Test Methods for Destructive Shear Testing of Ball Bonds," American Society for testing of Materials (1995).
    47. C. M. Miller, I. J. Anderson and J. F. Smith, Journal of Electronic Materials, Vol. 23, pp.595-601 (1997).
    48. A. D. Romig Jr., Sandia National Laboratories (1986).
    49. A. D. Romig Jr., F. G. Yost and P. F. Hlava, Mircrobeam Analysis-1984, ed.AD. Romig Jr. and J. I. Goldstein, San Francisco Press, CA (1984).
    50. C. E. Ho, W.T. Chen, C.R. Kao, Journal of Electronic Materials, Vol.30 pp. 379-387 (2001).
    51. 高振宏, 何政恩, “一種可抑制易脆之Au 介金屬於銲點中生成之新技術,” 中華民國專利, No.471988
    52. Jeong-Won Yoon, Seung-Boo Jung , Microelectronics Reliability , Vol. 46 pp. 905-914 (2006).
    53. 王朝弘， 陳信文， “Sn-0.7 wt.% Cu 在250℃之界面反應”，材料年會，台北
    54. W. C. Luo, C.E. Ho, J.Y. Tsai, Y.L. Lin, C.R. Kao , Materoals Science & Engineering A , Vol. 369 pp. 385-391 (2005).
    55. T. H. Chuang, S. F. Yen and M. D. Cheng, Journal of Electronic Materials, Vol. 35, pp. 302-309 (2006).
    56. H. Okamoto and T. B. Massalski, ASM Hand book vol. 3 Alloy Phase Diagrams, edited by H. Baker, ASM International, Materials Park, Ohio (1987).
    57. P. Nash and A.Nash, ASM Hand book vol.3 Alloy Phase Diagrams, edited by H. Baker, ASM International, Materials Park, Ohio (1992).
    58. Ahmed Sharif, M.N. Islam. Y.C. Chan, Materoals Science & Engineering B , Vol. 113 pp. 184-189 (2004).
    59. R. W. Olesinski and G. J. Abbaschian, ASM Hand book vol. 3 Alloy Phase Diagrams, edited by H. Baker, ASM International, Materials Park, Ohio (1984).
    60. 鮮祺振，“金屬腐蝕及其控制”，徐氏基金會，台北
    61. 貢國良，“微量Ge對大氣下液態Sn抗氧化性能的影響”，中國科學院金屬

    QR CODE