研究生: |
郭柏陞 Po-Sheng Kuo |
---|---|
論文名稱: |
拋光墊溝槽微粒分佈觀測應用於玻璃晶圓化學機械平坦化研究 Observation of Abrasive Distribution in Pad Groove for Application in Glass Wafer Chemical Mechanical Planarization Process |
指導教授: |
陳炤彰
Chao-Chang Chen 莊程媐 Chen-Hsi Chuang |
口試委員: |
潘文玨
Wen-Jue Pan 劉顯光 Hsien-Kuang Liu 田維欣 Wei-Hsin Tien 莊程媐 Chen-Hsi Chuang 陳炤彰 Chao-Chang Chen |
學位類別: |
碩士 Master |
系所名稱: |
工程學院 - 機械工程系 Department of Mechanical Engineering |
論文出版年: | 2021 |
畢業學年度: | 109 |
語文別: | 中文 |
論文頁數: | 145 |
中文關鍵詞: | 化學機械平坦化 、拋光墊溝槽 、粒子影像測速 、聚二甲基矽氧烷 |
外文關鍵詞: | Chemical Mechanical Planarization, Pad Groove, Particle Image Velocimetry, Polydimethylsiloxane, PDMS |
相關次數: | 點閱:476 下載:1 |
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本研究之目的為設計研發依商用拋光墊溝槽及其經過磨耗後之尺寸PDMS材料翻模複製的透明溝槽,並與玻璃黏合為一體之觀測模型,經過相似性轉換計算後利用粒子影像測速法(Particle Image Velocimetry, PIV)觀測螢光微粒在透明溝槽模型中的運動狀況,最後進行Glass-CMP驗證分析結果。本研究期望能解決在CMP製程中,因為晶圓與拋光墊之間視野狹小且材料不透明材質,導致若想在製程中瞭解拋光液中的磨粒在不同製程參數下對製程效益的影響非常困難之難題。本研究可分為三部分:先以微銑床在壓克力上銑削寬度520 μm,高度分別為400 μm、260 μm及120 μm之尺寸,再以PDMS翻模複製並打氧電漿使其與玻璃黏合完成透明溝槽模型製備,分別對透明溝槽模型進行尺寸量測與拋光墊及玻璃晶圓之折合模數、硬度、接觸角量測。第二部分先以相似性轉換計算注入流量再以PIV法觀測螢光微粒在不同溝槽深度及不同轉速參數下運動情形,分析結果注入速度與溝深影響對微粒速度及渦度有正相關,並能夠觀測到十字溝槽中微粒從進注口流入,經過轉角處加速的情形。最後進行Glass-CMP驗證實驗中得到晶圓之材料移除率與PIV觀測微粒運動結果之最大速度、渦度場呈現0.96與0.93極高度相關。
This study aims to develop a PDMS transparent groove model based on the commercial polishing pad groove and the changes of its depth, which is bonded to glass. After calculating the parameter based on the similarity transformation, particle image velocimetry (PIV) is used to observe the movement of the particles in the transparent groove model. Finally, the Glass-CMP is conducted to verify the results of the analysis. Due to the small gap between the wafer and the polishing pad as well as the opacity of the polishing pad, it is difficult to observe how the abrasives in the slurry affect the efficiency of the process under different CMP parameters. The study is conducted in three phases. Firstly, acrylic sheets are milled by a micro-milling machine into the width of 520 μm and the height of 400 μm, 260 μm, and 120 μm, respectively. PDMS is used to manufacture the transparent groove model, and oxygen plasma is then used to bond the model to glass. The dimensions of the transparent groove model are measured, as well as the reduce modulus, hardness, and contact angle of polishing pad and glass wafer. Secondly, the quantity of the fluorescent agent injected is calculated based on the similarity transformation, and the movement of the fluorescent particles in pad grooves with different depths and under different rotation parameters is observed by PIV. The results show that injection velocity and groove depth are highly correlated with particle velocity and vorticity, and that in the cross grooves, the flow of the particles is accelerated at the corners. Finally, the Glass-CMP verification experiment demonstrates that the material removal rate is positively correlated with the velocity magnitude and vorticity field of the particle movement observed by PIV have 0.96 and 0.93 highly correlated.
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