研究生: |
潘巧昕 Chiao-Hsin Pan |
---|---|
論文名稱: |
數位雙生系統於搖臂式拋光墊修整之分析與預測研究 Study on Digital Twin System for Analysis and Prediction of Swing-Arm Pad Dressing Process |
指導教授: |
陳炤彰
Chao-Chang Chen |
口試委員: |
趙崇禮
Choung-Lii Chao 劉顯光 Hsien-Kuang Liu 楊棧雲 Chan-Yun Yang 王雪明 Hsueh-Ming Wang 田維欣 Wei-Hsin Tien 陳炤彰 Chao-Chang Chen |
學位類別: |
碩士 Master |
系所名稱: |
工程學院 - 機械工程系 Department of Mechanical Engineering |
論文出版年: | 2022 |
畢業學年度: | 110 |
語文別: | 中文 |
論文頁數: | 149 |
中文關鍵詞: | 數位雙生 、即時監控 、動態量測 、拋光墊修整 、拋光墊移除率 |
外文關鍵詞: | Digital Twin, Real-time Monitoring, Dynamic Measuring, Pad Dressing, Pad Cutting Rate (PCR) |
相關次數: | 點閱:242 下載:0 |
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本研究目的為建立搖臂式拋光墊修整之數位雙生系統,整合搖臂控制模組及動態量測模組透過Modbus通訊協議連接實體搖臂與應用程式,可收集搖臂之實時資料,並透過彩色共軛焦感測器架設於搖臂上,以近似阿基米德螺線線方式達到等距且大範圍量測,利用數位雙生系統(Digital Twin System, DTS)監控及量測分析其表面訊號,預測拋光墊修整移除率(Pad Cutting Rate, PCR)。本研究分為三部分進行,首先建立數位雙生應用程式連接實體機台,達到即時監控製程,並以實際搖臂資料計算修整時在拋光墊各區之停留時間及實際下壓力對應之鑽石有效壓痕深度建立拋光墊移除率模型,實驗A透過變速修整軌跡模擬程式,模擬修整軌跡之分布,並藉由壓克力板進行修整軌跡驗證。實驗B透過等速修整實驗及變速修整實驗探討不同參數對於拋光墊之影響,並且將數位雙生系統與實際量測之修整移除率結果相互驗證,兩者於不同參數下最大誤差為19.6 %,均勻度最大誤差為9.56 %。且修整軌跡中,鑽石在內圈區域產生過度磨耗的情況,呈現內圈移除率較外圈高之情形,透過模擬修整參數,得到模擬之最佳參數4/8/10 deg/s,實驗結果顯示透過調節搖臂角速度可以達到整個拋光墊較為穩定之移除率及拋光墊均勻度,並以最佳修整參數4/8/10 deg/s作為實驗C之修整參數,進行12吋Oxide Wafer拋光實驗及相關性分析,透過變角速度修整後,晶圓薄膜厚度呈均勻下降,可提高晶圓移除均勻性57 %,並且對於拋光墊表面性能指標中與承載比之儲存區(Rpk)有高度相關(0.91)、與儲存區(Rvk)有高度相關(0.71)。
This study establishes a digital twin system of swing-arm pad dressing process, which integrates the swing-arm control model and dynamic measurement model. Collect swing-arm data with sensors through the Modbus communication protocol to obtain real-time data. The study is conducted in three phases. First, established a digital twin application for real-time monitoring of the physical machine to achieve the integration of the virtual world and physical world. The digital twin system analyzes and predicts the pad cutting rate (PCR) and pad uniformity (PU) through monitoring and measuring the surface signal. The model calculates duration time in different zones of pad and effective cutting depth of real-time pressure to predict PCR. Experiment A simulates the distribution of dressing locus and uses OpenCV to validation. Experiment B discusses the effects of various parameters on polishing pad and PCR result was verified by digital twin system and DPMS. The PCR maximum error is 19.6% and the PU maximum error is 9.56%. Experimental results show that adjusting the angular velocity of swing-arm not only can achieve better flatness and uniformity of pad but also the wafer removal uniformity in the CMP process can be improved by 57%. Discuss the correlation between MRR and bearing area ratio, the result shows that highly related to Rpk and Rvk.
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