本論文以分子動力學(Molecular Dynamics，MD)模擬不同刀尖半徑之刀具對脆性材料的奈米切槽行為，工件材料則採用共價鍵基礎的非晶態石英玻璃材料與金屬鍵基礎的非晶質銅鎳合金，透過熔煉-淬火製程製造出非晶態二氧化矽材料與銅鎳合金材料，比較不同切槽深度下，材料切削後深度與預定切削深度之差異評估其彈性回復量，並且判定材料形成切屑之臨界切削深度，分析不同鍵結材料的變形機制。
模擬結果顯示，石英玻璃之切槽過程中，由於刀具半徑效應效應的影響，隨著刀尖半徑的增加，並且隨著刀尖半徑的減少，切削其臨界切削深度也隨之減少。由切削力分析顯示，切削深度未達到臨界值時，刀具受到較多的底部摩擦力，因此刀具所受到的底部推力會大於有效的水平切削力。
非晶銅鎳合金之切削過程中，由於其為金屬鍵，原子外層之自由電子允許金屬原子間可以相互通過，故延性較高，因此在不同刀具幾何特徵均能在切削深度較低的情況下形成切屑。

In this paper, molecular dynamics (Molecular Dynamics, MD) is used to simulate the nano grooving behavior of different tool tip radius on a covalently bonded amorphous quartz glass material and a metal bond-based amorphous copper-nickel alloy. The amorphous SiO2 material and the copper-nickel alloy material are fabricated through a melting-quenching process, and the difference between the depth of the material after cutting and the predetermined depth of cut is compared at different depths of cutting to calculate the amount of elastic recovery during the cutting process, thereby determining the material forms the critical depth of cutting of the chip and discusses the mechanism of material deformation between the two.
The simulation results show that during the grooving process of quartz glass, due to the effect of the tool radius, as the radius of the tool tip increases, the amount of elastic recovery also increased by the surface of the material after cutting. After comparison with each other, as the radius of the tool tip is reduced, the critical cutting depth of the cutting process is also reduced. By cutting force analysis, when the cutting depth does not reach the critical value, because the cutting depth is shallow, the tool receives more bottom friction, so the bottom thrust of the tool will be greater than the positive cutting force.
In the cutting process of amorphous copper-nickel alloy, since it is a metal bond, the free electrons of the outer layer of the atom allow the metal atoms to pass each other, so the ductility is high, so it is easy to form chips in the case where the cutting depth is low.

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