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研究生: 李佳哲
Chia-Che Lee
論文名稱: 高速光電連接器與毫米波雷達天線及饋入架構之設計
Design of High-Speed I/O Connectors and Millimeter Wave Radar Antennas with Feeding Structures
指導教授: 楊成發
Chang-Fa Yang
口試委員: 楊成發
Chang-Fa Yang
廖文照
Wen-Jiao Liao
鞠志遠
Chih-Yuan Chu
林文雄
Wen-Hsiung Lin
蘇侯安
HOU-AN SU
學位類別: 碩士
Master
系所名稱: 電資學院 - 電機工程系
Department of Electrical Engineering
論文出版年: 2020
畢業學年度: 108
語文別: 中文
論文頁數: 151
中文關鍵詞: 毫米波雷達系統饋入架構貼片天線陣列天線高速連接器
外文關鍵詞: Millimeter Wave, Radar System, Feeding Structure, Patch Antenna, Array Antenna, High Speed Connector
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  • 本論文包含毫米波雷達系統之微型化饋入架構與陣列天線設計以及兩款連接器設計,可應用於第五代無線通訊系統。
    第一部份為微型化毫米波雷達天線設計,首先為可應用於毫米波雷達系統之微型化饋入架構,此架構利用精密加工方式,在鋁塊中放入介質鐵氟龍及內部導體作為連接77/79 GHz雷達IC模組與天線間之同軸電纜結構,而此饋入架構具有低傳輸損耗、高天線設計自由度、以及可藉由鋁塊達到散熱效果之優點。其次為針對大範圍三維涵蓋應用提出一款槽孔矩型貼片天線設計,並將天線分別設計應用於60與77/79 GHz兩種不同毫米波頻段。再次,本研究亦針對應用於77/79 GHz雷達系統之串列式槽孔貼片陣列天線進行設計與量測驗證。最後,本研究整合上述同軸饋入架構以及串列式天線來分析其整體效能。此外,本研究進行了毫米波雷達系統實測來驗證其偵測效能。
    第二部份則提出兩款連接器設計,內容包含應用於光電通訊系統之DSFP高速連接器以及汽車產業客制化Ouster連接器的設計。首先為DSFP高速連接器,其單通道支援頻率為0–28 GHz,若搭配PAM4調變方式,單通道傳輸速率將可達100 Gbps,由於此連接器具有上下兩通道,因此單顆連接器傳輸輸率可達200 Gbps,以滿足5G無線通訊之高速傳輸需求。接續為Ouster連接器設計,此連接器為基於Cat-5e客製開發圓型連接器,主要用於車載診斷系統,雖然此款連接器應用頻率並不高,但仍然具有高度耦合串音干擾效應,需要針對串音抑制進行改善。


    This thesis contains the design of the miniaturized feeding structure and array antenna for the millimeter-wave radar system, and also two connectors which can be applied in the 5th generation wireless system.
    The first part is the design of the miniaturized millimeter-wave radar antenna. Firstly, a miniaturized feeding structure that can be applied for millimeter-wave radar system is studied. A copper wire covered with Teflon is put into an aluminum block to form a coaxial line structure connecting the 77/79 GHz radar IC module and the antenna. Thus, the feeding structure may have low transmission loss, more flexible antenna design, and the advantage of the heat dissipation through the aluminum block. Secondly, a cavity-back patch antenna design is proposed for a wide range of three-dimensional coverage applications for 60 GHz and 77/79 GHz millimeter-wave bands, respectively. Thirdly, this study also carries out design and measurement verifications for series-fed cavity-back patch antenna applied to 77/79 GHz millimeter-wave radar system. Finally, the feeding structure and series-fed patch array antenna mentioned above are integrated to analyze overall performance. In addition, the measurement of the millimeter-wave radar system is conducted.
    The second part proposes two connector designs, including the DSFP high-speed connector for optical electrical application and Ouster connector for the automotive industry. Firstly, for DSFP high-speed connector design, every high-speed channel of the connector supports frequency range up to 28 GHz. With the PAM4 modulation technique, the transmission rate of the DSFP can reach 100 Gbps. Because this connector has two channels, the total transmission rate is 200 Gbps to meet the high-speed transmission requirements in the 5G wireless communications. As for Ouster connector. it is a custom-made circular connector based on Cat-5e, mainly used in on board diagnostics. Although the application frequency of this connector is not high, it still has a significant coupling crosstalk interference to be improved in this study.

    摘要 I ABSTRACT II 目錄 IV 圖目錄 VII 表目錄 XIII 第一章 緒論 1 1.1研究背景與動機 1 1.2論文組織 4 第二章 毫米波雷達系統之饋入架構與雷達測試 5 2.1 前言 5 2.2 同軸饋入架構設計與分析 8 2.2.1 下板與上板架構設計與模擬 9 2.2.2 整體架構模擬 17 2.2.3 製程變異分析模擬 22 2.2.4 小結 23 2.3 60/77/79 GHz槽孔矩形貼片天線模擬與量測分析 24 2.3.1 設計原理 24 2.3.2 設計流程 28 2.3.3 模擬 28 2.3.3.1 77/79 GHz槽孔矩形貼片天線 29 2.3.3.2 60 GHz槽孔矩形貼片天線 32 2.3.4 量測 34 2.3.4.1 77/79 GHz槽孔矩形貼片天線 34 2.3.4.2 60 GHz槽孔矩形貼片天線 40 2.4 77/79 GHz串列式槽孔貼片天線模擬 48 2.4.1 模擬 49 2.5 77/79 GHz串列式貼片陣列天線 53 2.5.1 模擬 54 2.5.2 量測 66 2.6 雷達系統測試 72 2.6.1 77/79 GHz 2T4R 微型化毫米波雷達測試 73 2.7 小結 77 第三章 高速連接器設計 78 3.1 前言 78 3.1.1 連接器的組成 78 3.1.1.1 塑膠 80 3.1.1.2 端子 81 3.1.1.3 外殼 81 3.1.1.4 連接器之製作 82 3.1.2 高速電路理論 83 3.1.2.1 特性阻抗 83 3.1.2.2 差模訊號 86 3.1.2.3 阻抗匹配與反射 89 3.1.2.4 脈衝上升時間 93 3.1.2.5 傳輸損耗 95 3.1.2.6 傳輸延遲 97 3.1.2.7 串音干擾 98 3.1.2.8 電路 101 3.2 DSFP 高速連接器設計與分析 103 3.2.1 連接器架構與規範 103 3.2.2 模擬 107 3.2.2.1 連接器阻抗調整 110 3.2.2.2 板端與卡端測試板量測置具設計 114 3.2.2.3 連接器S參數與串音抑制設計 118 3.3 Ouster III 連接器設計與分析 124 3.3.1 連接器架構與規範 124 3.3.2 模擬 126 3.4 小結 131 第四章 結論 132 參考文獻 133

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