本文旨在應用灰色理論、田口實驗方法與製程統計分析等之理論於記憶體模組除料製程之品質改善與化學機械拋光參數分析。
本文首先使用變異數分析與灰關聯理論分析，探討田口實驗計劃法之CMP實驗數據:如拋光正向壓力、拋光襯墊盤轉速、工件吸附盤轉速與擺動臂速度等參數，結果顯示兩者排序相同，同時針對灰關聯理論中的數據正規化對排序的靈敏度提出分析結果。
影響記憶體除料製程中產品長度尺寸精度有床台與夾具之誤差、刀具位置、刀具磨耗、機台震動與刀具溫度等等。本文結合灰關聯分析與統計製程分析的模式找出影響除料製程準確度的最重要參數為刀具的變異，其中以刀具初期磨耗為主要因素。
本文提出灰預測刀具補償法、預磨製程法與中心偏移法解決除料製程中，記憶體模組經常產生尺寸變異的問題。結果顯示三種方法均可改善產品之品質尺寸。此外本文使用製程能力指數計算三種方法改善之前與改善後的結果，並分析三種方式之優缺點。
為了研究鍍膜碳化鎢刀具之使用壽命與記憶體品質，本文使用TiAlCN與Zr鍍膜兩種市售之鍍膜碳化鎢刀具與自行製作之ZrN鍍膜碳化鎢刀具進行銑切記憶體模組除料製程實驗比較。實驗結果顯示，鍍膜刀具確實在使用壽命與記憶體產品品質上均有更佳的效果。
本文使用直流脈衝磁控濺鍍氮化鋯於碳化鎢刀具上，並由田口實驗方法結合灰關聯分析模式探討濺鍍製程最佳參數。由實驗得知，磁控濺鍍法具有方向性，所以本文設計一濺鍍刀具旋轉裝置，並找出最佳的濺鍍轉速。
本文的研究成果可作為記憶體模組之除料製程中，尺寸變異問題的解決方案的重要參考。

The major objective of this thesis is to apply theories such as Grey Theory, Taguchi Method and Statistical Process Control (SPC) etc. to the quality improvement of the depanel process of the memory modules, as well as the analysis of the CMP (Chemical Mechanical Polishing) parameters.
This thesis firstly uses ANOVA (Analysis of Variance) and grey relation analysis to investigate into CMP experiment data of Taguchi Method such as: polishing down pressure, polishing platen speed, carrier speed and arm oscillation etc. The result shows that the order of importance is the same. At the same time, an analytical result is proposed regarding the sensitivity of the data regularization and data of the grey relation theory towards the order of importance.
Factors affecting the precision of the products during the memory modules depanel process include: error between the tables and the fixtures, location of the tool, tool wear, machine vibration and cutting temperature etc. By combining the model of grey relation analysis and SPC, this thesis finds that the most important parameter affecting the accuracy of depanel process is the variation of tool, in which the preliminary tool wear can be regarded as the most important factor.
This research proposes to use grey prediction compensation method, pre-treated method and shift center deviation method to solve the problems of dimensional variation that often occurs in the memory modules. The result shows that these three methods can all improve the quality of the products. Besides, this thesis uses process capability indices to calculate the result of these three methods before and after improvement, as well as the advantages and the disadvantages of them.
In order to research into the tool life and the quality of the memory modules of the tungsten carbide router, this thesis uses two types of commercial available tungsten carbide router, which are TiAICN and Zr respectively, to undergo the experimental comparison towards the milling depanel process. Experimental result shows that the coated tools indeed carry a better effectiveness in their tool life and the quality of the memory module products.
This thesis uses Pulsed-DC Reactive Magnetron Sputtering (ZrN) on the tungsten carbide router, and by combining Taguchi Method and grey relation analysis, it analyzes into the optimal parameters for sputtering process. Experiment result shows that, magnetron sputtering is indicative in direction. Therefore, this thesis designs a rotational device for the sputtering tool and finds the optimal sputtering speed.
These research results can be provided as valuable references in solving the dimensional variation problems in the depanel process of memory modules.

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