隨著國際石油價格提高，永續性替代能源與製造成為研究主要方向，以矽(Si)為材料的太陽能基板主要由複線式線鋸切割技術(multi-wire sawing)進行切削。本研究主目的為建立線鋸分析程式(Wire Sawing Analysis, WSA)，分析切削前載液性質、切削後矽基板之表面形貌(surface topography)與估算切削後材料移除率 (material removal rate, MRR)。本研究設定兩組參數(WS-1、WS-2) 實際鋸切多晶矽晶錠，針對兩款不同黏度載液進行分析，以擬塑性流體(pseudoplastic fluid)之概念進行指數擬合(ostwal-deWaele equation)，定義漿料黏度影響因子(slurry viscosity factor, SVF)與漿料敏感度(slurry sensitivity, SS)，量測切削後基板表面粗糙度、基板厚度變化量與次表面破壞層(subsurface damage)，並對切削後基板表面進行快速傅立葉分析(fast Fourier transform, FFT)，探討基板形貌頻率振幅強度與頻率位置變化。由實驗結果可知，參數WS-1之黏度影響因子(SVF)為499.98、漿料敏感度 (SS)為-0.037比WS-2之SVF為461.5、SS為-0.045造成較大的切口損失(kerf-loss)與材料移除率(MRR)。此外，本研究所建立線鋸分析程式(WSA)未來可運用在不同載液與不同參數條件下所切削之矽基板形貌分析。

Multi-wire sawing process has been widely used to fabricate silicon substrates for solar cells application. This research is to develop the process model of wire sawing based on wire sawing analysis (WSA). Main parts of WSA include slurry viscosity factor (SVF) and slurry sensitivity (SS) obtained by ostwal-deWaele equation, the estimated of cutting kerf-loss and material removal rate (MRR). Two sawing parameters (WS-1 and WS-2) of free abrasive sawing (FAS) processes have been used to test WSA model by slicing polycrystalline silicon ingots. A viscosimeter is used to measure the slurry viscosity with variant temperature and the slurry film is calculated by dipping the wire into slurry at different temperature to estimate the kerf loss and MRR. The measured results of total thickness variation (TTV), surface topography, and subsurface damage are used to evaluate the feasibility of different slurry by slurry viscosity factor (SVF) and slurry sensitivity (SS). Fast Fourier transform (FFT) is used to analyze the frequency amplitude and frequency position of surface topography on different silicon substrates. Result of SVF as 499.98 and SS as -0.037 with WS-1 has obtained the higher kerf loss and MRR than those of WS-2 which SVF as 461.5 and SS as -0.045 after slicing. Both of subsurface damage and 3-D roughness parameters appeared better performance of WS-1 with higher viscosity. Results of this study could be used to analysis the carrier properties, surface topography, and estimate the cutting performance to investigate the effect of different cutting parameters.

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