研究生: |
許育豪 Yu-Hao Hsu |
---|---|
論文名稱: |
飛秒雷射製作金屬玻璃微奈米轉印精密模具應用分析 Applications and analyses of precise nanoimprint mold of metallic glass fabricated by femtosecond laser |
指導教授: |
鄭正元
Jeng-Ywan Jeng |
口試委員: |
鄭逸琳
Yih-Lin Cheng 黃忠偉 Jong-Woei Whang 洪基彬 Ji-BinHorng |
學位類別: |
碩士 Master |
系所名稱: |
工程學院 - 機械工程系 Department of Mechanical Engineering |
論文出版年: | 2011 |
畢業學年度: | 99 |
語文別: | 中文 |
論文頁數: | 98 |
中文關鍵詞: | 飛秒雷射 、精密轉印模具 、金屬玻璃 、熱壓微奈米轉印 |
外文關鍵詞: | Femtosecond laser, Precise mold, Metallic glass, Nanoimprint |
相關次數: | 點閱:215 下載:11 |
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飛秒雷射具有超短脈衝及光能量密度極高的特性,別於一般長脈衝雷射以光熱加工,飛秒雷射以光化學剝離機制加工,光子能量直接打斷材料鍵結,造成材料電漿離子化而移除;此特性使飛秒雷射具有加工熱影響區小、加工尺寸精密度高、極少微裂縫、重鑄層等特點。精密耐久模具為現代消費電子產品在大量生產製造所必需;金屬玻璃具高硬度及耐磨耗特性,可取代傳統易耗損之鎳模具,但由於金屬玻璃之強韌性使其加工不易。
本研究利用飛秒雷射之加工特性,製作金屬玻璃微奈米轉印之精密模具。嘗試使用不同雷射加工參數(能量功率、脈衝次數、掃描速度等)的變化對照其材料加工後狀況及尺寸,觀察其結構的變化及現象進而找出相對關係;並找出可製作最小結構之加工參數。後期研究為參考其分析結果,在金屬玻璃材料上製作出微奈米結構,透過熱壓式微奈米轉印技術,在高分子材料上壓印出設計之微奈米結構。以原理和加工結果配合,探討其可行性並證明飛秒雷射加工之特性及優點。期望未來可應用於半導體、生醫技術、微機電系統及微奈米製造技術。
Femtosecond laser is characterized with ultra-short pulse and high fluence. And with the unique mechanism of photochemical peeling, which is distinct from long-pulsed laser, femtosecond laser has advantages of small heat-affected zone, high precision, and recast layer. Nowadays, precise and durable moldings are necessary for mass productions of consumer electronics. With the high hardness and durability, metallic glass can ideally replace nickel moldings that tend to wear out. Nevertheless, metallic glass is difficult to manufacture due to its toughness.
This study utilizes femtosecond laser to manufacture nano-imprint moldings with metallic glass. With the adjustments and the results of specific working parameters, such as fluence, pulse and scanning speed, the correlation between effects and sizes on materials can be concluded in order to manufacture the minimum structures. After testing the best parameters, micro/nano structures on metallic glass have been fabricated and then used to imprint polymer. The results have successfully shown advantages of femtosecond laser. And it is promising to apply to semiconductor industry, biomedical engineering, MEMS and micro/nano machining.
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