本文探討電子束蒸鍍薄膜之殘留應力，以表面輪廓儀量測薄膜蒸鍍前後的曲率變化，再反算其殘留應力，並以有限元素進行數值模擬。首先以電子束蒸鍍機沉積鈦(Ti)薄膜在矽晶圓表面，鈦(Ti)薄膜於不相同沉積速率分別：0.1、0.3、0.5 (/s)；並將鈦(Ti)薄膜設定其不同的取出溫度：25、50、75 (℃)，進而比較其殘留應力的行為。其次使用奈米壓痕儀來計算鈦(Ti)薄膜微、奈米機械性質；再進一步利用X-ray繞射儀、能量分散式光譜儀(EDS)來檢測薄膜成分及晶格結晶方向。最後配合有限元素法(Finite Element Method)來模擬分析鈦(Ti)薄膜和矽晶圓間界面薄膜熱應力。在實驗檢測部份，鈦(Ti)薄膜沉積在矽晶圓表面，皆為壓縮應力，其薄膜殘留應力隨著沉積速率增加而增加；就機械性質而言，楊氏係數隨著殘留應力增加而增加、硬度則因殘留應力增加隨之減少。此外，蒸鍍後將溫度降到25 ℃把試片取出時，其薄膜殘留應力為最大，其次為75 ℃，待溫度50 ℃時取出試片其薄膜殘留應力為最小。在數值模擬部份，則是模擬溫度對鈦(Ti)薄膜的影響，便觀察其熱應力的變化，模擬結果顯示皆為拉伸應力，綜合實驗和模擬結果，我們可以得知，薄膜的製作過程中產生的本質應力皆遠大於溫度對試片所造成的熱應力。總而言之，薄膜殘留應力與沉積過程、沉積參數有相當大的關係，然而楊氏係數和硬度的機械性質將是取決於薄膜殘留應力。

A study of residual stresses of thin films evaporated by an electronic-beam is presented in this work. A surface profiler is utilized to measure the substrate curvature before and after evaporation. Then the residual stresses are calculated from the curvature change. In addition, a numerical simulation to predict the thermal mismatch between the thin film and substrate is also discussed. First, titanium thin films are deposited on silicon wafer substrate by evaporation deposition with 0.1, 0.3, 0.5 /s deposition rates. The specimens are cooled to 25, 50, 75 °C in the evaporator, and proceed the curvature measurement. Second, use nanoindenter, X-ray diffraction, and energy dispersive spectrometer to test the mechanical properties and microscopic structures of the thin films. Finally, the thermal stresses induced by the thermal mismatch between the titanium thin films and silicon substrates are simulated by finite element method. In experimental results, all the residual stresses are compressive and increase with deposition rate. The Young’s modulus increases but the hardness decreases as the deposition rate increases. For different cooled temperature, the specimen at 25 °C has the maximum residual stress, 75 °C is the second, and 50 °C has the minimum. In numerical simulation, the results show that all the thermal stresses between titanium thin film and silicone substrate are tensile. It concludes that the internal stresses induced by the deposition process are larger than the thermal stresses induced by the thermal mismatch. The residual stresses strongly depend on the parameters of deposition processes and have significant effect on the mechanical properties measured by nanoindentation.

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