金屬玻璃薄膜鍍覆微型鑽針：鍍膜參數對鑽孔效果之影響

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研究生：	黃筱翔 Hsiao-Hsiang Huang
論文名稱：	金屬玻璃薄膜鍍覆微型鑽針：鍍膜參數對鑽孔效果之影響 Thin Film Metallic Glasses-coated Micro-drill bits: Effects of Deposition Parameters on Drilling Performances
指導教授：	朱瑾 Jinn P. Chu
口試委員:	朱瑾 Jinn P. Chu 修芳仲 Fang-Jung Shiou 黃俐恬 Li-Tian Huang
學位類別：	碩士 Master
系所名稱：	工程學院 - 材料科學與工程系 Department of Materials Science and Engineering
論文出版年：	2017
畢業學年度：	105
語文別：	英文
論文頁數：	189
中文關鍵詞：	微鑽針、金屬玻璃鍍層、孔位精度、鑽針壽命、排屑能力
外文關鍵詞：	Micro-drill bit, Thin film metallic glass, Hole accuracy, Durability, Chip removal
相關次數：	點閱：230 下載：0
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上一筆

印刷電路板為電子業中不可或缺之部件，隨著機械加工技術朝向高精密與高速化方向發展，電路板微細加工之要求便愈趨嚴苛，使得鑽孔作業所使用之鑽針尺寸也越來越小。與一般尺寸鑽針相比，微鑽針承受相對嚴重的磨耗，進而導致斷針。為了使微鑽針達到良好的鑽孔條件與使用壽命，表面改質之鍍膜技術便發展在微鑽針上。
披覆在微鑽針上的鍍膜需要具備磨潤性，以減少加工過程中鑽針與工件之摩擦，並促進鑽針的排屑性能，進而提升鑽針之壽命與鑽孔品質。金屬玻璃鍍膜因其非晶結構，具備許多獨特之機械性質，例如：表面平整度佳、低摩擦係數與良好之磨潤性。故本研究將金屬玻璃鍍層鍍製在微鑽針上，期待能夠提升微鑽針之鑽孔性能。
本研究選用鋯基金屬玻璃鍍層鍍製薄膜於微鑽針上。微鑽針樣品於鍍膜前分別以兩種不同清洗方式（A組與B組）進行前處裡，接著以不同參數鍍覆含鈦緩衝層之金屬玻璃鍍膜與單層金屬玻璃鍍膜。鈦緩衝層是以電弧離子鍍的方式沉積，而金屬玻璃則是利用濺鍍方式沉積薄膜。含鈦緩衝層之金屬玻璃鍍膜微鑽針主要探討四種參數影響，包含表面清潔的時間、基材偏壓、電弧沉積時間與電弧能量；金屬玻璃薄膜鍍覆之微鑽針則探討工作壓力與基材偏壓對薄膜與微鑽針鑽孔能力之影響。完成鍍膜後之微鑽針會以固定轉速與進給率於兩種電路板上進行鑽孔測試。研究結果顯示，以A組清洗的微鑽針具有較佳之鑽孔能力，此結果可能是因微鑽針質量差異或清洗流程而造成，另外，不同板材條件會影響到鑽針鑽孔效果。在含鈦緩衝層之金屬玻璃鍍膜微鑽針的實驗結果中發現，表面清潔的時間越長會導致過度的離子轟擊，這將使鑽針針身受損，進而導致較差的鑽孔壽命；而在高基材偏壓下沉積的薄膜會有相對較少與較小的金屬微滴，這樣的薄膜會具備較低的表面粗糙度，進而提升鑽針的鑽孔能力。另一方面，在金屬玻璃薄膜鍍覆之微鑽針的實驗結果發現，在工作壓力5與8 mTorr下所製備的金屬玻璃鍍層之微鑽針展現相對佳之孔位精度與壽命。金屬玻璃鍍膜微鑽針與裸針相比，金屬玻璃鍍膜針最大可提升18.3%之孔位精度。研究更發現，鍍膜微鑽針在鑽孔過後針體表面粗糙度較低，表面粗糙度與鑽孔前相比，在退屑槽的位置僅有19.7%的變化量，而裸針在該位置之表面粗糙度變化量則為111.2%。因此，藉由以上的實驗結果推論，金屬玻璃鍍膜在適當的鍍膜參數下鍍製於微鑽針上，可以提供較平滑的表面，進而提升微鑽針之排屑能力與其他鑽孔性能。

The demand for better tool performance in machining printed circuit boards (PCBs) is increasing due to the extensive usage of PCBs in digital electronic products. Therefore, higher density PCBs with smaller hole diameters, produced by small sized drill bits are required. However, the chip adhesion became more serious for drill bits with small diameters e.g. micro-drill bit, leading to a poor drilling performance as well as short drill life.
To improve the drilling performance of micro-drill bits, surface modification, such as coating, have been widely applied. Thin film metallic glasses (TFMGs) have a smooth surface roughness and a low coefficient of friction compared with other coatings due to their disordered atomic structure. Accordingly, TFMGs have become a potential material for the surface treatment for micro-drill bits. In this study, micro-drill bits were pre-cleaned in two different ways, referred to as Group A and Group B. TFMG with Ti buffer layer (TFMG/Ti) and monolithic TFMG coatings were deposited by various deposition parameters using arc ion plating (Ti layer) and magnetron sputtering (TFMG). Effects of four parameters on drilling performance, including sputter etching time, substrate bias, arc deposition time and arc power were evaluated by TFMG/Ti coated drill bits. Moreover, the effects of working pressures and substrate biases were carried out by TFMG-coated drill bits. Drilling test were then evaluated on two kinds of PCBs, different PCBs yielded different drilling performances. For TFMG/Ti coated drill bits, long sputter etching time resulted in damage of drill substrate, due to the severe ion bombardment. Increasing substrate bias resulted in decreases of number and size of microparticles, thus the surface roughness decreased as well. For TFMG-coated drills, the pre-cleaning process was significantly influence on drilling performance. Overall, TFMG-coated drill bits in Group A presented a better drilling performance than those in Group B. TFMG-coated drill bits deposited at high working pressures (5 and 8 mTorr) exhibited better drilling performance. The coated drill bits gave an average enhancement of Cpk up to 18.3% and lower surface roughness variation before and after drilling rest (19.7% presented by coated drills while 111.2% presented by bare drill bits at flutes), compared with bare drill bits. Furthermore, TFMG remained on the flute of coated micro-drill bits, providing a better chip removal.

Contents
摘要    I
ABSTRACT    III
ACKNOWLEDGEMENTS    V
CONTENTS    VIII
LIST OF FIGURES    XII
LIST OF TABLES    XVII
CHAPTER 1 INTRODUCTION    1
1 BACKGROUND OF THE STUDY    1
2 MOTIVATION AND OBJECTIVES    2
CHAPTER 2 LITERATURE REVIEW    3
1 MICRO-DRILL BITS USED IN PCB MANUFACTURING    3
1.1 Micro-drill bits: Materials and geometry    3
1.2 Printed circuit board    4
2 MECHANISM AND EVALUATION OF DRILL BITS    5
2.1 Wear    6
2.2 Chip adhesion    7
2.3 Durability    9
2.4 Hole position accuracy    10
3 LUBRICANT COATINGS ON DRILL BITS    13
4 BUFFER LAYER USED ON DRILL BITS    16
5 THIN FILM METALLIC GLASSES    17
5.1 Properties and fabrication of TFMGs    17
5.2 Applications of TFMGs    20
5.3 Surface roughness of TFMGs    22
6 MAGNETRON SPUTTER DEPOSITION    23
7 CATHODIC ARC PLASMA DEPOSITION    25
7.1 MACROPARTICLES (OR MICROPARTICLES)    26
CHAPTER 3 EXPERIMENTAL PROCEDURES    30
1 SAMPLE PREPARATION    31
1.1 Substrate preparation    31
1.2 Substrate pretreatment    31
2 THIN FILM DEPOSITION    34
2.1 TFMG/Ti and TFMG deposition    34
2.2 Deposition parameters of TFMG/Ti    35
2.2.1 Deposition parameters of TFMG/Ti-PCB 1    35
2.2.2 Deposition parameters of TFMG/Ti-PCB 2    37
2.3 Deposition parameters of TFMG    37
3 MATERIAL CHARACTERIZATION    39
3.1 Chemical composition analysis    39
3.2 Crystallographic analysis    39
3.3 Thermal analysis    40
3.4 Microstructural analysis    41
4 DRILLING PERFORMANCE EVALUATIONS    41
4.1 Drilling condition    42
4.2 Hole position accuracy analysis    45
4.3 Durability analysis    47
4.4 Chip removal test    47
5 SURFACE MORPHOLOGY OBSERVATION    48
6 SURFACE ROUGHNESS ANALYSIS    48
7 CHEMICAL COMPOSITION ANALYSIS OF THE DRILL BITS AFTER DRILLING    50
CHAPTER 4 RESULTS AND DISCUSSION    51
1 MATERIAL CHARACTERIZATIONS    51
1.1 Chemical composition Analysis    51
1.2 Crystallographic analysis    53
1.3 Thermal analysis    53
1.4 Microstructural analysis    54
2 GROUP A: TFMG/TI COATEDDRILL BITS    56
2.1 Group A: TFMG/Ti coated drill bits-PCB 1    56
2.1.1 Effects of sputter etching time    56
2.1.1.1 Drilling performance evaluations    57
2.1.1.1.1 Hole position accuracy analysis    57
2.1.1.1.2 Chip removal test    57
2.1.1.2 Surface morphology observation    58
2.1.1.3 Surface roughness analysis    60
2.1.2 Effects of substrate bias    63
2.1.2.1 Drilling performance evaluations    63
2.1.2.2.1 Hole position accuracy analysis    63
2.1.2.2.2 Chip removal test    63
2.1.2.2 Surface morphology observation    64
2.1.2.3 Surface roughness analysis    66
2.1.3 Effects of arc deposition time    67
2.1.3.1 Drilling performance evaluations    67
2.1.3.1.1 Hole position accuracy analysis    67
2.1.3.1.2 Chip removal test    68
2.1.3.2 Surface morphology observation    68
2.1.3.3 Surface roughness analysis    70
2.1.4 Effects of arc power    71
2.1.4.1 Drilling performance evaluations    71
2.1.4.1.1 Hole position accuracy analysis    71
2.1.4.1.2 Chip removal test    72
2.1.4.2 Surface morphology observation    73
2.1.4.3 Surface roughness analysis    75
2.1.2 Discussion on TFMG/Ti coated drill bits-PCB 1    76
2.2 GROUP A: TFMG/TI COATED DRILL BITS-PCB 2    77
2.2.1 Effects of arc deposition time    77
2.2.1.1 Drilling performance evaluations    77
2.2.1.1.1 Hole position accuracy analysis    77
2.2.1.1.2 Chip removal test    78
2.2.1.2 Surface morphology observation    78
2.2.1.3 Surface roughness analysis    80
3 GROUP A: TFMG-COATED DRILL BITS (EFFECTS OF WORKING PRESSURE AND SUBSTRATE BIAS)    81
3.1 Drilling performance evaluations    81
3.1.1 Hole position accuracy analysis    81
3.1.2 Durability analysis    84
3.1.3 Chip removal test    85
3.2 Surface morphology observation    87
3.3 Surface roughness analysis    106
3.4 Chemical composition analysis of the coated drill bits after drilling    109
3.4.1 Mapping and the microstructure analysis of the coated drill bits after drilling    114
3.5 Discussion on Group A TFMG-coated drill bits    118
4 GROUP B: TFMG-COATED DRILL BITS (EFFECTS OF WORKING PRESSURE AND SUBSTRATE BIAS)    121
4.1 Drilling performance evaluations    121
4.1.1 Hole position accuracy analysis    121
4.1.2 Durability analysis    123
4.1.3 Chip removal test    124
4.2 Surface morphology observation    126
4.3 Surface roughness analysis    141
4.4 Chemical composition analysis of the coated drill bits after drilling    145
4.5 Discussion on Group B TFMG-coated drill bits    148
5 COMPARISON OF TFMG-COATED DRILLS IN GROUP A AND GROUP B    150
5.1 DIFFERENCE IN CLEANING PROCESS BETWEEN GROUP A AND GROUP B    152
CHAPTER 5 CONCLUSIONS    155
REFERENCES    157
                                

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