本研究是有關於開發一種塑膠金屬化立體線路的製造方法，特別是指在三維立體的塑膠本體上形成立體金屬化圖案線路的製造方法。
由於智慧型手機、超薄筆記型電腦等3C 產品日益輕薄短小，故必須縮減內部元件之體積與增加空間彈性應用，三維立體電路技術的最大優點是易適用於不規則之塑膠基材上，形成立體電路，充份利用到產品表面所有空間。目前雷射直接成型法(Laser Direct Structuring, LDS)為三維立體電路技術主要製作方法，其利用雷射進行圖案化，進而將活化金屬晶粒曝露於塑膠表面，再以無電鍍進行金屬線路沉積，雖然具有設計彈性大、節省空間等特性，但受限於特定材料限制。因此，本研究論文將發展一種雷射曝光蝕刻線路的塑膠金屬化天線技術(Etching for Three-dimensional Structures, ETS)，亦能於三維立體結構上進行金屬線路製作，且不受特殊基材材料之限制，更擴大天線設計之應用範圍。
由美國無線通信協會(CTIA)針對無線電行動通訊裝置所制定的一套輻射性能測試規範OTA(Over-The-Air)，本研究依照此輻射性能測試方式來實際驗證ETS三維立體天線在三維空間中的「輻射發射功率」與「輻射接收靈敏度」，其主要的測試項目包括總輻射功率(TRP)與總等向性靈敏度(TIS)。最後，經由量測結果比較可看出ETS三維立體天線展現出比LDS三維立體天線更良好的天線效能。

Thanks to the significant advantages of 3D circuits, such as space saving and irregular substrates, it is expected to fit the rapidly growing demands of smaller and lighter 3C products such as smartphones and laptops. Laser Direct Structuring (LDS) is the most common method in 3D-MID circuit manufacturing, performing laser patterning with post electro forming on activated ions. Although highly flexible in design, it is limited by material selection. Therefore, to expand the applications of 3D circuits, the development of laser exposure and etched metallization technique in our research, and is not strongly limited by its substrate material.
Mobile OTA (Over-The-Air) performance test is a radiated performance test defined by CTIA – The Wireless Association for wireless devices, this study applies the OTA test method to verify 3D-ETS antenna in 3-dimension “Radiated RF Power” and “Receiver Performance”. Its main test items include TRP (Total Radiated Power) and TIS (Total Isotropic Sensitivity) two categories. From these measured antenna parameters data, we can observe the good antenna quality of the 3D-ETS antenna than the 3D-LDS antenna.

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