印刷電路板是配合客戶產品開發進行高度客製化的產品，而電子產品發展 快速，隨時會因為市場需求推出新應用產品，導致既有產品沒落或甚至消失於市場中。因此需要對市場開發與應用狀況進行策略分析與佈局，以確保能開發出滿足未來產品應用所需的新技術。個案公司之環境市場處在第五代通訊系統正在推行與應用發展之時，在受到COVID-19疫情影響下，對於其利基型產品的開發策略與戰略佈局進行研究分析探討。
本研究先透過文獻與產業分析方法找出適合個案公司的利基型產品種類，再使用本研究規劃之方法分析。利用PEST分析與五力分析進行企業外部與內部環境分析，搭配SWOT分析來制定SO策略-商業機會WO策略-轉型成長ST策略-創造市場與WT策略-商業風險之對策組合。再以目標產品的產品生命週期分析電路板所需之產品應用，進行產品組合與資源分配策略分析。並以此進行戰略與規劃出未來三年產品開發策略藍圖。
本研究目標為規劃組織未來三年產品開發策略藍圖(T-Plan) 並以此研究流程標準化、建立未來產品開發策略佈局及戰略規畫之流程，讓組織能永續經營。並定期更新檢討產品開發策略藍圖，以能符合最新市場產品應用需求。

The printed circuit boards are highly customized products that cooperate with customer product development. The electronic product is developing rapidly. New application products will be launched due to market demand at any time. It will be leading to the decline or even disappearance of existing products in the market. Therefore, it is necessary to conduct strategic analysis and layout of market development and application status. Let the new technologies can meet future product applications can be developed. The market of the case company is at the time when the fifth-generation communication system is being promoted and applied. Under the influence of the COVID-19, it needs research and analysis on the development strategy and strategic layout of its niche products.
First, we use literature and industry analysis methods to find out the types of niche products for the case company and use the methods of this research plan to analyze. Use the PEST analysis and the Five Forces analysis to do the external and internal environment analysis of the company. Use the SWOT analysis to formulate the strategy. It includes the business opportunity, transformation growth, market creation, and business risk countermeasure combination. Then analyze the product application required by the PCB on the product life cycle of the target product. And analyze the product portfolio and resource allocation strategy. Based on this strategy and planning, draw up the technology roadmap for the product development strategy.
The goal of this research is to plan and organize the development strategy roadmap (T-plan) and use it to let the process standardization. It establishes the future product development strategy layout and strategic plan. It needs regularly update and review the roadmap to meet the latest market product application requirements.

[1]. D.R. Probert, C.J.P. Farrukh and R. Phaal. (2003). Technology roadmapping: linking resources to strategic goals. Cambridge: University of Cambridge.
[2]. Giseli Valentim Rochaa, Carlos Henrique Pereira Melloa. (2015). How to develop technology roadmaps? The case of a Hospital Automation Company. Itajubá: aUniversidade Federal de Itajubá.
[3]. IppichAlexander. (2014年January月). Influence of Via Stub Length and Antipad Size on the Insertion Loss Profile. The PCB Design Magazine, 42-58.
[4]. PisanoP.G. (2015). You need an innovation strategy. Harvard Business Review, 44-54.
[5]. PompeoR.Mochael. (2020). The Clean Network. 擷取自 U.S.DEPARTMENT of STATE: https://www.state.gov/the-clean-network/
[6]. PorterE.Michael. (1980). Competitive Strategy: Techniques for Analyzing Industries and competitors. New York: The Free Press.
[7]. PRISMARK. (2020). PCB MARKET UPDATE. NY: PRISMARK.
[8]. Robert Phaal, Clare Farrukh and David Probert. (1997). Technology Roadmapping: linking technology resources to business objectives. Cambridge: Centre for Technology Management, University of Cambridge.
[9]. Robert Phaal, Clare J.P. Farrukh and David R. Probert. (2001年8月). Characterisation of Technology Roadmaps: Purpose and Format. Cambridge: Institute for Manufacturing, University of Cambridge.
[10]. 工研院產科國際所. (2019). 5G時代引領新興電路板需求. 桃園市: 台灣電路板協會(TPCA).
[11]. 工研院產科國際所. (2019). 全球伺服器產業現況與展望. Taoyuan: TPCA台灣電路板協會.
[12]. 工研院產科國際所. (2020年11月). RCEP 成立對台灣電路板產業影響. 桃園市: TPCA.
[13]. 工研院產科國際所. (2020). 全球肺炎疫情(COVID 19) 對臺灣產業影響關鍵報告. 台北市: 工業技術研究院.
[14]. 中原捷雄(HayaoNakahara). (2020年9月23日). NTI-100 2019全球PCB百大排行出爐 PCB產業聚焦亞洲. 擷取自 TPCA台灣電路板協會: https://www.tpca.org.tw/Message/MessageView?id=7985&mid=283
[15]. 印刷電路板產業鏈簡介. (2020). 擷取自 產業價值鏈資訊平台: https://ic.tpex.org.tw/introduce.php?ic=L000
[16]. 林定皓. (2003). 軟性電路板技術. 桃園市: 台灣電路板協會.
[17]. 林定皓. (2015). 高密度印刷電路板技術. 桃園市: 台灣電路板協會.
[18]. 經濟部技術處ITIS研究團隊. (2020). 2019年全球前三大之台灣產業/產品. 經濟部技術處.
[19]. 零組件研究部電子組董鍾明. (2020). 全球肺炎疫情(COVID-19)對臺灣產業影響關鍵報告 – 電路板. 台北市: 工研院產業科技國際策略發展所.
[20]. 潘建光. (2020). 全球化重組下之伺服器與網通產業發展新契機. 台北市: 財團法人資訊工業策進會產業情報研究所(MIC).
[21]. 龔明德ResearchDIGITIMES. (2020). 5年預測:公有雲、HPC、AI、5G帶動2020~2025年全球伺服器出貨CAGR將達6.7%. 台北市: DIGITIMES.
[22]. 龔明德ResearchDIGITIMES. (2020). 產銷調查：既有雲端服務及疫情觸發線上需求帶動1H20全球伺服器出貨可望雙位數年增. 台北市: DIGITIMES.