本研究探討Sn-9wt%Zn、Sn-3.0wt%Ag-0.5wt%Cu合金銲料以Ag為基材在經過不同的回銲次數後對界面反應與機械性質的影響，並以反應偶形式來觀察其界面反應後之介金屬相種類與形態，且根據介金屬相於不同的回銲次數及反應時間之厚度表現，探討其反應機制，並量測其銲點的機械強度來評估接點的可靠度。實驗結果顯示，Sn-9Zn/Ag系統在240℃下，生成AgZn3、Ag5Zn8及AgZn相，以冰水淬冷的反應偶介面處析出的AgZn3相較薄， 在空冷的介面處有棒狀Zn的析出，隨著反應時間及回銲次數的增加棒狀Zn會逐漸減少成細小針狀Zn；Sn-3.0Ag-0.5Cu/Ag系統在240℃下，生成Ag3Sn相，在空冷的反應偶中，Ag3Sn隨著回銲次數的增加有逐漸粗大化的趨勢。此二系統之介金屬相厚度與反應時間之平方根呈線性關係，反應機制皆為擴散控制所主導。

In this study, Sn-9wt%Zn、Sn-3.0wt%Ag-0.5wt%Cu solders and the Ag metal were prepared to form the reaction couples. During different reflowing times, we investigated interfacial reaction and mechanical properties of the reaction couples.
The results showed that the AgZn3、Ag5Zn8及AgZn phases were form at the Sn-9Zn/Ag interface. The AgZn3 phase quenched in ice water was thinner than quenched in air. The amounts of rod-shaped Zn precipitates in Sn-9Zn/Ag quenched in air are more than Sn-9Zn/Ag quenched in ice water. And The thickness of IMC between Sn-9Zn/Ag and reaction couples increase with reflowing times. In SAC/Ag system, we found the Ag3Sn phase was form at the Sn-9Zn/Ag interface and the Ag3Sn between SAC/Ag interface became coarsening with reflowing times. Also, the thickness was proportional to the square root of reaction time. The interfacial reaction mechanism was diffusion controlled.
In the ball shear test, the fracture surface showed brittle and AgZn3 phase appear with the increasing of reflowing times for the Sn-9.0Zn/Ag couple. For the SAC/Ag couple, the fracture surface showed ductile and slightly brittle failure and Ag3Sn phase appear with the increasing of reflowing times.

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