本論文旨在討論自動測試機台，在針對方形扁平無引腳積體電路包裝之散熱片不同測試方式，提升整體測試良率，減少成本支出，探討以提供電流或電壓測試方法，達到測試站將不良品排除。選取用汽車材料專用之方形扁平無引腳積體電路，使用Teradyne測試平台IFLEX， VBAT程式碼作為測試編碼。在研究中探討了散熱片脫層的不良品問題，以及改善測試方式前後不同的結果，良率改善了0.76%。
脫層的驗證方式為超音波掃描顯微鏡，由收集不同測試不良品，分析是否有脫層佐證散熱片量測方式的精確性。因為散熱片量測方法並非於掃除脫層之不良品，主要針對封裝時，晶片不同腳位連接金或銅線之塌陷至散熱片不良品做測試之排除。以改良測試的方式，進而改善良率並降低整體測試成本。

This thesis aims to study different testing methods for yield improvement and cost reduction of Quad Flat No-lead (QFN) package devices at Automatic Test Equipment (ATE). Based on different method of driving current or voltage is to screen out the rejects at final testing station. The target IC is packaged by QFN commonly used in automotive application. The adopted testing platform is IFLEX from Teradyne and the coding is VBAT.
In this thesis, QFN thermal pad delamination analysis from test failures, by the results of different testing method is discussed and compared. The total yield is improved 0.76% from rejects. Scanning Acoustic Microscope (SAM) is used for delamination.
According to collection of different rejects, the devices are analyzed to see if having delamination or not. The testing of IC thermal pad is not for filtering the delamination issue. The bonding wire is from different pins to thermal pad. To use the new test method, yield can be increased and cost can be reduced.

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