光波導由於電磁免疫等優越特性而被廣泛的研究與應用，最普遍常見的光波導元件為可用於長距離傳輸的光纖波導，由於光纖提供極佳的特性如低傳輸損耗、重量輕與低價格，因此也常被作為光纖感測器的應用，但光纖卻難以做元件內部的積體整合，而高分子光波導與矽光波導由於擁有可高積體整合的特性能夠解決此問題。在本論文中我們將介紹這些光波導以及他們的應用。
本論文以單模光纖作為光纖感測器作為起頭，利用低同調干涉之概念以雙級式馬赫詹德干涉儀(Mach–Zehnder interferometer)應用於光纖感測器，可實現於應變(strain)、力量(force)與雙折射效應(birefringence)的光纖偵測。雙級式光纖干涉感測器，能在干涉圖上得到兩倍的干涉距離有效的提升靈敏度。此架構以3公尺的單模光纖作為低同調干涉感測元件，擁有6.8 μm/με之應變靈敏度，並且此系統搭配力量偵測器，可得到力量對於干涉距離變化的關係，實驗結果顯示此架構擁有8.5 μm/mN的力量靈敏度。此外，提出以1310 nm光波長的高同調光源作為光學尺較準系統，可提升系統之解析度，利用655 nm半波長的週期性變化，配合18.9 nm的步進馬達解析度，在理論上3公尺光纖之應變解析度可達2.7nε。本論文也對1公尺與30公尺的單模光纖作為干涉式應變感測器，分別可擁有2.3, 66.7 μm/με之應變靈敏度，此結果明顯顯示感測光纖長度越長將擁有越高的靈敏度。馬赫詹德光纖干涉感測器也能夠測量極化保持光纖(Polarization maintaining Fiber, PMF)的節拍長度與雙折射效應，經過此感測系統測量康寧熊貓型極化保持光纖，實驗結果顯示長度1公尺與3公尺的極化保持光纖，雙折射效應分別為3.85×10-4與3.92×10-4，換算為節拍長度分別為4.03mm與3.95 mm，此結果與產品規格中之節拍長度相比較是吻合的。
可撓式光波導不僅可彎曲並擁有非常低的光傳輸損耗，還擁有極佳之穩定性與可彈性的整合產品，可應用在折疊式的智慧型3C產品之中，本論文研究此光波導與傳統印刷電路板整合成可撓式光電電路板(Optical and electric printed circuit board, OEPCB )，不僅可達到傳統銅線無法達成之高速傳輸，還可保有極佳的彎曲不敏感特性。光電電路板之光學設計以LightTool軟體模擬光學路徑以及製程對準誤差所造成之損耗，簡易的切割製程製作45度的斜面，並以電子束蒸鍍的方式製作銀反射面，可達成光學垂直耦合的目的，由於銀鍍層製作成本高，因此本論文也針對不使用銀鍍層的內部全反射的概念作為垂直耦合的方法做探討。量測結果顯示此可撓式光波導傳輸損耗最低可達0.1dB/cm，也證實切割法不僅擁有簡單的斜面製程，還能夠使波導端面平整化，擁有比一般研磨端面更低的損耗。載入12.5Gb/s之高頻訊號，由數位通訊分析儀能得到清楚的眼圖與Q值，而且在彎曲半徑2mm的狀態下傳輸，Q值仍然變化不大。並且此波導能夠以2mm的彎曲半徑撓曲而不受破壞，經過高溫高濕以及溫度循環的測試仍能夠擁有低損耗的傳輸特性。
由於矽材料本身在通訊波段上有極低的吸收損耗，並且易與矽晶圓上之積體電路元件整合或製程上的相容，可達成光電積體電路之標的。論文中介紹矽光波導之單多模現象，並以光波導延伸應用於微環形共振腔，且可作為微波相位延遲器之應用，以多模干涉器(Multimod interference, MMI)之波長不敏感特性作為次微米環型共振腔之功率耦合器，目標在於完成波長不敏感之環型共振腔，以調整光源之波長的方式可調整微波之相位，環長為110nm之環型共振腔實驗結果顯示，可調整350°的相位差。
　　最後，除了一般水平的光連結外，為達成更高度的整合，45度的反射面可用以達成矽光波導與高分子波導的垂直的光學連結概念，實驗結果證實，可撓式光波導與矽光波導之光學連結於1310nm之光波長可擁有較低的損耗。結合可撓曲低損耗的高分子波導以及CMOS製程相容的矽光波導，將會是下世代光學連結的研究目標。

Optical waveguide has been widely used in various applications because it is immunity to electromagnetic interference. The most common optical waveguide for long-distance transmission is optical fiber. Due to optical fibers offer the advantages of low propagation loss, light weight, and low costs, it has been widely applied to fiber-optics sensor as well. But optical fiber is difficult to achieve in-device integration. However, optical polymer waveguides and silicon waveguides can resolve this problem because of their ability to satisfy the high-density integration. In this thesis, we introduce these optical waveguides and their applications.
We propose using a two-stage optical low-coherence Mach-Zehnder (MZ) interferometer containing a super-luminescent emitting diode (SLED) for fiber sensing sensitivity enhancement. This fiber-optic structure was used to several types of sensors such as strain, force, and birefringence sensors. An single mode fiber with a 3-m-long sensing arm exhibited strain and force sensitivities as high as 6.8 μm/με and 8.5 μm/mN, respectively. In addition, the beat-length value of a polarization-maintaining fiber (PMF) was measured using an optical MZ interferometer. The experimental results indicate that the birefringence values of 1-m and 3-m PM fibers were 3.85 × 10-4 and 3.92 × 10-4, respectively. Using an optical ruler derived from a 1310-nm wavelength distributed feedback (DFB) laser assisted by a stable stepper motor improved strain resolution. Theoretically, a 3-m-long fiber sensing arm in a MZ interferometer can be used to obtain a 2.7-nε high-strain resolution. The sensitivity values of 1-m and 30-m fiber strain sensing were 2.3 and 66.7 μm/με, respectively. The experimental results indicated that a long optical fiber provides high sensitivity.
In addition, we propose using a flexible multimode waveguide for high-speed transmission. We demonstrated that a highly flexible multimode waveguide implemented on an electronic printed circuit board (PCB) can be used in folded-type applications. An optical interconnection using polymer waveguides on an optical and electronic printed circuit board (OEPCB) was designed and fabricated to achieve low optical propagation loss and a high-speed data rate. The optical flexible waveguides were fabricated using the roll-to-roll lamination method. To achieve a simple fabrication process and high position accuracy, the polymer waveguides were forming 45° reflective mirrors using dicing approach and followed by the e-beam deposition for 90° beam turning. To simplify the fabrication process, laser-to-waveguide and waveguide-to-detector coupling were implemented using the total internal reflection (TIR) method. A transmission rate of up to 12.5 Gb/s and an optical propagation loss of 0.1 dB/cm were produced using the board-embedded flexible polymer waveguide. The additional optical loss of 0.3 dB was experimentally shown on the 2-mm bending radius and 180° curvature angle.
Because of the advantageous effects of silicon material on transparency in telecommunication wavelengths, complementary metal–oxide–semiconductor (CMOS)-compatible processing, and the high index contrast for a small footprint, the silicon-on-insulator (SOI) platform has attracted increasing attention for processing photonic integrated circuits in a massive electronics fabrication infrastructure. We developed the use of SOI photonic wire microring resonators, which use a multimode interference (MMI) coupler between the ring and waveguides. The MMI coupler exhibited a wide operating wavelength and high fabrication tolerance for maintaining insensitivity MMI-coupled ring resonator. The MMI-coupled ring resonator was designed and fabricated with a circumference of 110 μm and a stable quality factor of 1199 across a wide range of wavelengths. The use of a tunable microwave phase shifter (a tunable phase shift range of 350°) based on a wavelength-tuning SOI microring resonator, which can be tuned using a tunable laser source (TLS).
Based on the rapid development of silicon and polymer waveguide transmissions, a concept of unidirectional interconnection between silicon and polymer waveguides is proposed in this study. The concept of combining flexible polymeric waveguide links with CMOS-compatible silicon waveguides is also proposed for next-generation applications.

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