本論文探討連接器的電氣特性，包含阻抗、介入損失和回波損失。研究目的是以時域反射儀及網路分析儀量測的結果來了解電磁模擬軟體分析結果的準確性。
由實驗和分析結果的比較得知，在時域的部分，模擬及實際量測之差動阻抗吻合度佳；而頻域的部分，在介入損失方面，比較模擬及實際量測介入損失相對低點的位置及大小，整體趨勢相近吻合度高。在回波損失方面，比較模擬及實際量測回波損失的尖點位置及大小，其整體曲線的趨勢吻合度亦很高。另外本研究使用IConnect軟體換算時域反射儀所量到之電壓曲線得到回波損失曲線，和網路分析儀所量測之回波損失曲線作比較，得知使用IConnect軟體模擬回波損失，在0.5 ~ 3 GHZ的範圍內準確度甚高。最後針對修改連接器設計的分析結果得知，欲得到via附近較佳阻抗匹配的設計，則其結構強度就會降低，故這樣的修改並非可行。而對於antipad的研究，經由模擬分析及實際量測的結果得知，適當應用antipad確實能夠獲得較佳的阻抗匹配度。
由論文研究結果可以了解電磁模擬軟體所分析連接器電氣特性結果的準確度很高。因此開發連接器產品時，根據所設計的幾何結構和材料特性，使用電磁模擬軟體進行分析和修改直到符合規格，如此可以節省設計變更所衍生的成本。

The electrical characteristics of a connector, which include impedance, insertion loss, and return loss, can greatly affect its performance as the signal speed increases. The objective of this research is to understand the discrepancy between the simulation and experimental results, so that a more accurate prediction of the electrical characteristics of a connector can be made during the design phase.

It was discovered that in both the time and frequency domain the simulation results were consistent with the experimental results. Given these conclusions the simulation model was modified to improve the impedance mismatch with the connector. It was found that by properly designing the antipads the impedance mismatch can be reduced.

[1] http://zh.wikipedia.org/w/index.php?title=%E5%9F%83%E5%B0%BC%E9%98%BF%E5%85%8B&variant=zh-tw.
[2] http://www.intel.com/technology/mooreslaw/index.htm.
[3] 馮輝舜, "高頻電子連接器之電磁模擬與特性量測," 國立成功大學機械工程系碩士論文, 2002.
[4] M. I. Montrose, "Right angle corners on printed circuit board traces, time and frequency domain analysis," Electromagnetic Compatibility, 1999 International Symposium on, 1999, pp. 638-641.
[5] A. C. Scogna and M. Schauer, "Stripline Simulation Model with Tapered Cross Section and Conductor Surface Profile," Electromagnetic Compatibility, 2007. EMC 2007. IEEE International Symposium on, 2007, pp. 1-5.
[6] R. L. Eisenhart, "A Better Microstrip Connector," Microwave Symposium Digest, MTT-S International, 1978, pp. 318-320.
[7] 曾理彬, "高頻結構之電磁模擬與電路模型及其應用," 國立成功大學電腦與通訊工程研究所碩士論文, 2005.
[8] S. Pannala, C. Nguyen, and M. Swaminathan, "Extraction of electrical parameters of high density connectors using time domain measurements," Electronic Components and Technology Conference, 1997. Proceedings., 47th, 1997, pp. 936-941.
[9] 郭俊志, "以時域方法擷取三導體高速數位互連結構之等效模型," 國立中山大學電機工程研究所碩士論文, 2001.

[10] K. Chia-Hsiung, T. Chun-Chieh, L. Fong-Ming, and A. M.-F. L. Mao-Fu Lai, "A better technique using multisegment modeling and analysis of high-density and high-speed connectors," Advanced Packaging, IEEE Transactions on [see also Components, Packaging and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on], vol. 29, pp. 140-148, 2006.
[11] M. S. Zhang, Y. S. Li, L. P. Li, and C. A. J. C. Jia, "Modeling and Analyzing High-Speed and High-Density Connectors by Using Multisegment Multiple Transmission Lines Model," Advanced Packaging, IEEE Transactions on [see also Components, Packaging and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on], vol. 31, pp. 203-210, 2008.
[12] 芮綺穗, "HDMI高速接頭之模型建立與分析," 大同大學通訊工程研究所碩士論文, 2006.
[13] 彭美瑾, "HDMI接頭之特性分析," 大同大學通訊工程研究所碩士論文, 2007.
[14] TDR Impedance Measurement: A Foundation for Signal Integrity, Tektronix application note 55W-14601.
[15] Network Analyzer E507C RF: Agilent Technologies, Electronic Measurements Group Customer Education.
[16] R. S. Mroczkowski, Electronic Connector Handbook: McGRAW-HILL.
[17] "AirMax連接器測試報告 " http://portal.fciconnect.com/Comergent/fci/documentation/950535-015_AIRMAX_SI_brochure.pdf, .