在不考慮光學透鏡、反射杯及驅動電路等零件因素影響條件下，本研究以不同LED模組及燈杯表面散熱面積組成之MR16-Compatible LED燈泡，在改變額定輸入電流條件下，研究其電壓、光通量、色溫、演色性、溫度等數值變化情形。
實驗結果顯示MR16-Compatible LED燈泡之溫度在點亮30分鐘後趨於穩態。LED工作電流與工作溫度是影響LED發光特性主要因素，LED工作電流增加影響LED電壓上升，LED光通量上升，LED色溫值上升，LED演色性上升。LED工作溫度上升影響LED電壓下降，LED光通量下降，LED色溫值上升，LED演色性上升。
MR16-Compatible LED燈杯材料雖為同一材質，但經由熱傳導溫度差的實驗結果發現，燈杯熱傳導係數不一樣。燈杯表面散熱面積比例差異僅7%，無法明顯觀察出散熱上的差異。MR16-Compatible LED燈泡之對流熱傳遞係數隨功率大小而改變，在功率高時溫度高，溫度差大，有較大的對流熱傳遞係數。燈杯表面散熱面積是影響MR16-Compatible LED燈泡散熱最大因素。

Ignoring the effects of optical lens, reflector, and driver, this study investigated the effects of input current on the forward voltage, luminous flux, correlated color temperature, color rendering index, and temperature of an MR16-Compatible LED lamp, using two different LED modules and two different heat sinks.
The results showed that the MR16-Compatible LED lamp reached a steady state 30 minutes after being turned on. The major factors that affected the LED Lighting characteristic were LED temperature and LED forward current. Increasing the LED forward current resulted in the increase of LED forward voltage, forward current, correlated color temperature, and color rendering index. An increase in the LED temperature caused the decrease of LED forward voltage and forward current, but the increase of LED correlated color temperature and color rendering index.
Although the same material was claimed for the two different heat sinks, the thermal conductivity values of them were different, evidenced by the dramatic difference in temperature drop in the heat sinks. The difference, as large as 7%, in the surface area of the heat sink did not cause a significant difference in the temperature drop arising from heat convection. The convective heat transfer coefficient of the heat sinks varied slightly with the LED input power, or heat sink surface temperature, with a high LED input power or a higher heat sink surface temperature yielding a higher convective heat transfer coefficient. The main factor affecting the heat dissipation of the MR16-Compatible LED lamps was the heat sink surface area.

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