本研究主要係以不同體積含量之氮化硼及混摻入不同體積含量之氮化鋁為填充材，以2,2-Bis(3-amino-4-hydroxy-phenyl)hexafluoropropane與4,4’-Oxydiphthalic Anhydride兩單體合成之聚亞醯胺為母材，製備導熱型複合材料，並探討複合材料之熱性質、微觀結構及介電性質等。
根據文獻報導，以往聚亞醯胺複合材料係以二步法方式製備複合材料，將單體混合反應形成聚醯胺酸，加入陶瓷填充材後攪拌，入模後在高溫高壓下進行脫水縮合反應，而此種製備複合材料方式無法聚合出高分子量之聚亞醯胺，因此本實驗以一步法合成可溶型聚亞醯胺，並藉由非質子溶劑於室溫下溶解聚亞醯胺，摻入導熱型填充材，製備導熱型複合材料，複合材料成膜後，無需高壓處理，且具可撓性及熱導性質。
實驗發現，氮化硼與聚亞醯胺製備之複合材料其微觀結構分析可發現填充材堆積型態對於熱傳導係數之影響，良好的堆積密度及型態可形成熱導通途徑，因此熱傳導係數提高。本研究也將氮化鋁以不同體積比摻入氮化硼/聚亞醯胺複合材料，發現氮化鋁之結構型態、粒徑等因素皆影響試片內部填充材堆積型態，導致熱傳導係數隨著氮化鋁量增加而下降。本實驗也針對不同烘乾溫度對氮化硼/聚亞醯胺複合材料之影響作探討，以氮化硼體積含量60vol%為例，將試片於160℃、200℃及250℃溫度下烘乾，發現當烘乾溫度只有160℃，由於試片內部殘留之溶劑較多，導致聲子傳遞時容易散射，當烘乾溫度到達250℃，可看到熱導係數提升3.3倍，由此結論可了解試片內部溶劑含量對熱傳係數的重要性。
本實驗成功地藉由一步法製備出低介電及熱導型填充材(氮化硼，氮化鋁)/聚亞醯胺複合材料，當氮化硼含量達60vol%時，於250℃烘乾溫度下，其熱導係數為2.33W/m．k，介電常數為3.8。

In this study, boron nitride and aluminum nitride were used as fillers with different volum ratio in the polyimide matices. The polyimide matrix was synthesized with 2,2-Bis(3-amino-4-hydroxy-phenyl)hexafluoropropane and 4,4’-Oxydiphthalic Anhydride monomers by one-step method. Microstructure and thermal and dielectic properties of the thermally conductive (BN, AlN)/PI composites were investigated.
According to the published reports, most of the ceramic filler/polyimide composites were synthesized by a two-step method, with which the filler/xxx(PAA) mixed solution was molded with pressure at 300oC. However, the problem of the two-step method is the lower molecular weight of the polymized polyimide. In our research, the matrix was synethesized by a one-step method. Our synthesized PI could be dissolved by non-proton solvents such as DMAC and THF. Our fabrication procedure of the filler/PI composite could be made without pressing. The (BN, AlN)/PI composite layers are flexible and thermal conductive.
From results of our research, the stacking states of boron nitride in composite had an effect on the thermal conductivity. With the increase in the BN volum ratio, the contact points among BN plates increase. Therefore, the thermal conductivity increase with volum ratio of BN. In this study, we also blended different ratios of AlN into BN/PI composites and investigate the effect of stack state on the thermal conductivity of composites. From SEM analyses, we can apparently found that the BN stacking was interrupted by AlN due to its irregular shapes, larger particle size etc. Therefore, a decrease of thermal conductivity with the AlN content was observed. Our 60% BN/polyimide compostes after drying at 250oC had shown thermal conductivity of 2.33 W/m•k and a dielectric constant of 3.8.

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