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Thermal issue have become one of the major concerns for three-dimensional multicore chips. In this study, we surveyed recent thermal management techniques for three-dimensional multicore chips. All representative related work are presented and compared through hardware-level thermal management and software-level thermal management. Hardware-level thermal management is focus on component floorplanning and TSV placement for hotspot distribution. Software-level thermal management apply thermal-aware task scheduling with dynamic voltage frequency scaling and dynamic power management for run-time heat dissipation. The objective of this study is to provide a broad knowledge and further insights of designing thermal-aware three-dimensional multicore chips.

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