澳洲聯邦科學暨工業研究院與德國聯邦物理技術研究院使用 Cup-type球拋機搭配氧化鋁磨料研光和粗拋與酸性的二氧化鈦拋光液精拋製出單晶矽晶球，並在2019 成為最新的國際質量原器。本研究自行設計四旋轉軸球拋機，可加工直徑50~100mm、2公斤以內的球體、最高工作壓力0.6MPa、最高轉速300rpm，和可透過化學反應產生鈍化層的研光液和拋光液進行單晶矽晶球製作。首先以三因子二水準進行研光和化學機械拋光的實驗設計，實驗因子為壓力、轉速、研光液流率，實驗球體為黃玉石和單晶矽。結果顯示，在壓力0.2 MPa、轉速100 rpm，和研光液流率150 ml/min時有最佳研光結果；於壓力0.2 MPa、轉速50 rpm，和SP4080-2拋光液流率150 ml/min時有最佳拋光品質。接著，根據實驗設計的最佳結果搭配機械力移除研光液和SP4080-2拋光液進行黃玉球加工並得到真球度5.3μm、粗糙度Sa 0.012 μm，和Sq 0.017 μm的品質；最後，搭配固相化學反應研光液與SP4080-2拋光液進行單晶矽晶球加工實驗，得到真球度2.8 μm、粗糙度Sa 6 nm，和Sq 8 nm的單晶矽晶球。在球體加工應避免易發生震動的高壓力與高轉速，且高加工液流率會有很好的加工成效。

In 2019, the new mass standard of the international system of units (SI) is to fabricate a silicon (Si) sphere by cup-type sphere polisher by adding Al2O3 abrasives and acidic titanium dioxide slurries from Commonwealth Scientific and Industrial Research Organization and Physikalisch-Technische Bundesanstalt. In this study, the Si sphere was fabricated by a self-develop 4-axis- rotation sphere polisher that can apply to the sphere under 2 kilogram and diameter of 50-100mm also have 0.6MPa of maximum pressure and 300 rpm of highest rotation, adding slurry to reactive soft-layer. First, the design of experiments (DOE) of lapping and polishing with three-factor and two-level: The factors are the pressure, the rotation speed, and the slurry rate. The material of sphere is made of topaz and Si. When the condition is under 0.2 MPa, 100 rpm, and the 150ml/min lapping slurry rate has the best lapping quality; 0.2 MPa, 50 rpm, and the 150ml/min of polishing slurry rate has the best polishing quality. Then, the topaz sphere has 5.3μm of sphericity, Sa 0.012μm, and Sq 0.017μm by combining the DOE result and traditional lapping slurry, SP4080-2 polishing slurry. The Si sphere has sphericity of 2.8μm, Sa 6nm, and Sq 8nm when DOE results combine lapping slurry with solid phase chemical reaction and SP4080-2 polishing slurry. High pressure and high speed will cause the vibration of the polisher. Better sphere quality needs to increase the slurry rate.

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