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研究生: 劉福祥
Fu-Hsiang Liu
論文名稱: 以專利分析探討深度學習之應用與發展趨勢
The Application and Development of Deep Learning with Patent Analysis
指導教授: 袁建中
Chien-Chung Yuan
口試委員: 鄭正元
Jeng-Ywan Jeng
耿筠
Yun Ken
學位類別: 碩士
Master
系所名稱: 工程學院 - 高階科技研發碩士學位學程
Executive Master of Research and Development
論文出版年: 2017
畢業學年度: 105
語文別: 中文
論文頁數: 115
中文關鍵詞: 深度學習專利類神經網路
外文關鍵詞: Deep Learning, Patent, Neural Network
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  • 人工智慧是未來科技發展的趨勢,其中的技術就是機器學習,又深度學習是機器學習最重要的分支,約三十年前就有專家提出類神經網路的概念,此後不斷地有專家投入研究,但由於運算、學習速度的限制,一直不受到重視,直到 2010 年前後GPU效能逐漸強化且普及、使得平行運算速度加快。加上現代大數據的影像、文字、數據如洪水般湧出、工業4.0 需要大量數據運算、機器人取代人力及自駕車等,在這樣各種環境及需求搭配的情況下,出現爆發性的成長。但殺手應用尚未出現,所以技術仍在萌芽的階段仍值得投入研究、找出未來趨勢及方向。
    本研究有別於傳統的方法分析新興產業,從專利管理圖中得知主要領導公司,並找出其領導公司主要發展的技術分類及技術,進行公司競爭力分析。並進行專利指標計算、探討公司各自主要發展之技術的專利品質。本研究結果可以做為新創可能投入的技術研發或創新方向。
    研究結果得知,深度學習在專利部份仍為演算法、圖形辨識、語音辨識、數據計算、醫療及量測等應用最為廣泛,但其中又以演算法、圖形辨識及語音辨識相關專利間的競爭最為激烈,可見相關應用如機器視覺、語言及語音辨識仍是各家主力發展的方向。


    Artificial intelligence is the future of scientific and technological development which the technology is machine learning. Deep Learning is the most important part of machine learning. Thirty years ago, some experts put forward the concept of neural network. Experts continue to put into research but limited by computing speed. Until 2010, GPU performance gradually enhanced and universal, making parallel computing speed. Recently big data, images, text growth fast, industrial 4.0 need robot replace the human and self-driving. In this kind of environment and demand with the circumstances, the explosive growth. But the killer application has not yet appeared, so the technology is still in the bud stage is still worthy of study to identify future trends and direction.
    This research is different from the traditional methods of analysis of new industries. This research is study from the patent management map to get the main leading companies and to identify the leading companies to develop the main technical classification and competition. Calculating patent parameters of leading company's main development to find the technology of the patent quality. The results of this research can be used as a new R & D or innovation and provide invest direction.
    The results show, deep Learning is still the most widely used in the patent. Such as algorithm, pattern recognition, speech recognition, data calculation, medical treatment and measurement. The most intense competition were pattern recognition and speech recognition. Visible applications were machine vision, natural language and voice recognition still the main direction of development.

    摘 要 Abstract 誌 謝 目錄 圖目錄 表目錄 第一章 緒論 1.1 研究背景 1.3 研究目的 1.4論文章節架構 1.5 研究流程 第二章 Deep Learning技術及產業分析 2.1 Deep Learning 定義 2.2 Deep learning 歷史 2.3 Deep learning 技術 2.3.1 技術演進史 2.3.2 常用模型 2.3.2.1監督式學習 2.3.2.1.2 Convolutional Neural Network卷積式神經網路 2.3.2.1.3 Recurrent Neural Network 遞迴式類神經網路 2.3.2.2 非監督式學習 2.3.2.2.2 Sparse Coding 稀疏編碼 2.3.2.2.3 Restricted Boltzmann Machine(RBM) 限制波爾茲曼機 2.3.2.2.4 Deep Belief Networks 深信度網路 2.4 Deep learning 市場 2.4.1市場現況 2.4.1.1 市場促進因素 2.4.1.2 市場障礙 2.4.1.3 產業概要 2.4.2 主要加入企業 2.4.3 Deep learning應用市場 2.4.3.1 農業 2.4.3.2 金融服務 2.4.3.5能源開發 第三章 研究方法 3.1 專利研究流程與架構 3.2 研究資料範圍 3.3 研究工具 3.4 公司專利指標挑選 3.4.1 專利被引證數 3.4.2 專利引證數 3.4.3 專利家族數 3.4.4 專利家族在美國數量 3.4.5 專利技術領域範圍 3.4.6 專利請求項數 第四章 研究結果 4.1 專利檢索與分析流程 4.2 專利管理圖分析 4.2.1 歷年專利件數分析 4.2.1.1 申請年與優先權年趨勢 4.2.2 專利所屬國分析 4.2.2.1 專利所屬國件數分析 4.2.2.2 歷年專利所屬國趨勢 4.2.3 技術生命週期圖分析 4.2.4 國際專利分類 (IPC) 分析 4.2.4.1主要IPC 三階 4.2.4.2 主要IPC 四階 4.2.4.3 主要IPC 五階 4.2.5 美國專利分類(USPC) 分析 4.3 專利權人分析及排行 4.3.1 Microsoft 4.3.1.1 IPC 技術分佈排行 4.3.1.2 IPC 技術雷達 4.3.1.3 TOP 3專利家族 4.3.2 Siemens 4.3.2.1 IPC 技術分佈排行 4.3.2.2 IPC 技術雷達 4.3.2.3 TOP 3 專利家族 4.3.2.4 TOP 3 被引證專利 4.3.3 IBM 4.3.3.1 IPC 技術分佈排行 4.3.3.2 IPC 技術雷達 4.3.3.3 TOP 3 專利家族 4.3.3.4 TOP 3 被引證專利 4.3.4 GE (General Electric) 4.3.4.1 IPC 技術分佈排行 4.3.4.2 IPC 技術雷達 4.3.4.3 TOP 3 專利家族 4.3.4.4 TOP 3 被引證專利 4.3.5 Google Inc. 4.3.5.1 IPC 技術分佈排行 4.3.5.2 IPC 技術雷達 4.3.5.3 TOP 3 專利家族 4.3.5.4 TOP 3 被引證專利 4.3.6 Exxon Research and Engineering Co. 4.3.6.1 IPC 技術分佈排行 4.3.6.2 IPC 技術雷達 4.3.6.3 TOP 3 專利家族 4.3.6.4 TOP 3 被引證專利 4.3.7 Sony Corporation 4.3.7.1 IPC 技術分佈排行 4.3.7.2 IPC 技術雷達 4.3.7.3 TOP 3 專利家族 4.3.7.4 TOP 3 被引證專利 4.3.8 FUJITSU LTD 4.3.8.1 IPC 技術分佈排行 4.3.8.2 IPC 技術雷達 4.3.8.3 TOP 3 專利家族 4.3.8.4 TOP 3 被引證專利 4.3.9 Samsung Electronics Co. 4.3.9.1 IPC 技術分佈排行 4.3.9.2 IPC 技術雷達 4.3.9.3 TOP 3 專利家族 4.3.9.4 TOP 3 被引證專利 4.3.10 NEC CORPORATION 4.3.10.1 IPC 技術分佈排行 4.3.10.2 IPC 技術雷達 4.3.10.3 TOP 3 專利家族 4.3.10.4 TOP 3 被引證專利 4.3.11 西安電子科技大學 4.3.11.1 IPC 技術分佈排行 4.3.11.2 IPC 技術雷達 4.3.11.3 TOP 3 專利家族 4.3.11.4 TOP 3 被引證專利 4.3.12 Baker Hughes 4.3.12.2 IPC 技術雷達 4.3.12.3 最高專利家族 4.3.12.4 最高被引證專利 4.3.13 Mitsubishi 4.3.13.1 IPC 技術分佈排行 4.3.13.2 IPC 技術雷達 4.3.13.3 最高專利家族 4.3.13.4 最高被引證專利 4.3.14 Qualcomm Incorporated 4.3.14.1 IPC 技術分佈排行 4.3.14.2 IPC 技術雷達 4.3.14.3 最高專利家族及被引證專利 4.3.15 Facebook Inc. 4.3.15.1 IPC 技術分佈排行 4.3.15.2 IPC 技術雷達 4.3.15.3 第一專利家族 4.3.15.4 第一被引證專利 4.3.16 Apple Inc. 4.3.16.1 IPC 技術分佈排行 4.3.16.2 IPC 技術雷達 4.3.16.3 最高專利家族及被引證專利 4.3.17 主要專利權人IPC 三階技術分析 4.3.18主要專利權人IPC 五階技術分析 4.3.19 主要專利權人技術落點分析 4.4 專利家族分析 4.4.1第一專利家族 4.4.2第二專利家族 4.4.3第三專利家族 4.4.4第四專利家族 4.4.5第五專利家族 4.5 領導公司專利技術強度分析 第五章 研究結論與建議 5.1 結論與管理意涵 5.2 後續研究與建議 參考文獻

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