中文摘要
隨著晶片功率不斷地提升，導致CPU所產生之廢熱不斷地提高，因此如何將CPU維持在穩定的工作溫度下，即成為本研究之重點。本研究透過數值模擬及實驗驗證方法評估散熱器設計的散熱能力，首先透過修改熱管的排列方式，使氣流更能夠接觸到每一根熱管，提高熱管的實際效率。接著在平板鰭片上添加三角形開孔產生回流現象，以增加流體與平板鰭片的接觸機會；同時，因為於鰭片開孔的關係，使因熱浮力帶動之流體經此通道往上一層間流動，來增加對流的機會。最後，藉由加裝不同朝向之渦流產生器，使流體產生縱向流動，進而增加與平板鰭片的接觸機會，最終得以提高塔式散熱器的解熱能力。
本研究也針對熱管的啟動與性能進行測試，利用不同的加熱瓦數來量測熱管的溫度變化，以確認熱管在作動過程中，是否有發生燒乾(Dry out)的現象。結果顯示，熱管在使用上，當熱源發熱瓦數較低時，將使熱管的蒸發端溫度不足，導致熱管的熱阻提高，以致於降低熱管的熱傳導係數；同時也透過數值模擬方法，調整熱管在不同溫度下之熱傳導係數，並與實驗進行比對，求得與實驗值較為接近之熱管熱傳導係數，接著利用曲線嵌合的方式，得到加熱瓦數與熱管熱傳導係數間的關係 。
經由改善熱管、平板鰭片三角形開孔與渦流產生器的擺放位置，同時針對渦流產生器之幾何外型作最佳化後，數值計算結果顯示能提高塔式散熱器的散熱能力，其熱源溫度由349.2 K降至346 K，熱阻值由0.274 K/W降至0.252 K/W。更發現無論加裝任何形式之渦流產生器，皆確實能提升塔式散熱器的散熱能力，且使用Flow Up型式的渦流產生器能提供較大的流體縱向流動，有助於平板鰭片上方的溫度均勻分布；而使用Flow Down型式的渦流產生器，則能提高整體散熱器的散熱能力。接著再配合最佳化鰭片數量設計，在47片的情況下，熱源的溫度能夠降至343.8 K、熱阻降為0.234 K/W。另外在考量噪音與風扇性能之下，搭配選擇最合適之風扇轉速，將整體塔式散熱器的性能再次提升，以47片鰭片之散熱器搭配2,500 RPM的風扇(3.48 mmAq與86.9 CFM)，更可將熱源溫度降至326.6 K。而實驗量測求得的溫度為327.4℃，與計算值的差異為0.8℃；至於熱阻則降為0.123 ℃/W，與實驗量測的熱阻值(0.129℃/W) 比較兩者之差異為4.65%。總結來說，本研究所建立之結合數值模擬、CNC實體製作與實驗驗證的研發設計模式，能幫助解決塔式散熱器在應用上所遇到之設計問題，並提供設計之方向與依據。

Abstract
This study combines numerical simulation and experimental technique to investigate the cooling characteristic of a bracket-type heat-sink assembly for ensuring CPU operating under the critical temperature. At first, numerical visualizations on the thermal/fluid fields are used to justify the physical mechanisms inducing an excessive temperature rise. Then, several alternatives are proposed to enhance the cooling capacity of the heat sink assembly. They are the adjustment on heat-pipe arrangement to increase its contact opportunity with cooling airstream, and the addition of holes on fin surface to generate the possible heat/flow recirculation between two adjacent fin passages for a better convective heat transfer. Furthermore, two types of vortex generators (flow down and flow up) are evaluated and installed to create a longitudinally perturbed flow to increase the heat dissipation capability of bracket-type heat assembly.
As a result, with the appropriate heat-pipe arrangement, triangular holes, and location of vortex generators, the heat dissipation ability of bracket-type heat sink assembly is improved obviously. The CPU temperature is reduced from 349.2K to 346K and the thermal resistance of thermal module is improved from 0.274 to 0.252 K/W. Also, a more uniform temperature distribution is identified with the aids of longitudinal airflow generated by mounting the flow-up vortex generator. And the cooling capacity of heat sink assembly is enhanced since the fluid is guided to the heat-concentrated area when the flow-down vortex generators are adopted. Moreover, the optimum fin number (47) is found to decrease CPU temperature and thermal resistance further to 343.8K and 0.234 K/W, respectively.
Thereafter, considering the limitations of fan noise, the proper fan operating at 2,500RPM is selected to produce the fan performance (3.48 mm-Aq, 86.9 CFM). Also, the calculations on CPU temperature and thermal resistance are obtained as 326.61K and 0.123 K/W, which are correlated well with the experimental results (327.4K and 0.129 oC /W) . The error percentage between numerical and experimental results on the thermal resistance is 4.65% and on the CPU temperature is 0.8 oC. In conclusion, this rigorous and systematic design scheme for bracket-type heat sink assembly is successfully established for designing the new and effective thermal module.

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