銲料在電子構裝中扮演著相當重要的角色，主要使用於電子元件與其電路板之間的連接，並能傳遞其訊息。因先前文獻多半單獨研究無鉛銲料與Cu金屬之界面反應，為了與文獻研究相比較以及兼顧前瞻性，本研究致力於無鉛焊料 Sn, Sn-3 wt.%Ag- 0.5 wt.% Cu (SAC), Sn-0.7 wt.% Cu (SC)與 Cu-Ti合金(C1990HP)之固/固界面反應，C1990HP組成為Cu-(2.9-3.5)wt.%微量添加(2.9-3.5%)的Ti可以增加其合金的可銲性，同時C1990HP銅鈦合金具有強度高，可彎折性好的優點，具有與銅鈹合金相似的機械性質。研究中主要探討了固/固反應下界面中生成介金屬間化合物(intermetallic compound，IMC)的機制與生長動力學。
實驗方法為首先將Cu-Ti合金(C1990HP)與0.7g的Sn、SAC和SC焊料在240 ˚C下反應15s形成反應偶，再將反應偶分別置於125、150和175 ˚C的烘箱內，固/固反應100、200、500、1000、2000h，並利用光學顯微鏡(Opitcal Microscope, OM)、熱燈絲掃描電子顯微鏡(Scanning Electron Microscope, SEM)確認界面處所生成的介金屬相的顯微結構，另外使用能量散射光譜儀(Energy-dispersive X-ray spectroscopy, EDS)對界面處之介金屬相進行定性半定量分析，並利用電子探針顯微分析(Electron Probe Microanalyzer, EPMA)對介金屬相進行定量分析，確定各個介金屬相之組成。
在本實驗中發現Ti的添加抑制了Cu3Sn層的出現，並且促進了Cu¬¬6Sn5相的成長，同時在175 ˚C下C1990HP與Sn和SAC的反應中出現了非常不同的IMC成長現象。

Solder played a very important role in electronic packaging industry, commonly used for connected between electronic components or circuit board. Previous literatures usually focus on the interfacial reactions between lead-free solders and Cu-based alloys, in order to compared with previous literatures and forward looking, this research concentrated on the solid-solid interfacial reactions between three lead-free solders Sn, Sn-3wt.%Ag- 0.5wt.% Cu (SAC), Sn-0.7wt.% Cu (SC) and Cu-Ti alloy(C1990HP). The component of C1990HP is Cu-(2.9-3.5)wt.% Ti, a bit of added Ti can enhance the weldability of substrate, and the C1990HP has high strength and commendable mechanical property as same as Cu-Be alloy. In this research, the growth mechanism and growth dynamics of intermetallic compound(IMC) growth at interfacial of solid-solid reactions were studied.
We used C1990HP reaction with Sn, SAC and SC solders at 240˚C with 15s to form the reaction couples. Then, put the couples into oven with temperature of 125, 150 and 175˚C for 100, 200, 500, 1000 and 2000h solid-solid reaction. After reaction, we used OM(Optical Microscope) and SEM(Scanning Electron Microscope) to discuss the morphology of interfacial. And EDS(Energy-dispersive X-ray spectroscopy,) and EPMA(Electron Probe Microanalyzer) are ueds to comfirm the components of each intermetallic compounds.
The results shows that the added of Titanium inhibit the growth of Cu3Sn, meanwhile promote the growth of Cu6Sn5, and with the reaction temperature of 175 ˚C , the growth types of IMCs in Sn and SAC couples are very different with the Sn/Cu couples.

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