使用離子高分子(PEL)藉由同時式聚合反應的方式與環氧樹脂進行摻合，藉以改善環氧樹脂之脆性，經由實驗探討PEL對環氧樹脂的韌化機構，且經由TGA及DMA探討其相容性。
結果可得知，抗張強度隨PEL的含量增加而增加，當PEL含量高達30PHR時，伸長率急遽增加，由於純PEL與環氧樹脂間不產生化學鍵，造成其交聯結構上的缺陷。
由TGA及DMA的實驗結果可得知，環氧樹脂與PEL的相容性會隨著PEL的含量增加而獲得改善，是由於PEL帶有Li+CLO4-之電荷，產生離子鍵而改善其相容性。
由導電性實驗可得知，環氧樹脂系統會隨著PEL含量的增加而導電係數增加，當PEL含量達20PHR時，導電度明顯增加。

The polypropylene oxide-polyethylene oxide copolymer (PEL) and epoxy resin were blended by the method of simultaneous polymerization. It was exploring the toughened mechanism of the PEL-Epoxy resin with some tests. The compatibility of the blend system was discussed by TGA and DMA.
In the results, the tensile strength would be promoted with increasing the PEL content. While the PEL content was 30PHR, the elongation ratio would go to a maximum. Because that there was not any chemical bond between the pure PEL and Epoxy resin. This made the flaws in cross-linking structure.
According to the analytic of DMA and TGA, the compatibility between the epoxy resin and PEL would be improved with increasing the PEL. It was due to the PEL which brought the ionic Li+CLO4- charge which could produce ionic bond and improve compatibility.
With the analytic of conductivity, the electric conductivity coefficient between the epoxy resin and PEL would be improved with increasing the PEL. While the PEL content was 20PHR, the electric conductivity coefficient would go to a maximum.

1. S. C. Chen , H.T. Chiu , C. P. Ye, J. Appl. Polym. Sci., 86, ,3740(2002)
2. L. S. Penn and T. T. Chiao in “Hand book of Composites”, Georage Lubin, Eds’., Van Nostrand Reinhold Co., New York, Chapter 5,(1982)
3. S. Rimdusit, S. Pirstpindvong, W. Tanthapanichakoon, S. Damrongsakkul, Polym. Eng. Sci., (2005), 288
4. H. T. Chiu, J. H. Wu, J. Appl. Polym. Sci., 98, 1206(2005)
5. H. Okamura, K. Shin, M. Tsunooka, M. Shirai, J. polym. sci., A, Polym. chem., 42, 3685(2004)
6. P. R. Scarito, L.G. Sperling, Poly Eng and Sci., 19, 297(1970)
7. Sultan etc Ploym. Eng. and Sci., 13(1). 29 (1973)
8. R. A. Islam, Y. C. Chan, Microelectronics Reliability, 44, 815(2004)
9. Y. Tajitsu, J. mater. sci. lett., 20, 1159(2001)
10. E. Butta, G. Lerita, A. Marchetti, A. Lazzeri, Morphology and Mechanical Properties of Amine-Terminated Butadiene-Acry lonitrile/Epoxy Blends, Poly. Eng. Sci., 26, 63 (1986)
11. Progelhog, R. C., J. L Throne Ploy Eng Sci., 18, ,951(1975)
12. Gillhan, JK., J. A. Bemci, J. Appl. Polym. Sci., 18,, 95(1974)
13. D. E. Feton, J. M. Parke, P. V. Right, 103, 4745. (1995)
14. C. K. Chiang, Polymer Commun., 22, 1454 (1981)
15.A. Hooper, J. M. North, Solid State Ionics, 9&10, 1161 (1983)
16. M. Gauthier, D. Fauteux, G. Vassort, A. Belanger, M. Duval, P. Ricoux, J. M. Chabagno, D. Muller, P. Rigaud, M. B. Armand, D. Deroo, This Journal, 132, 1333(1985)
17. T. A. Skotheim, O. Inganas, ibid., 132, 2116(1985)
18. K. M. Abraham, M. Alamgir, S. J. Perrotti, ibid., 135, 535(1988)
19. K. West, B. Zachau-Christiansen, T. Jacobsen, S. Atlung, ibid., 132, 3061 (1985)
20.W. Thongruang, R. J. Spontak, C. M.Balik, Polymer, 43, 3717(2002)
21.T. Tanaka, “Proceedings of The International Pressure Sensitive Adhesive Technoforum”, Japan, (1997) p.143
22. Kevin P. Menard,” Dynamic Mechanical Analysis” (1998)
23. B.B. Johnsen, A.J. Kinloch, A.C. Taylor, Polymer, 46, 7352–7369(2005)
24. J.K. Kocsis, O. Gryshchuk, Macromol., Symp., 217, 317-328(2004)