本論文利用電弧熔融配製鐵-鎳-錫合金，探討其三元系統的相平衡，並使用液/固反應偶之技術，觀察錫/鐵-鎳合金之界面反應。實驗結果顯示，鐵-鎳-錫三元系統在270℃的等溫截面圖中，存在8個三相區、17個兩相區、以及10個單相區，並且無三元的介金屬相生成。而界面反應部分，其實驗結果顯示出Sn/Alloy 42反應後會生成兩層不同形態的FeSn2¬介金屬層︰靠近基材端為細針狀連續層，而靠近銲料端為針狀、塊狀層。而當基材Ni含量小於80 at.%時，Sn/Fe-Ni僅會在界面生成FeSn2的介金屬層。而當Ni含量介於80 at.% ~ 90 at.%時，界面則會生成FeSn2及Ni3Sn4兩種不同的相， IMC成長迅速。當基材Ni含量提升至95 at.%以上時，介金屬層僅生成Ni3Sn4相，並不隨著反應時間的增長而改變。
對界面反應所生成的厚度與反應時間的關係作圖，可得知在反應10小時以前，Sn/Alloy 42與Sn/Fe-60 at.% Ni之反應偶之n值約為0.5，其遵守拋物線定率，故反應機制為擴散控制；而Sn/Fe-80 at.% Ni、Sn/Fe-85 at.% Ni、Sn/Fe-90 at.% Ni、Sn/Fe-95 at.% Ni之反應偶之n值約為1，為厚度成長迅速的界面反應控制。將反應拉長至100小時後，Sn/Alloy 42之n值下降至0.18並且呈兩段式線性成長，而Sn/Fe-60 at.% Ni之n值仍為0.5，厚度成長為所有組成中最緩慢，而其他剩餘組成之反應偶則是保持n值約為1的擴散控制成長，至100小時反應後仍不改變其成長機制。
Sn/Alloy 42、Sn/Fe-80 at.% Ni、以及Sn/Fe-95 at.% Ni之反應偶於270℃下長時效反應，利用線性掃描，配合界面組成與擴散距離之關係圖，繪製其反應路徑繪製於270℃鐵-鎳-錫等溫三相圖中，其銲料至基材之反應路徑依反應偶分別為: Sn/FeSn2/Alloy 42、Sn/Sn+FeSn2/Ni3Sn4/ Fe-80 at.% Ni與Sn/Ni3Sn4/Fe-95 at.% Ni。

In this research, we used arc melting to mix up Fe-Ni-Sn alloys and discussed phase equillibria of the ternary phase; and further, we used liquid/solid reaction couples to investigate the interfacial reaction between tin and iron-nickel alloys. The experiment indicated that isothermal section of the Fe-Ni-Sn ternary system at 270℃ had eight three-phase regions, seventeen two-phase regions, ten one-phase regions and without any ternary coupound. In interfacial reactions section, Sn/Alloy 42 couple would form into two different IMC structures of FeSn2: the layer closed to the substrate was continuous niddles and that is near Sn solder side contained niddle and pillar shaped structure. When Fe-Ni substrate contained less then 80 at.%, Sn/Fe-Ni only formed FeSn2 phase in the interface. When Ni composition is between 80 at.% and 90 at.%, the FeSn2 and Ni3Sn4 phases were formed in the interface and the overall IMC thickness is enormous. When Ni contents of Fe-Ni substrate increased up to 95 at.%, the IMC turned to be the Ni3Sn4 phase only even after a long reaction time.
By ploting IMC thickness to reaction time diagrams, we know that before reaction time for 10 hrs, the n value of Sn/Alloy 42 and Sn/Fe-60 at.%Ni couples were about 0.5 and obeyed parabolic law, which is diffusion-controlled. The n value of the Sn/Fe-80 at.%Ni, Sn/Fe-85 at.%Ni, Sn/Fe-90 at.%Ni, and Sn/Fe-95 at.%Ni couples were 1, which is reaction-controlled. When reaction time increased to 100 hrs, the n value of Sn/Alloy 42 decreased to 0.18 and presented two-step linear growth. Sn/Fe-60 at.%Ni had the same n value and the formation of the IMC was the slowest. Others n values remained 1 and did not change the kinetics of growth.
By using line-scan of Sn/Alloy 42, Sn/Fe-80 at.%Ni, and Sn/Fe-95 at.%Ni long-time reaction couples in 270℃,we can plot the diffusion distance to the composition diagrams and use these data to depict reaction path to Fe-Ni-Sn ternary phase diagram in 270℃. The reaction path from solder to substrate were: Sn/FeSn2/Alloy 42, Sn/Sn+FeSn2/Ni3Sn4/ Fe-80 at.%Ni, and Sn/Ni3Sn4/Fe-95 at.%Ni, respectively.

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