本文提出以微聚焦線型雷射為主動光源結合三角量測原理發展的扇形雷射光束掃瞄量測系統，經過適當的校正後可用來量測工件的表面粗糙度與三維輪廓。量測系統主要包括微聚焦線型雷射、CCD攝影機與鏡頭、四軸移動機台、一部個人電腦及控制量測程式等。根據散射原理得知，可由影像上掃描線的平均寬度評估工件的粗糙度；利用不同高度塊規之校驗結果，可由計算工件與基準平面掃瞄線中心偏移量求出高度值。若工件表面為平整面，則可同時量測其表面粗糙度與平面度。
以本系統進行實例應用，在塑膠射出成型板材粗糙度與平面度檢測中，以表面粗度儀校驗粗糙度量測結果，誤差為0.033μm；以三次元量測儀校驗平面度量測結果，誤差為7μm。在BGA錫球的共面度檢測中，所量得的共面度為0.1274mm，也可經由量測結果得知BGA的缺銲情況。

A sectorial laser beam scanning measuring system based on the triangulation principle was developed in this study, to measure the surface roughness and the workpiece profile after a suitable calibration. The developed system mainly consists of a micro-focus sectorial line laser, an image processing system, a PC-based 3-axis machine, and a PC. According to the scattering theorem, a correlation was investigated between the surface roughness of the workpiece measured with a precision stylus instrument and the average fringe line width projected onto the workpiece surface. The height value of the object can be calculated, based on the offset between the position projected onto the object and the position projected onto platform after carrying out the calibration with gauge blocks. For a workpiece with flat surface, its surface roughness and flatness can be determined simultaneously.
The developed system was applied to measure the surface roughness and flatness of a plastic sheet. The surface roughness deviation between the measurement using the developed system and that of a stylus surface roughness measurement instrument was about 0.033 μm. The flatness error deviation between the measurement using the developed system and that of a coordinate measuring machine was about 7 μm. The co-planarity of a BGA socket can also be measured by the developed system, the measured result was about 0.1274 mm. In addition, the position related to the lack of the solder ball could also be detected by the developed system.

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