研究生: |
陳易宏 Yi-Hung Chen |
---|---|
論文名稱: |
導入CMP領域知識之工程專利知識庫與專利分析檢索技術之初步研究 Preliminary Research of CMP Knowledge-implemented Project Patent Knowledge Base and Patent Analytic Search Technology |
指導教授: |
林榮慶
Zone-Ching Lin |
口試委員: |
許覺良
none 張瑞芬 none |
學位類別: |
碩士 Master |
系所名稱: |
工程學院 - 機械工程系 Department of Mechanical Engineering |
論文出版年: | 2005 |
畢業學年度: | 93 |
語文別: | 中文 |
論文頁數: | 170 |
中文關鍵詞: | 專利資料庫 、專利分析 、關鍵字 、專利檢索 、化學機械拋光 、拋光墊 |
外文關鍵詞: | Keywords, Patent, CMP, Polishing Pad |
相關次數: | 點閱:535 下載:3 |
分享至: |
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根據世界智慧財產權組織(WIPO)統計報導,善加利用專利資訊,可以縮短研發時間60%,節省研發經費40%,專利資訊既是技術文件,也是法律文件(權力文件),根據統計,產業界的KNOW-HOW,百分之八十以上來自專利資訊。故本文可充分利用專利資訊並結合專利分析與檢索功能來作為機械產品領域之研發參考。
本研究初期利用專利分析軟體,針對化學機械拋光(CMP)研磨墊之專利進行專利件數、國家別、公司別、發明人、引證率與IPC等詳細之專利分析,藉以瞭解CMP研磨墊技術發展之趨勢。
藉由後續之專利檢索與設計、製造、材料、形狀、結構與應用等相關領域之分析結果後得知CMP研磨墊溝槽花紋形貌屬於設計領域之專利居多,故可從設計方面切入較為容易,作為其研發之切入點。並深入探討發現,大部分之CMP研磨墊花紋溝槽設計皆為強調其具有之功能性與如何搭配適當之製程參數和新穎性之溝槽設計來控制晶圓之移除率與提升均勻度。
本文初步建立了CMP研磨墊工程專利知識庫與本體語意架構,透過下達關鍵字與IPC索引系統來針對專利文件作檢索,並且建立了專業關鍵詞彙資料庫來進行專利分析。期望藉由透過適當之關鍵字與配合IPC分類之索引來提升專利搜尋上之精確度與完整性,可避免因用字不當而造成專利搜尋上之遺漏。
According to the statistical report of The World Intellectual Property Organization (WIPO), an effective use of patent information can reduce the time for research and development (R&D) by 60% and save its cost by 40%. Patent information is both a technical and legal document (power document). Research statistics reveal that over 80% of the know-how of industries comes from patent information. Thus, this paper fully utilizes the patent information together with the combination of patent analysis and search function, so as to serve as a reference for the R&D of mechanical products.
By using patent analysis software in the first stage, this study focuses on the patent of chemical mechanical polishing (CMP) pad to conduct detailed patent analysis of the number of patents, countries, companies, inventors, citation rate and IPC etc., so as to learn the development trend of CMP pad technology.
From the related analytic results of the subsequent patent search and design, manufacturing, materials, shape, structure and application, it is known that the slot pattern of CMP pad is more belonging to the patent of design area. Thus, it is easier to start its R&D from the aspect of design. After in-depth investigation, it is found that most of the slot designs of CMP pad stress their functions and how they coordinate with appropriate process parameters and innovated slot designs to control the removal rate of wafers and promote the evenness.
This paper firstly builds a CMP pad project patent knowledgebase and an ontological semantic structure. Through the keywords entered and the IPC search system, this paper exercises the search of patent documents and establishes a database of professional keywords to conduct patent analysis. It is hoped that through appropriate keywords, as well as the search on IPC classification, the accuracy and completeness of patent search can be promoted, and the omission caused by the use of wrong keywords during patent search can be avoided.
【1】林聖富,"專利資訊和專利檢索",智慧財產權管理季刊,1996年7月。
【2】謝寶煖,"專利與專利資訊檢索",大學圖書館,2卷4期,民國87年10月,pp.111-127。
【3】"中華民國專利法"。http://www.apipa.org.tw/
【4】姚志民,"善用專利資源與網路專利查詢",高速計算世界,民國86年。
【5】陳達仁、黃慕萱著,"專利資訊與專利檢索",台北市,文華圖書館管理,民國91年初版。
【6】"專利地圖之應用時機",工業技術研究院,工業材料研究所,1992年。
【7】淺談專利地圖,工研院電通所法務智權園地,http://www.ccl.itri.org.tw/products/patent/patent_main.htm
【8】陳瑞田,"創新性之專利迴避設計",機械工業雜誌,民國87年2月號。
【9】孫美君,"數位內容產業之專利趨勢分析",連穎科技股份有限公司。
【10】賴榮哲,"專利分析總論",翰蘆圖書,民91。
【11】王大元,"美國專利兩種途徑檢索比較",情報雜誌,2001年第3期。
【12】林秀英,"從技術專利指標探索全球技術競爭力",臺灣經濟研究月刊,第二十卷第九期86年9月。
【13】PatentGuider 1.0系統使用手冊,連穎科技。
【14】陳達仁,"各國專利公報比較之研究",圖書與資訊學刊,第45期,民國92年,pp.24-36。
【15】賴奎魁、張瑩珠、鄭伶如, 1999,"建立專利策略群組模式之研究",第853-867頁,1999全國智慧財產權研討會,1999,國立交通大學企業法律中心。
【16】陳順榮,"化學機械拋光研磨墊知識庫建立與專利產出之研究",國立台灣科技大學機械工程學系碩士論文,民國93年。
【17】莊達人,"VLSI製造技術",高立圖書有限公司,民國90年。
【18】賴哲雄、潘文玨等人,"補償式化學機械晶圓研磨之方法及裝置",中華民國專利,專利字號536752,民國90年。
【19】許厲生、徐振貴、陳炤彰,"矽晶圓拋光平坦化加工技術",機械月刊,二十九卷第七期,pp.50-62。
【20】陳昇照,"銅晶圓化學機械研磨研磨墊花樣對研漿流場以及研磨效果之理論建立與實驗驗證",國立成功大學機械工程學系,碩士論文,民國92年。
【21】林明獻,"矽晶圓半導體材料技術",全華科技圖書股份有限公司,89年3月再版。
【22】何碩洋,"化學機械拋光中拋光墊修整參數影響之研究",國立清華大學動力機械工程學系,碩士論文,民國91年。
【23】簡志偉,"平面研光加工路徑分析研究",淡江大學,機械工程學系,民國88年。
【24】"專利審查基準",台北市經濟部中央標準局,民國85年。
【25】張淙亮、梁高榮,"利用爪哇技術建立檔案轉移服務",機械工業雜誌,254期,頁215-223,民93。
【26】賴佳宏,"薄膜電晶體液晶顯示器(TFT-LCD)產業之技術發展趨勢研究,中原大學企業管理學系,碩士論文,民國92年。
【27】曾元顯(1998),"模糊搜尋、相關詞提示與相關詞回饋在OPAC系統中的成效評估",中國圖書館學會會報,第61期,頁103-125。
【28】顧值豪,"跨網站式XML購物引擎之建構-以手機選購為例",大業大學資訊管理學系,碩士論文,民國90年。
【29】蘇豐文,"專利文件語意結構擷取系統",清大,http://140.114.78.38/patent/.
【30】"Patent information,"
http://www.european-patent office.org/patinfopro/index.htm.
【31】"Some Basic Information,"
http://www.european-patent-office.org/patinfopro/index_moreinfo.htm. (23 Nov. 1998).
【32】引證美國專利(公開)號" US6685548、US5690540、US5842910、US6585579、(20030034131)、(20040058630)、(20050090187)、(20050106878)、(20050107009)、US6273806. "。
【33】Brockhoff, K., Chakrabarti, A. K. and Hauschildt, J. (eds), "Evaluation of Dynamic Technological Developments by Means of Patent Data," The Dynamics of Innovation: Strategic and Managerial Implications, 1999, S107-132.
【34】Bunge, M. "Ontology I:The Furniture of the World," Treatise on Basic Philosophy, Vol. 3, 1977.
【35】Guarino, N. "Formal Ontology and Information Systems," Formal Ontology in Information Systems, Proceedings of the 1st International Conference, pp. 3-15,1998.
【36】The Information Mapping project of CSLI research group at Stanford University, under the direction of Stanley Peters. http://godel.stanford.edu/twiki/bin/view/Public/WebHome
【37】Stephane Zrehen; Michael A. Arbib, "Understanding Jokes: A Neural Approach to Content-Based Information Retrieval," In Proceedings of the second international conference on Autonomous agents, May, 1998.
【38】Shinkai, D.; Yoshida, T.; Nishida, S. "Complement Keywords for Query toward Efficient Information Retrieval," Department of Systems and Human Science, 1999.
【39】Gerard Salton, "Automatic Text Processing: The Transformation, Analysis, and Retrieval of Information by Computer," Addison-Wesley Series In Computer Science, pp. 530, 1989.
【40】Anders Bruun, "Development of the IPC as a search tool," World Patent Information, pp. 97-100, 1999.
【41】Michelle Lyon, "Language related problems in the IPC and search systems using natural language," World Patent Information, pp. 89-95, 1999.
【42】Ganali G. "Patent information services on the Internet: threat or valuable resource for information centres? " The Italian experience, World Patent Information, pp. 5-12, 2000.
【43】Schellner I. "Sources of Japanese patent information," World Patent Information, pp.149-156, 2001.
【44】F. W. Preston, "Theory and Design of Plate Glass Polishing Machines," J. Soc. Glass Technology, Vol. 11, pp. 214-256, 1927.
【45】T. K. Yu, C. C. Yu, M. Orlowski, "A statistical polishing pad model for chemical mechanical polish," in IEDM Tech. Dig, pp.865-868, 1993.
【46】T. K. Yu, C. Chris and M. O. Lee, "Combined Asperity Contact and Fluid Flow Model for Chemical Mechanical Polishing," IEEE, pp.29-34, 1994.
【47】M. M. Razzzaque, T. Kato, "Effects of a groove on the behavior of a squeeze film between a grooved and a plain rotating annular disk," ASME Journal of Tribology, Vol.121, pp.808-815, 1999.
【48】F. B. Kaufman, et al, "Chemical-Mechanical Polishing for Fabricating Patterned W Metal Features as Chip Interconnects," The Electrochemical Society, Inc, No.11, Nov.1991, pp.3460-3465.
【49】H. Liang, F. Kaufman, R. Sevilla, S. Anjur, "Wear Phenomena in Chemical Mechanical Polishing," Wear, Vol.211, 1997, pp.271-279.
【50】D. Zeidler, Z. Stavreva, M. Plotner, K. Drescher, "Characterization of Cu chemical mechanical polishing by electrochemical investigations," Microelectronic Engineering, Vol.33, 1997, pp.259-265.
【51】Viet H. Nguyen, Roel Daamen, Romano Hoofman, "Impact of different slurry and polishing pad choices on the planarization efficiency of a copper CMP process," Microelectronic Engineering, pp.95-99, 2004.
【52】Doy TK, Seshimo K, Suzuki K, Philipossian A, Kinoshita M, "Impact of Novel Pad Groove Designs on Removal Rate and Uniformity of Dielectric and Copper CMP," Journal of The Electrochemical Society, pp.G196-G199, 2004.
【53】D. Rosales-Yeomans, T. Doi, M. Kinoshita, and A. Philipossian, "Effect of Pad Groove Designs on the Frictional and Removal Rate Characteristics of ILD CMP," Journal of The Electrochemical Society, pp.G62-G67, 2005.