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研究生: 林浩暐
Hao-Wei Lin
論文名稱: 內建分散分析改善嵌入式記憶體良率
Built-In Scrambling Analysis for Yield Enhancement of Embedded Memories
指導教授: 呂學坤
Shyue-Kung Lu
口試委員: 黃錫瑜
Shi-Yu Huang
張慶元
Tsin-Yuan Chang
李進福
Jin-Fu Li
方劭云
Shao-Yun Fang
學位類別: 碩士
Master
系所名稱: 電資學院 - 電機工程系
Department of Electrical Engineering
論文出版年: 2015
畢業學年度: 103
語文別: 中文
論文頁數: 101
中文關鍵詞: 記憶體良率故障分析修復
外文關鍵詞: memory, yield, fault diagnosis, repair
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近年來,超大型積體電路 (VLSI) 技術的快速發展使得電晶體的數量與記憶體細胞密度顯著增加,這個結果已經嚴重威脅到記憶體陣列的良率與可靠度,使得良率明顯下降。因此故障分散 (Fault Scrambling) 技術被提出,可有效改善良率。故障分散技術是將錯誤細胞分散至不同編碼字中,讓每一個編碼字最多只有一個故障細胞,因此,單錯誤更正雙錯誤偵測碼就可以改正編碼字進而改善修復率。但故障分散技術必須使用分散控制字,分散控制字決定分散之效率,而產生控制字之演算法因複雜度太高,通常以軟體實現,尚無有效之演算法適合於硬體實現。
而本篇提出啟發性 (Heuristic) 分散分析演算法,此方法可容易實現於內建電路,並計算出控制字,而內建分散分析電路在此篇提出並加以實現,內建分散分析電路可容易結合於現代普遍之內建自我修復架構。此外本篇所提出之無結合內建自我修復之內建分散分析架構可節省內建自我修復電路以及記憶體備用元件之硬體成本,並且可達到良好的修復效果。依據本篇所開發模擬器之模擬結果,利用混合型分散技術可達到九成的修復率,並與軟體實現之分散分析比較,所提出電路之修復率下降微小,內建分散分析電路可達到軟體窮盡化分析之結果。而硬體成本之比較,所提出之內建分散分析電路只增加至多不到2% 之硬體成本,因此根據實驗之結果,內建分散分析電路在可忽略的硬體成本之下,亦可得到良好的修復率。


In recent years, very-large-scale integration (VLSI) technology continues to progress very fast. The number of transistors and the density of embedded memories are also increasing rapidly. This result threats the yield and the reliability of embedded memories seriously. Therefore, fault scrambling technique is proposed to improve the yield of embedded memories effectively. Fault scrambling technique is considered a promising way to distribute faulty bits into different codewords such that the number of faulty cells in each codeword is below the protection capability of the EDAC coding techniques. However, the effectiveness of the scrambling technique depends on the determination of the scrambling control words and the algorithm for generating control word is too complex to implement in hardware.
Therefore, we propose a heuristic algorithm suitable for built-in implementation for the evaluation of control words based on the hardware limitation. The corresponding built-in scrambling analysis (BISA) circuit is also proposed. The BISA module can be easily integrated into the conventional built-in self-repair (BISR) module. In addition, we propose a new architecture with BISA to improve yield without BISR and spare elements. It can save the extra hardware overhead of BISR and spare elements and the yield can achieve more than 90%.
According to experimental results, the repair rate is close to software-based exhaustive analysis and the hardware overhead of the BISA is only about 2%. The result shows that the proposed BISA can improve the repair rate significantly with negligible hardware overhead.

誌謝 I 摘要 II Abstract III 目錄 IV 圖目錄 VII 表目錄 X 第一章 簡介 1 1.1 動機及背景 1 1.2 組織架構 6 第二章 隨機存取記憶體內建自我測試、診斷及修復技術基本概念 7 2.1 內建自我測試、診斷及修復技術簡介 7 2.2 錯誤模型 7 2.3 測試演算法 9 2.4 內建自我測試 11 2.5 內建自我診斷 13 2.6 內建自我修復與內建備用分析演算法 13 2.6.1 內建備用分析 14 2.6.2 內建自我修復 16 第三章 故障分散技術基本概念 17 3.1 故障分散技術簡介 17 3.2 記憶體架構 17 3.3 故障分散技術 20 3.3.1 列分散 (Row Scrambling) 技術 21 3.3.2 行分散 (Column Scrambling) 技術 22 3.3.3 混合型分散 (Hybrid Scrambling) 技術 23 3.3.4 附有故障分散技術的記憶體架構 24 3.4 故障分散技術的測試和修復流程 25 第四章 內建分散分析演算法及硬體架構 28 4.1 內建分散分析簡介 28 4.2 內建分散分析演算法 29 4.3 內建分散分析硬體架構 39 4.3.1 基本整體架構 39 4.3.2 故障位址存取模組 (Faulty Address Access Module) 40 4.3.3 禁止控制字產生模組 (Inhibitive Control Word Generation Module) 45 4.3.4 控制字決定模組 (Control Word Decision Module) 48 4.3.5 內建分散分析之控制器 49 4.4 結合內建分散分析與內建自我修復之架構 52 4.4.1 基本整體架構 52 4.4.2 測試、分析及修復更正流程 53 4.5 無結合內建自我修復之內建分散分析架構 55 4.5.1 基本整體架構 55 4.5.2 測試、分析及更正流程 56 第五章 實驗結果 58 5.1 瑕疵分布與瑕疵模型的設定 58 5.2 修復率分析 60 5.3 良率分析 63 5.4 可靠度分析 65 5.5 硬體成本分析 67 5.6 時序分析 78 5.7 超大型積體電路實現 81 第六章 結論與未來展望 84 6.1 結論 84 6.2 未來展望 84 參考文獻 86

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