摘 要

本研究主要是探討錫-銀-銅合金與金基材界面反應。區分為三個不同錫濃度系統：96.5wt％Sn、95.5wt％Sn、95.0wt％Sn，分別與金基材進行固相/固相界面反應，反應溫度為150℃，180℃，200℃，反應時間12~1200小時不等，觀察界面反應生成的介金屬相種類與界面型態。
實驗觀察發現於反應溫度200℃金基材與合金間依序生成AuSn/AuSn2/AuSn4/(AuCu)Sn/(CuxAu1-x)6Sn5等相。當反應溫度為180℃，150℃合金中銅濃度增加會抑制AuSn4、AuSn2等介金屬相的生成，金基材與合金間依序生成AuSn/AuSn2/(AuCu)Sn/(CuxAu1-x)6Sn5等相或AuSn/(AuCu)Sn/(CuxAu1-x)6Sn5等相。
介金屬生成厚度正比於反應時間的平方根，因此反應為擴散控制。而介金屬成長速率隨反應溫度下降與合金中銅濃度增加而減緩。而合金中銅濃度增加(AuCu)Sn/(CuxAu1-x)6Sn5介金屬層厚度較厚，但整體介金屬成長速度趨緩(金基材消耗速度亦減緩)，可能原因為生成(AuCu)Sn/(CuxAu1-x)6Sn5介金屬層產生之障蔽效應導致錫原子擴散速度減緩，並發現合金中銅濃度增加亦減緩反應偶中金原子往銲料端擴散的情形。

ABSTRACT

This study investigated interfacial reactions between Sn-Ag-Cu alloys and Au substrate. It's distinguished three systems that different concentration of Sn. The reaction time is 12 hour to 1200 hour, reacted at 150,180 and 200°C.After reaction，we analyze the species of IMCs and observe morphology of IMCs.
Reacted at 200°C, five phases, AuSn /AuSn2 / AuSn4 / (AuCu)Sn /(CuxAu1-x)6Sn5,are found between Au substrate and Sn-Ag-Cu Alloys. Reacted at 180°C，increase the Cu concentration in alloy will restrain the formation of AuSn4. Four phases, AuSn /AuSn2/(AuCu)Sn/(CuxAu1-x)6Sn5
are found between Au substrate and Sn-Ag-Cu Alloys.Reacted at 150°C, increase the Cu concentration in alloy will restrain the formation of AuSn2. Three phases, AuSn /(AuCu)Sn/(CuxAu1-x)6Sn5 are found between Au substrate and Sn-Ag-Cu Alloys.
The thickness of the reaction layers increases with higher temperatures and longer reaction time, and their growth rates are described by using the parabolic law. Based on the reaction path knowledge and interfacial morphology, it is concluded that Sn is the fastest diffusion species in the couples.The thickness of the reaction layers decrease when the concentration of copper in alloy increase. But the thickness of (AuCu)Sn/(CuxAu1-x)6Sn5 phase increase.. Maybe, it result from barrier effect of (AuCu)Sn/(CuxAu1-x)6Sn5 phase. (AuCu)Sn/(CuxAu1-x)6Sn5 phase also restrain Au diffuse to alloy.

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