熱壓轉印是微奈米轉印技術之一，並可能成為新世代的微奈米結構製造技術。但由於熱壓製程流程包括加熱、加壓與冷卻，造成製程時間過長。熱壓製程還需要突破縮短製程時間才能達到高效能量產的需求。本研究主要以分站式同步進行的概念輔以特殊設計的保壓模具以達成縮短熱壓製程的目的。本實驗將熱壓製程分為三個階段:預熱、轉印、冷卻。每個階段都能同步進行，因此大幅減少加熱至冷卻的時間，以達到整體製程時間的縮短，實驗結果成功有效轉印出微米與奈米結構。此外探討大氣電漿塗佈模具抗沾黏層之測試，當中利用接觸角的變化量測，以不同溫度、重複次數壓印、時效性進行實驗，以建立未來可應用在模具抗沾黏處理的新技術，將可以應用在快速熱壓轉印製程。

Hot embossing is one of the micro/nano imprint techniques and an alternative candidate for the next generation patterning technology. However, the process needs a long cycle from heating, pressing to cooling. It has to be improved in order to become an efficient mass-production method. In this study, we applied a synchronous method with a special designed mold to reduce the cycle time of hot embossing process. In our experiment hot embossing process was split into three parts. Which are heating, imprinting and cooling. These three parts were able to be synchronous and therefore the cycle time of hot embossing was reduced. The synchronous method was successfully to replicate microstructure and nanostructure with high transfer rate. Furthermore, a study of anti-adhesive layer by atmospheric plasma was carried out. Operating parameter, temperature effect, durability and lifetime were evaluated by measuring the variation of contact angle in different experimental conditions. The establishment of a new technology applied on ant-adhesive process of mold. It will be used in fast hot embossing processes.

[1]http://www.kenmos.com.tw/prouduct.htm
[2]http://www.gap-optique.unige.ch/HomeExtras/
[3]蔡宏營, 奈米轉印技術介紹
[4]S.Y.Chou,P.R.Krauss,P.J.Renstrom, “Nanoimprint Lithography”,
Physics Letter,vol.67,No.21,pp.31114-3116,1995
[5]M.L.Williamsr, R.F.Landeal, J.D.Ferry“The Temperature Dependence of
Relaxation Mechanisms in Amorphous Polymers and Other Glass-forming
Liquids”,Temperaturdee Pendencoef Relaxatiomne Chanisms,pp.3701,1955
[6]L.J. Heydermana, H. Schift ,C. David, J. Gobrecht, T. Schweizer “
Flow behaviour of thin polymer films used for hot embossing
lithography”,Microelectronic Engineering,vol.54,No.3,
pp.229–245,2000
[7]A. Lebib, Y. Chen , E. Cambril, P. Youinou, V. Studer, M. Natali,A.
Pe´pin, H.M. Janssen , R.P. Sijbesma“ Room-temperature and
low-pressure nanoimprint lithography”,Microelectronic
Engineering,vol.61 ,pp. 371–377 ,2002
[8]K.Mohamed,M.M.Alkaisi,J.Smaill“Resist deformation at low temperature in
nanoimprint lithography”,Current Applied Physics,vol. 6, No.3,pp.486–
490 ,2006
[9]H.C.Scheer,N.Bogdanski,M.Wissen,S.MÖllenbeck“Imprintability of
polymers for thermal nanoimprint”,Microelectronic Engineering
,vol .85,No.5, pp.890–896 ,2008
[10]T. Leveder , S. Landis , L. Davoust , N. Chaix “Optimization of
demolding temperature for throughput improvement of
nanoimprint lithography”,Microelectronic Engineer,vol.84
,No.9,pp.953–957 ,2007
[11]S.Lan, H.J. Lee, S.H.Lee, J Ni, X. Lai , H.W.Lee , J.H. Song ,M G. Lee
“Experimental and numerical study on the viscoelastic property of
polycarbonate near glass transition temperature for micro thermal
imprint process”,Materials and Design,vol.30, No.9,pp.3879–3884,2009
[12]J.M. Li,C. Liu, J. Peng“Effect of hot embossing process parameters on
polymer flow and microchannel accuracy produced without vacuum”,Journal
of materials processing technology,vol.2 0 7, No.1,pp.163–171,2008
[13]S .Lan, H.J.Lee , E .H.Kim , J. Ni , S.H.Lee , X.Lai , J.H Song ,N. K.
Lee , Moon G. Lee “ A parameter study on the micro hot embossing
process of glassy polymer for pattern replication” ,Microelectronic
Engineering ,Vol.81,No.12,2009
[14]S.Park,H. Schift, C. Padeste , B. Schnyder ,R.Kötz , J. Gobrecht“ Anti-
adhesive layers on nickel stamps for nanoimprint
lithography” ,Microelectronic Engineering,vol.73,No.3, pp.196–201 ,2004
[15]W.B.Young“Analysis of the nanoimprint lithography with a
viscous model”,Microelectronic Engineering,vol.77,No.3
pp.405–411,2005
[16]C.W.Wu, Y.K.Shen,S.Y.Chuang,C.S.Wei “Anti-adhesive effects of diverse
self-assembled monolayers in nanoimprint lithography”, Sensors and
Actuators, vol.139 ,No.1,pp.145–151,2007
[17]T.L.Chang,J.C.Wang“Study of Nanopattern Forming with Chemical Coatings
for Silicon-Based Stamp in Nanoimprint Process”,Proceedings of the 7th
IEEE International Conference on Nanotechnology August 2 - 5, Hong Kong,
2007
[18]W.H. Shin, “Design of thermal imprinting system with uniform residual
thickness”, Microelectronic Engineering,vol.86,No.11,.pp. 2222-2227,2009
[19]T. E .Kimerling, W. Liu,B.H. Kim,D.Yao“Rapid hot embossing of polymer
microfeatures”, Microsystem Technologies,vol.207,No.1,pp.730-735,
2006
[20]S.K.Hong, Y.M.Heo,J.Kang “Replication of Polymeric Micro
Patterns by Rapid Thermal Pressing with Induction Heating
Apparatus ”,Proceedings of the 3rd IEEE Int. Conf. on Nano/Micro
Engineered and Molecular Systems January 6-9,Sanya,China,2008
[21]Materials science and Engineering an introduction William D.
Callister, JR 高立圖書有限公司
[22]高分子流變學基礎 吳鐵鈞 吳德峰 化學工業出版社
[23]高分子材料導論 徐武軍 五南圖書出版社
[24]J.R.Hollahan et al. Eds “Techniques and Applications of Plasma
Chemistry”, Wiley,1974.
[25]P.Fauchais,A.Vardell,“Thermal Plasmas”,IEEE Trans.Plasma
Science Ieee Transaction,vol.25,No5.,pp.1258-1280,Dec,1997
[26]M.Goldman , R.S.Sigmond “Corona and insulation”,IEEE Trans.Elect.
Insulation,vol.17,No.2,pp.90-105,1982
[27]B.Emission,U.Kogelschatz“Modeling and application of ailent
discharge plasma”,IEEE Trans. Plasma Sources Science and
Technology,vol.19 ,No.2,pp. 309-323,Apr.1991
[28]J.Y.Jeong,S.E.Babayan,V.J.Tu,J.Park,I.Henins,R.F.Hicks,G
S.Selwyn ,“ Etching materials with an atmospheric-pressure plasma
jet” ,Plasma Sources Science and technology,vol.7,No.3,
pp.282–285,1998
[29]G.S.Selwyn,H.W.Herrmann,J.Park,I.Henins,“Materials
Processing using an Atmospheric-Pressure Plasma Jet”,Physics
Division Progress Report ,1999–2000
[30]陳敏慧,”平板形大氣電漿束之特性分析”國立清華大學物理系
碩士班物理組 ,2006
[31]http://ssttpro.acesuppliers.com/semiconductor/Magazine_DetailsI
ndex_Id_1281.html
[32]S.E.Babayan,J.Y.Jeong,V.J.Tu,J.Parz,G.S.Selwyn,R.F.Hicks“
Deposition of silicon dioxide films with an atmospheric-pressure
plasma jet”, Plasma Sources Science and Technology,
.Printed in the UK,Vol.7,No.3,pp.286–288,1998
[33]邱士峰“低表面能材料於超疏水表面製備與奈米壓印微影技術
之應用“國立中央大學化學工程與材料工程研究所,2005
[34]http://memo.cgu.edu.tw/hsin-chun/
[35]精密量測 范光照 張郭益 高立圖書有限公司總經銷科技書局
[36]http://zh.wikipedia.org/zh-tw/SEM
[37]http://elearning.stut.edu.tw/caster/3/no6/6-1.htm