錫鉛焊接為電子構裝主要銲接材料，惟鉛具有劇毒，不符於綠色環保，各先進國家無不積極研究無鉛銲料，其中Sn-Zn銲料與傳統Sn-Pb銲料機械性質相近，然易氧化容易腐蝕。In元素是屬於稀有元素，且In具有良好的抗熱潛變特性且有良好潤濕性，添加微量In有助於降低Sn-Zn銲錫熔點但取得較困難，適度添加可改善其缺點，但是過多會使銲料成本大幅增加。
本研究主旨在探討錫鋅合金中添加不同重量百分比之銦In (0.5wt%、1wt%及2%wt)元素，藉由銅金屬基材，相對錫鋅銦合金進行溶解現象、潤濕行為、熱性質、機械性質及介金屬化合物之關係，觀察與分析此一銲錫特性，尋求更佳之銲接性，進一步瞭解Sn-Zn-In銲錫合金之特性。
Sn-9Zn合金中添加微量的銦(0.5wt% - 2wt%)元素，其共晶溫度會因銦含量之增加而遞減，最大潤濕力隨著銦元素之重量百分比添加，潤濕性能相對增加，共晶溫度明顯下降，溫度越高其潤濕力有增加之趨勢；同時銅之溶解率，隨銦含量增加皆有明顯提升，且溶解速率隨著銦增加而增加。在銲錫合金與銅基材界面產生Cu5Zn8及Sn + CuZn兩種介金屬化合物。在150°C，120hr之時效處理後，金屬間化合物快速成長。
在溶解速率方面，雖較Sn-9Zn銲錫合金之溶解速率大，惟均較目前工業用添加其它成分之無鉛銲錫之相對溶解率小仍較俱優越性。經時效後，銲錫合金與銅基材界面產生之介金屬化合物，厚度明顯增加。研究結果顯示，在Sn-9Zn合金中添加微量的銦元素，其潤濕性、熔點及機械性質皆優於傳統Sn-9Zn銲錫合金。

Tin-lead (Sn-Pb) based solder alloy has been very common for electronic soldering. As the green concept has been well adopted by the world, environmental un-friendly material such as lead (Pb) is prohibited in electronic products. Researches for lead-free solders have been conducted. Sn-Zn based solder has very similar mechanical properties comparing to Sn-Pb based one. However Sn-Zn based solder can be oxidized easily. By adding small amount of Indium (In), a rare metal, into Sn-Zn based solder, it would lower the melting point of Sn-Zn based solder.
The main purpose of this investigation is to add three different weight percentages of Indium into Sn-9Zn solder and observe the dissolution、wetting behavior、thermal property、mechanical property and Intermetallic Compound (IMC) of both Cu substrate and Sn-Zn-In solder.
In addition, the study of seeking the best soldering ability and further comprehend Sn-Zn-In solder property was done.
By adding different weight percentage of Indium(0.5wt%、1wt% and 2%wt), the Eutectic temperature was reduced gradually and the wetting force was increased. As the temperature got higher, the wetting force was increased at the same time. Furthermore, the dissolution rate of Cu was clearly increased. When increasing the amount of Indium, the dissolution rate was increased as well. Under 150°C/120hr aging treatment, the IMC of Cu5Zn8 and Sn + CuZn generated between the solder and Cu substrate was growing rapidly and a lot of cavities were found.
By adding different weight percentage of Indium, the dissolution rate was bigger than the dissolution rate of Sn-9Zn solder. However, if it was compared with industrial solders, they still possess superiority on dissolution. Furthermore, the thickness of IMC was increased obvious after the aging. According to the experiments, by adding tiny amount of Indium into Sn-9Zn solder, the wetting ability、melt temperate and mechanical property are all better than traditional Sn-9Zn solder.

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