無電鍍銅在基材上為產業界非常重要的應用，可做為導線和抗電磁波之鍍層。無電鍍銅包含三個步驟：（1）化學蝕刻、（2）敏化和活化、（3）無電鍍銅。化學蝕刻是為了有足夠的粗糙度使觸媒附著於基材表面，敏化和活化部分是使無電鍍銅層成長的關鍵步驟。目前業界常用製程包含：基材先用錫鈀膠敏化後，浸泡速化劑活化觸媒；另一種為將銅、鐵、鉻等金屬加入塑料中，直接將觸媒與基材混和後成型(Laser Direct Structuring, LDS)。本研究中將從觸媒與基材改質層面著手，並與以上兩項常用製程由：（1）觸媒適用範圍、（2）鍍銅層厚度、（3）鍍層附著度、（4）鍍層平整度做比較。本研究分為三部分，一為對天線的無電鍍製程改良，藉由聚乙烯醇（PVA）取代錫離子，得到分散均勻、顆粒細小、表面攜帶負電荷之PVA-Pd墨水。其活性約是原始製程的2倍，約是LDS製程的1.5倍。並達到減少原始製程之5個步驟、三種藥劑與一半的觸媒成本。二為新型聚碳酸酯之表面處理，利用紅光雷射尋找最適和本研究之觸媒粗糙度，其附著度已通過百格測試與膠帶測試。三為玻璃基材之表面處理，利用紫外光（UV）雷射處理後，已得到通過百格測試與膠帶測試之鍍層。

Electroless copper plating is an appropriate process in 3C products, and there is a kind of catalysts that plays the most important role in this process called ‘palladium-tin’ colloid. However, it has some disadvantages:
(I) Sn is poisonous to the environment. (II) When Sn2+ reduces palladium ion into palladium, it will become Sn4+ cover on the palladium as the result, the catalytic activity of material is reduced.
This study is divided into three parts: (I) The synthesis of tin-free palladium catalysts. (II) Increasing the surface roughness of PC substrates that can make copper film strongly adhere on it.(III) Increasing the surface roughness of glass substrates that can make copper film strongly adhere on it.
In the first part, Sn is replaced by PVA, palladium ion is reduced by NaBH4. This study tries to optimize different parameters, and parameters with PVA and 3000 ppm Pd get the best results. PVA with 3000 ppm Pd colloid can help copper ion grow faster than Pd/Sn, and get 24 μm copper film in 2 hours(Pd/Sn can only get 10μm in 2 hours.).
In the second part, red laser is applied to roughen the surface of PC, and the adhesion test of copper film is passed.
In the third part, UV laser is applied to roughen the surface of glass, and the adhesion test of copper film is good.

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