研究生: |
劉羽航 Yu-Hang Liou |
---|---|
論文名稱: |
反光杯光通量之分析與研究 Analysis and Research of Flux Emitted by Reflectors |
指導教授: |
徐勝均
Sheng-Dong Xu |
口試委員: |
阮張榮
Chang-Jung Juan 吳晉賢 Chin-Hsien Wu 謝劍書 Chien-Shu Hsieh |
學位類別: |
碩士 Master |
系所名稱: |
工程學院 - 自動化及控制研究所 Graduate Institute of Automation and Control |
論文出版年: | 2016 |
畢業學年度: | 104 |
語文別: | 中文 |
論文頁數: | 82 |
中文關鍵詞: | 反光杯 、照度圖 、光通量 、坎德拉圖 |
外文關鍵詞: | reflectors, illuminance maps, emitted flux, Candela map |
相關次數: | 點閱:1205 下載:0 |
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本論文利用光學軟體以光軌跡追蹤法,模擬LED光源在反光杯中光線的行經路線,計算出接收面的照度值和光通量效率。
In this thesis, the paths of travel of light inside the reflectors are simulated by using an optical software and the light trajectory tracking method to get the illuminance maps and flux efficiency.
[1]S. Y. Leung, L. Zhong, J. Wei, Z. L. Xu, C. C. A. Yuan, and G. Q. Zhang, “Optical design and characterization of micro-fabricated light reflector for 3D multi-chip LED module,” International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Wroclaw, Poland, Apr. 14-17, 2013, pp. 1-5.
[2]J. Chen, Q. Zhu, Q. Chen, Q. Luo, X. Zhu, and B. Yu, “Reflector design of light emitting diode for uniform illuminance,” Photonics and Optoelectronics, Shanghai, China, May 21-23, 2012, pp. 1-4.
[3]N. T. Tran and F. G. Shi, “LED package design for high optical efficiency and low viewing angle,” 2007 International Microsystems, Packaging, Assembly and Circuits Technology, Taipei, Taiwan, Oct. 1-3, 2007, pp. 10-13.
[4]B. Cao, S. Yu, H. Zheng, and S. Liu, “3D silicon-based packaging for light emitting diodes,” International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Shanghai, China, Aug. 8-11, 2011, pp. 1-4.
[5]蘇永道、吉愛華、趙超、顏怡文,「LED構裝技術」,五南圖書出版股份有限公司,2011。
[6]田民波、呂輝宗、溫坤體,「白光LED照明技術」,五南圖書出版股份有限公司,2011。
[7]郭浩中、賴芳儀、郭守義,「LED原理與應用(3版)」,五南圖書出版股份有限公司,2013。
[8]李農、楊燕,「LED照明手冊(第二版)」,全華圖書,2012。
[9]陳鴻興、陳詩涵,「色彩工程學:理論與應用」,全華圖書,2008。
[10]訊技科技,「TracePro快術學習手冊」,五南圖書出版股份有限公司,2008。
[11]郭浩中、賴芳儀、郭守義,「LED原理與應用(3版)」,五南圖書出版股份有限公司,2013。
[12]「臺灣歐斯朗」, http://www.osram.tw/osram_tw/
[13]周鼎金、江哲銘,「學校教室照明與節能參考手冊」,教育部,2005。
[14]「APIC愛發股份有限公司」, http://www.apic.com.tw/index.php
[15]“TMC,” http://www.tmc.com/
[16]「大作商事」, http://www.daisaku-shoji.co.jp/
[17]“LAMBDA,” http://www.lambdares.com/cn/
[18]“PHILIPS,” http://www.deco.philips.com.tw/
[19]「國家度量衡標準實驗室」, http://www.nml.org.tw/
[20]黃衍介,「近代實驗光學(二版)」,東華出版社,2011。
[21]方長壽,「以Tracepro輔助科學研究的視覺化」,國立交通大學理學院科技與數位學習學程,2012年6月。
[22]C. Tsou, Y.-S. Huang, and C.-W. Lin, “Siliconbased packaging platfonn with embedded solder interconnections for light emitting diode,” in Journal of Physics: Conference Series, vol. 34, 2006, pp. 76-81.
[23]林俊鋒、黃琮暉、陳元鴻,「紅綠藍發光二極體組合混成白光的研究」,遠東學報第二十八卷第三期,pp. 293-307,2011年9月。
[24]黃忠偉、胡能忠,「光學系統模擬設計」,五南圖書出版股份有限公司,2006。
[25]X. He, G. Cao, and N. Zou, “Simulation of white light based on mixed RGB LEDs, ” International Conference on Communication Technology and Application (ICCTA), Beijing, China, Oct. 14-16, 2011, pp. 961-964.
[26]W. K. Jeung, S. H. Shin, S. Y. Hong, S. M. Choi, Y.-G. Suwon, and G.-Do, “Silicon-based, multi-chip LED package,” 2007 Proceedings 57th Electronic Components and Technology Conference, Reno, USA, May 29-Jun. 1, 2007, pp.722-727.
[27]Y. C. Chin, W. G. Chang, S. Y. Chu, and H. L. Wang, “The Average Intensity of Illumination and the Power Optimization,” Asia-Pacific Power and Energy Engineering Conference, Mar. 27-31, 2009, pp. 1-6.
[28]金原傑、朱飛豪,「結合耗能最佳化之實驗室照明設計與實測」,中華民國第三十一屆電力工程研討會,臺南,臺灣,2010年12月3-4日。
[29]古揮廷,「白光LED光源模擬應用與設計」,義守大學電子工程學系,2012年6月。
[30]C. K. Liu, M.-J. Dai, C.-K. Yu, and S.-L. Kuo, “High efficiency silicon-based high power LED package integrated with micro-thermoelectric device,” 2007 International Microsystems, Packaging, Assembly and Circuits Technology, Taipei, Taiwan, Oct. 1-3, 2007, pp. 29-33.
[31]周志遠,「含聚焦片之導光系統的光學性質研究」,國立臺北科技大學電資學院光能與能源產業研發碩士專班,2013年1月。
[32]“ENERGY.GOV,” http://apps1.eere.energy.gov/buildings/publications/pdfs/ss1
/led_energy_efficiency.pdf/
[33]S. Muthu, F. J. P. Schuurmans, and M. D. Pashley “Red, green and blue LEDs for white light illumination,” IEEE Journal of Selected Topics in Quantum Electronics, vol. 8, no. 4, pp. 333-338, 2002.
[34]M. Imoto, S. Usuda, H. Mori, and S. Tsurut, “Development for new power white LED module with multifanctional printed-wiring board,” Electrical Machines and Systems. ICEMS. International Conference, Seoul, Korea, Oct. 8-11, 2007, pp. 1889-1890.
[35]K.-F. Hsu, C.-W. Lin, and J.-M. Hwan, “High efficiency batwing thin-film design for LED flat panel lighting,” 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), Taipei, Taiwan, Oct. 22-24, 2014, pp. 480-483.
[36]C. Tsou, Y. S. Huang, and G. W. Lin, “Silicon-based packaging platform for light emitting diode,” 2005 6th International Conference on Electronic Packaging Technology, Shenzhen, China, Sep. 2, 2005, pp. 1-6.