本研究合成含金剛烷、苯環側基之兩種二胺單體1,4-Bis(4-aminophenoxy)-2-Adamantylbenzene(AP/NH2)及2-(1-Adamantyl)-1,4-bis(4-aminophenoxy)-5-phenylbenzene (2,5-APH/NH2)與三種酸酐：1,4-Phenylene bis(1,3-dioxo-1,3-dihydroisobenzofuran-5-carboxylate) (TAHQ)、3,3',4,4'-Biphenyltetracarboxylic dianhydride (BPDA)、4,4'-Hexafluoroisopropylidene daphthalic dianhydride (6FDA)進行聚縮合反應合成聚醯亞胺(PI)，所合成聚醯胺酸之固有黏度範圍1.56~6.65 dL/g之間，均可塗佈成具有韌性之薄膜；這些MPI薄膜都具有良好的熱穩定性，它們的玻璃轉換溫度(Tg) 在255~313°C之間，於氮氣下5%、10%重量損失溫度分別皆在435°C、463°C以上；這些MPI也具有好的機械性質，它們的抗張強度介於124~216 MPa，斷裂伸長率為 6.1~8.8%；MPI聚合物薄膜之吸水率介於0.06~0.27%之間；這些MPI聚合物也具有低的介電常數(Dk)與損耗因數(Df)，在10 GHz下Dk值介於2.64~3.20之間，而Df值介於0.0064~0.0105之間。

In this study, the diamine monomers 1,4-Bis(4-aminophenoxy)-2-Adamantylbenzene(AP/NH2) containing adamantyl group and 2-(1-Adamantyl)-1,4-bis(4-aminophenoxy)-5-phenylbenzene (2,5-APH/NH2) containing adamantyl and phenyl side groups were synthesized. The polyimides (PIs) were synthesized by condensation polymerization from these two monomer, with three of anhydrides, 1,4-Phenylene bis(1,3-dioxo-1,3-dihydroisobenzofuran-5-carboxylate) (TAHQ), 3,3',4,4'- Biphenyltetracarboxylic dianhydride (BPDA) and 4,4'-Hexafluoroisopropylidene-daphthalic dianhydride (6FDA). The poly(amic-acid)s had inherent viscosities of 1.56~6.65 dL/g, and could form tough and flexible films. The MPIs exhibited high thermal stability with the glass transition temperature (Tg) was in the range of 255~313°C, and 5wt%、10 wt% decomposition temperature were above 435°C and 463°C in nitrogen, respectively. Moreover, the polyimide films exhibited good mechanical properties with tensile strengths between 124~216 MPa and elongation at breaks of 6.1~8.8%. The water uptake of MPIs were between 0.06~0.27%. These MPIs also had low dielectric constant (Dk) and low dissipation factor (Df). The Dk and Df of PIs at 10 GHz were 2.64~3.24 and 0.0064~0.0105, respectively.

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