本研究主要透過聚縮合反應合成聚醯亞胺及聚醯胺，聚醯亞胺本身有相當好的熱穩定性、耐化學藥品性、低介電常數(含氟及脂環之聚醯亞胺)、耐候性、透明性、高機械強度及低熱膨脹係數等優異性質，以薄膜或塗料的型態廣泛地應用在半導體工業、精密機械工業、軟性印刷電路板、液晶顯示器等電子相關產業，做為電子材料是很好的選擇。聚醯胺可以應用在氣體-氣體分離、液體-液體分離以及氣體-液體分離薄膜之上在當今提倡節約能源以及開發新能源之時代，此類的薄膜極具重要性。另外，聚醯胺可與一般纖維及無機填充物製作成強化的聚醯胺複合材料。也可利用與金屬離子的相互作用作為高性能及高強度之聚醯胺。利用與聚醯胺改質之技術，更可做出優異之耐熱、耐候、耐燃、具柔軟性、彈性體及增加尺寸安定性之聚醯胺。
第一章經由氯甲基化的聚醯亞胺與含有羧酸之銅酞菁的酯化反應製備奈米雜化之含酞菁銅（CuPc）側鏈的高介電常數（κ）聚醯亞胺（PI-CuPC），在鋁和ITO電極之間放置厚度為1.2μm的納米雜化PI-CuPC薄膜製做Al / PI-CuPC/ ITO夾心元件，顯示線性電荷位移 - 電場特性（DE），可利用在高效率的電介質儲存能量的應用。本設備具有更高的擊穿強度大於1800的MV/ m時，能量密度為31 J/cm3，和能量損失小於10％。優異的容性能量存儲的PI-酞菁銅納米雜化物的屬性，可以歸因於銅酞菁半導體低聚物的高介電常數和高擊穿強度的聚醯亞胺聚合物的整合。
第二章藉由齊齊巴賓反應(Chichibabin reaction)合成新型具有咔唑的吡啶雜環化合物及透過聚縮合聚合製備一系列含吡啶雜環耐熱性聚醯胺新材料。並探討一系列含功能性基團之高分子材料的物性，如:聚合物之結晶度、溶解度、分子量、分子量分佈、高分子密度、介電常數、機械性質及熱性質等，並特別探討吡啶雜環上的氮原子在酸性環境下形成質子化(Protonation)，對聚合物物性(電致變色、波長位移等)與聚合物構型的影響及電致變色相關物性測試，如：紫外線光譜儀(UV-vis)、光激發光光譜儀(Photoluminescence，PL)及循環伏安儀(CV)

In this study, polyimides and polyamides are synthesized through the polycondensation. Polyimides have a fairly good thermal stability, chemical resistance, weather resistance, transparency, high mechanical strong level and low thermal expansion coefficient number of Merit nature, patterns of thin film or coating materials widely applications in the semiconductor industry, precision machinery industry, soft printed electrical circuit boards, liquid crystal display and other electronic related industry is a good choice for electronic materials. Polyamides can be applied to gas - gas separation, liquid - liquid separation and gas - liquid separation film on top to promote energy conservation and the development of new energy. In addition, the polyamide may be made into a general fiber and inorganic filler reinforced polyamide composite materials. The use of polyamide modified technology, more make excellent heat resistance, weather ability, fire, a soft elastomer and increase the dimensional stability of the polyamide.
In Chapter I, Nanohybrids (PI-CuPC) of polyimide with copper phthalocyanine (CuPC) side chains have been prepared by coupling the high dielectric constant (κ) CuPC oligomer into the PI matrix through chloromethylation and then esterfication with copper phthalocyanine containing carboxylic acids. Al/PI-CuPC/ITO sandwich devices, based on a thin film of PI-CuPC nanohybrid of 1.2 μm in thickness placed between gold and indium-tin oxide (ITO) electrodes, show linear charge displacement-electric field (D-E) characteristics with minimum polarization hysteresis and small remnant polarization, and can be utilized for high efficiency dielectric energy storage applications. The present devices exhibit breakdown strength higher than 1800 MV/m, energy density of 31 J/cm3, and energy loss of less than 10%. The excellent capacitive energy storage properties of the PI-CuPC nanohybrid can be ascribed to the integration of the high dielectric constant of the CuPC semiconductor oligomer and the high breakdown strength of the polyimide polymer matrix.
In Chapter II, novel carbazole pyridine heterocyclic compounds synthesis by Chichibabin reaction and pyridine heterocyclic heat-resistant polyamide synthesis through the polycondensation of a series containing. Their physical properties such as crystallinity, solubility, molecular weight, polydispersity, polymer density, dielectric constant, mechanical properties, thermal properties and electrochromic properties (UV-vis spectroscopy, photoluminescence and cyclic voltammetry) were explained, especially in polymer properties (electrochromic and wavelength shifted) and polymer conformation after protonation.

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