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研究生: 余亮
Yu - Liang
論文名稱: 模糊與TRIZ理論應用在CMP問題與決策系統之研究
The Study of Fuzzy and TRIZ Theory Application to Chemical Mechanical Polishing Problem and Decision System
指導教授: 林原慶
Yuan-Ching Lin
口試委員: 鐘清枝
T.T.Tsung
黃緒哲
Shiuh-Jer Huang
學位類別: 碩士
Master
系所名稱: 工程學院 - 機械工程系
Department of Mechanical Engineering
論文出版年: 2005
畢業學年度: 93
語文別: 中文
論文頁數: 108
中文關鍵詞: 決策系統化學機械研磨矛盾衝突矩陣表模糊
外文關鍵詞: Decision System, TRIZ, Fuzzy, Chemical Mechanical Polishing
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  • 本文主要研究發展一個CMP問題與決策的知識推論系統,用於八吋矽晶圓拋光、層間絕緣層、IC製程平坦化、金屬層和DRAM的拋光製程。系統採用本體論架構建構出相關的知識領域,再轉換成有用的工程資料庫,此資料庫模式係以物件導向知識表示法來表現配置問題的資料,並運用限制條件建構出不同物件與參數間的關係,接著利用推論法則以及模糊理論,以求得製程問題的最後解決方案,並利用TRIZ理論找出惡化項目解決方法,而且可經由XML檔案傳輸機制傳輸資料,系統不僅可獨立運作,更可連接其它系統或工程代理人。
    系統測試結果顯示,針對CMP特定製程問題所推論的最佳化答案與目前解決的方法相當符合。當使用者採用製程參數組合的最佳化答案時,能有效改善製程問題,若配合TRIZ-CMP矛盾衝突矩陣表,即可處理被改善的參數與所對應的相關參數之惡化項目,如此不僅可以徹底解決製程上問題,並且不會因為改變某一製程參數而造成其他製程問題的產生,此外,本系統的問題查詢記錄功能,更可提供CMP製程之創新與研發的正確方向。


    This thesis is to study and develop a questions and answers decision system (Q&A system) for chemical and mechanical polishing (CMP) process. The Q&A system proposed in this work can be applied to 8 inch wafer polishing, interlayer dielectric, IC planarization, top metal and DRAM polishing processes. Ontology concept is used to build up the domain knowledge, and then transform the domain knowledge to useful engineering data-based. Additionally, the construction of data-based based on object-oriented knowledge representation. Some constrain conditions are used to link the relationship between the object and process parameter. Some applicable solutions for the specific question of process are proposed by this system according to the inference rules and fuzzy theory. TRIZ theory is used to compromise the conflict between the relative parameters of process. The solutions proposed by this system can be interchange among the relative systems by XML format. Moreover, this Q&A system not only can operate independently but also link other system or engineering agent.
    The results of system test show that the solution gotten by this system is reasonable compare with the method which used to solve CMP process. As the user to choose optimal solutions proposed by this system, it could improve the process problems quickly and effectively. Moreover TRIZ-CMP contradiction matrix can avoid another problem occurs during polishing process when some parameters of process were adjusted to solve the specific problem.

    目 錄 中文摘要………………………………………………………………Ⅰ 英文摘要………………………………………………………………Ⅱ 誌謝……………………………………………………………………Ⅲ 目錄……………………………………………………………………Ⅳ 表索引…………………………………………………………………Ⅷ 圖索引…………………………………………………………………Ⅹ 第一章 前言…………………………………………………………1 1.1 研究動機………………………………………………2 1.2 研究目的………………………………………………2 第二章 文獻回顧……………………………………………………3 2.1 化學機械研磨…………………………………………3 2.1.1 研磨耗材…………………………………………3 2.1.1.1研磨液………………………………………4 2.1.1.2研磨墊………………………………………5 2.2 TRIZ創研方法…………………………………………6 2.2.1 TRIZ創研方法介紹……………………………6 2.2.2 矛盾衝突矩陣表方法…………………………6 2.2.3 三十九參數……………………………………6 2.2.4 四十法則………………………………………11 2.3 模糊理論簡介…………………………………………16 2.3.1 模糊運算………………………………………17 2.3.2 解模糊之計算…………………………………19 2.3.3 模糊集合………………………………………20 2.3.4 語意變數………………………………………20 2.4 本體論…………………………………………………21 2.4.1 知識本體的介紹………………………………21 2.4.2 知識本體的分類………………………………21 2.5 專家系統………………………………………………22 2.5.1 專家系統簡介…………………………………22 2.5.2 專家系統之基本架構…………………………23 2.5.3 知識表示法……………………………………24 2.5.4 推論機制………………………………………25 第三章 CMP結合模糊推論機制的製程參數之決策法則……………27 3.1 模糊的特性與應用……………………………………27 3.1.1 模糊集合的設定………………………………27 3.1.2 模糊規則的訂定………………………………28 3.1.3 隸屬函數之輸入與輸出的模糊變數…………29 3.1.4 模糊關係………………………………………29 3.1.5 規則結合………………………………………30 3.2 模糊理論應用在系統的功能…………………………34 第四章 CMP結合TRIZ矛盾衝突矩陣表處理製程參數的調整問題…36 4.1 TRIZ創研的作法………………………………………36 4.2 TRIZ與系統結合………………………………………37 4.2.1 TRIZ-CMP矛盾衝突矩陣表……………………37 4.2.2 TRIZ-CMP矛盾衝突矩陣表於系統的功能……39 第五章 CMP問題與決策系統之建構…………………………………40 5.1 系統架構………………………………………………40 5.2 主系統執行流程………………………………………40 5.3 模糊最佳化執行流程…………………………………42 5.4 TRIZ-CMP矛盾衝突矩陣表執行流程…………………42 第六章 案例…………………………………………………………44 6.1 案例說明………………………………………………44 6.2 案例結果與分析………………………………………44 第七章 結論與建議…………………………………………………47 7.1 結論……………………………………………………47 7.2 建議……………………………………………………48 參考文獻………………………………………………………………49 附錄A TRIZ矛盾衝突局陣表…………………………………………88 表 索 引 表2.1 化學機械研磨移除率之比較…………………………………54 表2.2 TRIZ矛盾矩陣表簡表…………………………………………54 表3.1 CMP移除率相關重要參數的權重與輸出答案數…………….55 表3.2 CMP拋光均勻度相關重要參數的權重與輸出答案數……….55 表3.3 CMP過磨相關重要參數的權重與輸出答案數……………….56 表3.4 CMP表面粗糙相關重要參數的權重與輸出答案數………….56 表3.5 CMP移除率隸屬度…………………………………………….57 表3.6 轉速隸屬度……………………………………………………57 表3.7 規則1的模糊關係…………………………………………….58 表3.8 規則2的模糊關係…………………………………………….58 表3.9 規則3的模糊關係…………………………………………….59 表3.10 規則4的模糊關係……………………………………………59 表3.11 規則5的模糊關係……………………………………………60 表3.12 規則1與規則2之最大隸屬度……………………………….60 表3.13移除率其轉速之最大隸屬度…………………………………61 表3.14移除率之理論平均值對應相關製程參數實際值……………62 表3.15均勻度之理論平均值對應相關製程參數實際值……………63 表3.16過磨之理論平均值對應相關製程參數實際值………………64 表3.17表面粗糙之理論平均值對應相關製程參數實際值…………65 表4.1 TRIZ-CMP矛盾衝突矩陣表……………………………………66 表6.1 CMP製程案例設定案例設定………………………………….67 表6.2主系統顯示改善移除率不足之製程參數的提案結果……….67 表6.3 模糊最佳化顯示參數…………………………………………68 圖 索 引 圖2.1專家系統基本架構…………………………………………….69 圖3.1 輸入與輸出的模糊變數………………………………………70 圖3.2 移除率隸屬函數………………………………………………70 圖3.3 轉速隸屬函數…………………………………………………71 圖4.1 TRIZ的創研程序………………………………………………72 圖4.2 TRIZ解題架構…………………………………………………73 圖4.3 CMP製程參數魚骨圖………………………………………….74 圖5.1 系統架構流程圖………………………………………………75 圖5.2 前向鏈結推論…………………………………………………76 圖5.3 CMP知識本體論架構………………………………………….77 圖5.4運作流程圖…………………………………………………….78 圖5.5 使用者界面……………………………………………………79 圖5.6 匯入XML檔…………………………………………………….79 圖5.7 選擇欲解決問題選項…………………………………………80 圖5.8 選擇其它選項…………………………………………………80 圖5.9 異常現象選項…………………………………………………81 圖5.10 選擇異常現象選項………………………………………….81 圖5.11 考慮重新設計的機構元件………………………………….82 圖5.12 選擇機構元件或耗材……………………………………….82 圖5.13 特定問題選項……………………………………………….83 圖5.14 改善參數…………………………………………………….83 圖5.15 建議改善參數……………………………………………….84 圖5.16模糊最佳化界面………………………………………………84 圖5.17模糊最佳化排序………………………………………………85 圖5.18 TRIZ-CMP矛盾衝突矩陣表界面…………………………….85 圖5.19 顯示主系統的初步參數答案……………………………….86 圖5.20 選擇欲改善參數…………………………………………….86 圖5.21 顯示相同解決方法的頻率次數…………………………….87

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