對填充型的導電複合材料而言，其中的填充物無疑是決定導電性的要角；以目前的半導體封裝產業來說，銀粉仍然被廣泛使用於導電複合材料中，乃是基於銀的優良導電性及化學安定性，但銀粉價格昂貴，所以本研究中尋求降低成本且兼顧優良導電性之方法。
本研究中先探討單一銀粉粒子添加量對導電複合材料的導電度影響，再比較多種不同粒徑大小銀粉混合時的複合影響效應及環境試驗的結果，茲將本研究結果摘要如下：
1.單一銀粉粒子添加量在混合物總量50wt﹪以上才是屬於導電物質。
2.銀粉粒子的particle size越小且Specific surface area越大者易有優良的導電度，在不同粒徑大小混合時仍有提升整體導電度的作用。
3.而針對降低成本的需求，降低高單價銀粉填充量，以碳黑及銀粉同時填充複合材料，少量銀粉的添加對整體導電度就有極顯著的提升作用，且導電性不易受環境試驗的影響。
4.由於導電複合材料的使用上多需要考量黏著性，故進行百格膠帶試驗法來評估其對基材的附著性。
5.銀粉粒子比重大易沉降，藉由SEM（掃描式電子顯微鏡）可觀察銀粉在樹脂基材中的分散狀況。

關鍵字：銀粉、碳黑、導電度

Speaking of the filled conductive compound materials, in which filler is the strong character decided its conductivity. By the present semiconductor seal industry, the silver powder was still widely used in the conductive compound materials, is based on the fine conductivity and the chemical stability of silver, but the price of silver powder is expensive, therefore in this research seeks to reduce the cost, and gives dual attention to the method of the fine conductivity.
This research discusses the conductivity influence for the content of sole silver flake powder first to the conductive compound materials, again time quite many kinds of different particle size silver flake powder mix compound influence effect and environmental testing result, the findings abstract will be as follows:
1.The content of sole silver flake powder in mixture to total quantity is 50wt ％ above ,belongs to the conductive material.
2.The silver flake particle size is smaller and specific surface area is bigger have fine conductivity, when different particle size mixed still has the promotion of whole mixture conductivity.
3.In view of the cost down, reduce the filled quantity of high price silver flake powder, simultaneously filled the compound materials by carbon black and silver flake powder, the few filled quantity of silver flake powder is extremely promoted the compound materials conductivity , and the conductivity is not easily affected by environmental testing.
4.Because of the application of conductive compound materials needs to consider the adhesiveness, therefore carries on cross-cut tape testing standard method to appraise it to the parent substrate adhesiveness.
5.Because of silver density is moe heavy leads to precipitation, may observe the dispersion condition of the silver flake powder particle in resin by SEM.

Keyword：silver flake, carbon black , conductivity

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