LED取代傳統照明燈具的走勢漸趨明顯，也因此LED的功率逐漸增加，伴隨而來的是如何在有限面積內將極高的熱通量有效的排出系統，否則將會造成LED模組發光效率降低甚至損壞。本研究所模擬的原始封裝LED路燈模組，設定放置於室外無風環境，以傳導及自然對流的方式進行散熱，並以計算流體力學軟體模擬其流場，分別對不同的發熱功率、環境溫度以及水平放置角度進行分析，並將結果與使用相同散熱模組的COB(chip on board)封裝LED模組做一比較。
由模擬結果中發現，原始封裝LED路燈模組中，發熱功率與環境溫度、LED接面溫度成正比增加關係，而燈座放置的水平角度，則與接面溫度成一反比關係，放置角度加大可以改善燈座的散熱效果。COB封裝LED模組的模擬結果顯示，可藉由減少傳導介質以減少熱阻，來改善路燈模組的散熱效率。

It is an obviously gradual tendency that LED lamps replace the traditional lighting lamps and lanterns. As the power of LED also increases gradually, the extremely high heat flux in a limited area will cause the decay of LED module’s efficiency or even damage to the LED module, if it’s unable to dissipate the heat flux out of the system efficiently. In this study, the thermal dissipation patterns of two different LED street lamp designs were compared and simulated. The first design uses discrete pre-packaged LEDs of 1 W which are soldered onto an aluminum metal-cored printed circuit board (MCPCB). The second design uses chip-on-board (COB) LEDs, in which the LED chips are packed directly onto a copper MCPCB. The street lamps of these two designs are exposed to the same simulation conditions, assuming in a natural convection environment. The variations of LED power output, ambient temperature, and the tilt angle of street lamp structure are compared.
The simulation result indicates the LED p-n junction temperature increases with the increases in LED power output and ambient temperature, but decreases with the increase in the tilt angle of street lamp structure. The second design where COB packaging LED modules are used exhibits lower p-n junction temperatures, as less interfacial thermal resistance was encountered in heat dissipation.

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